JP5554718B2 - ナノ粒子を含む金属系複合コーティングの電解デポジット - Google Patents
ナノ粒子を含む金属系複合コーティングの電解デポジット Download PDFInfo
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- JP5554718B2 JP5554718B2 JP2010538121A JP2010538121A JP5554718B2 JP 5554718 B2 JP5554718 B2 JP 5554718B2 JP 2010538121 A JP2010538121 A JP 2010538121A JP 2010538121 A JP2010538121 A JP 2010538121A JP 5554718 B2 JP5554718 B2 JP 5554718B2
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- YGAXLGGEEQLLKV-UHFFFAOYSA-L disodium;4-dodecoxy-4-oxo-2-sulfonatobutanoate Chemical compound [Na+].[Na+].CCCCCCCCCCCCOC(=O)CC(C([O-])=O)S([O-])(=O)=O YGAXLGGEEQLLKV-UHFFFAOYSA-L 0.000 description 1
- KHIQYZGEUSTKSB-UHFFFAOYSA-L disodium;4-dodecoxy-4-oxo-3-sulfobutanoate Chemical compound [Na+].[Na+].CCCCCCCCCCCCOC(=O)C(S(O)(=O)=O)CC([O-])=O.CCCCCCCCCCCCOC(=O)C(S(O)(=O)=O)CC([O-])=O KHIQYZGEUSTKSB-UHFFFAOYSA-L 0.000 description 1
- YRIUSKIDOIARQF-UHFFFAOYSA-N dodecyl benzenesulfonate Chemical compound CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 YRIUSKIDOIARQF-UHFFFAOYSA-N 0.000 description 1
- TVACALAUIQMRDF-UHFFFAOYSA-N dodecyl dihydrogen phosphate Chemical compound CCCCCCCCCCCCOP(O)(O)=O TVACALAUIQMRDF-UHFFFAOYSA-N 0.000 description 1
- QVBODZPPYSSMEL-UHFFFAOYSA-N dodecyl sulfate;2-hydroxyethylazanium Chemical compound NCCO.CCCCCCCCCCCCOS(O)(=O)=O QVBODZPPYSSMEL-UHFFFAOYSA-N 0.000 description 1
- JZKFHQMONDVVNF-UHFFFAOYSA-N dodecyl sulfate;tris(2-hydroxyethyl)azanium Chemical compound OCCN(CCO)CCO.CCCCCCCCCCCCOS(O)(=O)=O JZKFHQMONDVVNF-UHFFFAOYSA-N 0.000 description 1
- DDXLVDQZPFLQMZ-UHFFFAOYSA-M dodecyl(trimethyl)azanium;chloride Chemical compound [Cl-].CCCCCCCCCCCC[N+](C)(C)C DDXLVDQZPFLQMZ-UHFFFAOYSA-M 0.000 description 1
- 229940071161 dodecylbenzenesulfonate Drugs 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- LRMHFDNWKCSEQU-UHFFFAOYSA-N ethoxyethane;phenol Chemical compound CCOCC.OC1=CC=CC=C1 LRMHFDNWKCSEQU-UHFFFAOYSA-N 0.000 description 1
- 125000005313 fatty acid group Chemical group 0.000 description 1
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical group FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- RBNPOMFGQQGHHO-UHFFFAOYSA-N glyceric acid Chemical compound OCC(O)C(O)=O RBNPOMFGQQGHHO-UHFFFAOYSA-N 0.000 description 1
- 150000002314 glycerols Chemical class 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 230000005661 hydrophobic surface Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000003446 ligand Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000004005 microsphere Substances 0.000 description 1
- VLAPMBHFAWRUQP-UHFFFAOYSA-L molybdic acid Chemical compound O[Mo](O)(=O)=O VLAPMBHFAWRUQP-UHFFFAOYSA-L 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- ITFGZZGYXVHOOU-UHFFFAOYSA-N n,n-dimethylmethanamine;methyl hydrogen sulfate Chemical compound C[NH+](C)C.COS([O-])(=O)=O ITFGZZGYXVHOOU-UHFFFAOYSA-N 0.000 description 1
- HESSGHHCXGBPAJ-UHFFFAOYSA-N n-[3,5,6-trihydroxy-1-oxo-4-[3,4,5-trihydroxy-6-(hydroxymethyl)oxan-2-yl]oxyhexan-2-yl]acetamide Chemical compound CC(=O)NC(C=O)C(O)C(C(O)CO)OC1OC(CO)C(O)C(O)C1O HESSGHHCXGBPAJ-UHFFFAOYSA-N 0.000 description 1
- BOUCRWJEKAGKKG-UHFFFAOYSA-N n-[3-(diethylaminomethyl)-4-hydroxyphenyl]acetamide Chemical compound CCN(CC)CC1=CC(NC(C)=O)=CC=C1O BOUCRWJEKAGKKG-UHFFFAOYSA-N 0.000 description 1
- 229920004919 nonoxynol-6 Polymers 0.000 description 1
- 229920002113 octoxynol Polymers 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 239000003002 pH adjusting agent Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 125000005496 phosphonium group Chemical group 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- IYDGMDWEHDFVQI-UHFFFAOYSA-N phosphoric acid;trioxotungsten Chemical compound O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.OP(O)(O)=O IYDGMDWEHDFVQI-UHFFFAOYSA-N 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- ONQDVAFWWYYXHM-UHFFFAOYSA-M potassium lauryl sulfate Chemical compound [K+].CCCCCCCCCCCCOS([O-])(=O)=O ONQDVAFWWYYXHM-UHFFFAOYSA-M 0.000 description 1
- 229940116985 potassium lauryl sulfate Drugs 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-O pyridinium Chemical compound C1=CC=[NH+]C=C1 JUJWROOIHBZHMG-UHFFFAOYSA-O 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- YSZJKUDBYALHQE-UHFFFAOYSA-N rhenium trioxide Chemical compound O=[Re](=O)=O YSZJKUDBYALHQE-UHFFFAOYSA-N 0.000 description 1
- CGFYHILWFSGVJS-UHFFFAOYSA-N silicic acid;trioxotungsten Chemical compound O[Si](O)(O)O.O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1.O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1.O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1.O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 CGFYHILWFSGVJS-UHFFFAOYSA-N 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229940079776 sodium cocoyl isethionate Drugs 0.000 description 1
- 235000019333 sodium laurylsulphate Nutrition 0.000 description 1
- 229940067741 sodium octyl sulfate Drugs 0.000 description 1
- 229940048842 sodium xylenesulfonate Drugs 0.000 description 1
- ZZMDMGNQUXYKQX-UHFFFAOYSA-L sodium;1-nonyl-2-(2-nonylphenoxy)benzene;sulfate Chemical compound [Na+].[O-]S([O-])(=O)=O.CCCCCCCCCC1=CC=CC=C1OC1=CC=CC=C1CCCCCCCCC ZZMDMGNQUXYKQX-UHFFFAOYSA-L 0.000 description 1
- OHESZEZYDPDAIH-UHFFFAOYSA-M sodium;2-(4-nonylphenoxy)ethyl sulfate Chemical compound [Na+].CCCCCCCCCC1=CC=C(OCCOS([O-])(=O)=O)C=C1 OHESZEZYDPDAIH-UHFFFAOYSA-M 0.000 description 1
- DGSDBJMBHCQYGN-UHFFFAOYSA-M sodium;2-ethylhexyl sulfate Chemical compound [Na+].CCCCC(CC)COS([O-])(=O)=O DGSDBJMBHCQYGN-UHFFFAOYSA-M 0.000 description 1
- QUCDWLYKDRVKMI-UHFFFAOYSA-M sodium;3,4-dimethylbenzenesulfonate Chemical compound [Na+].CC1=CC=C(S([O-])(=O)=O)C=C1C QUCDWLYKDRVKMI-UHFFFAOYSA-M 0.000 description 1
- KVCGISUBCHHTDD-UHFFFAOYSA-M sodium;4-methylbenzenesulfonate Chemical compound [Na+].CC1=CC=C(S([O-])(=O)=O)C=C1 KVCGISUBCHHTDD-UHFFFAOYSA-M 0.000 description 1
- WFRKJMRGXGWHBM-UHFFFAOYSA-M sodium;octyl sulfate Chemical compound [Na+].CCCCCCCCOS([O-])(=O)=O WFRKJMRGXGWHBM-UHFFFAOYSA-M 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- SFVFIFLLYFPGHH-UHFFFAOYSA-M stearalkonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCC[N+](C)(C)CC1=CC=CC=C1 SFVFIFLLYFPGHH-UHFFFAOYSA-M 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium group Chemical group [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- UZZYXUGECOQHPU-UHFFFAOYSA-N sulfuric acid monooctyl ester Natural products CCCCCCCCOS(O)(=O)=O UZZYXUGECOQHPU-UHFFFAOYSA-N 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Substances [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 1
- HADKRTWCOYPCPH-UHFFFAOYSA-M trimethylphenylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C1=CC=CC=C1 HADKRTWCOYPCPH-UHFFFAOYSA-M 0.000 description 1
- PBYZMCDFOULPGH-UHFFFAOYSA-N tungstate Chemical compound [O-][W]([O-])(=O)=O PBYZMCDFOULPGH-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
- C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
Description
ナノ粒子を含むパラジウム系複合コーティングのデポジットのために、電解めっき溶液はパラジウムイオン源を含む。ナノ粒子を含むパラジウム系複合コーティングは種々の応用分野における用途を有する。例えば、耐腐食性が非常に重要なコネクタ及びリードフレーム等の電子部品用、めがね等の修飾応用分野用、及び筆記用具用コーティングとして、並びに表面張力の低下も重要なインクジェット等の機能品用コーティングとして。
20℃〜60℃(例えば、25℃〜35℃)の範囲のめっき温度
1amp/dm2〜100amp/dm2の範囲の電流密度
0.05μm/min〜50μm/minの範囲のめっき速度
パラジウム系複合コーティングは、約4重量%〜約10重量%、より典型的には約4.5重量%〜約8.5重量%の範囲のナノ粒子含量を含んでいてもよい。好ましくは、ナノ粒子はめっきされたデポジット全体にわたって充分に均一に分布する。
ナノ粒子を含む亜鉛系複合コーティングのデポジットのために、電解めっき浴はZnイオン源を含む。ナノ粒子を含む亜鉛系複合コーティングは種々の応用分野での用途を有する。例えば、亜鉛及び亜鉛合金を自動車部品用の腐食コーティングとしてめっきしてもよい。
ナノ粒子を含むスズ系複合コーティングのデポジットのために、電解めっき浴はSnイオン源を含む。ナノ粒子を含むスズ系複合コーティングは種々の応用分野での用途を有する。例えば、スズ及びスズ合金をはんだとして、又はリードフレーム及びコネクタ上のコーティングとして用いてもよい。
ナノ粒子を含むニッケル系複合コーティングのデポジットのために、電解めっき浴はNiイオン源を含む。ナノ粒子を含むニッケル系複合コーティングは種々の応用分野での用途を有する。例えば、ニッケル及びニッケル合金は銅リードフレーム等の銅基材上の保護用コーティングとして用いてもよい。
ナノ粒子を含む銀系複合コーティングのデポジットのために、電解めっき浴はAgイオン源を含む。ナノ粒子を含む銀系複合コーティングは種々の応用分野での用途を有する。例えば、銀及び銀合金は銅基材上の保護用コーティングとして用いてもよい。
ナノ粒子を含む金系複合コーティングのデポジットのために、電解めっき浴はAuイオン源を含む。ナノ粒子を含む金系複合コーティングは種々の応用分野での用途を有する。例えば、金及び金合金は宝飾品での装飾コーティングとして、及びエレクトロニクス産業での電気接点仕上げ(硬質金を含む)として用いてもよい。
ナノ粒子を含むプラチナ系複合コーティングのデポジットのために、電解めっき浴はPtイオン源を含む。ナノ粒子を含むプラチナ系複合コーティングは種々の応用分野での用途を有する。例えば、プラチナ及びプラチナ合金はめっき宝飾品では広範囲にわたって用いられる。電気業界では、プラチナ製の保護フィルムは電気回路での伝導経路として、及び電気接点を有するデバイスの接触面として用いられる。
ナノ粒子を含むロジウム系複合コーティングのデポジットのために、電解めっき浴はRhイオン源を含む。ナノ粒子を含むロジウム系複合コーティングは種々の応用分野での用途を有する。例えば、ロジウム及びロジウム合金はめっき宝飾品で広範囲にわたって用いられる。さらに、ロジウムめっきは電気接点に用いられる。
2つ又はそれ以上の上述した金属を含む種々の金属系複合コーティングは、ナノ粒子と共デポジットしてもよい。一の実施態様では、金属系複合コーティングはナノ粒子と共デポジットした銀及びスズを含む。一の実施態様では、金属系複合コーティングはナノ粒子と共デポジットした金及びスズを含む。
純スズコーティングに比べて増大した耐腐食性は、一つには、本発明の金属系複合コーティングのコーティング/大気/水の界面での界面接触角の増加によって測定することができる。非常に疎水性で、このように耐腐食性の表面は、約70°を超える接触角によって特徴づけられる。例えば、純パラジウムデポジットの接触角は、約38°〜約44°の範囲であり、比較的非疎水性のコーティングであることを示す。約0.3μm(300nm)〜約0.5μm(500nm)の範囲の平均粒径を有するフルオロポリマーからなるナノ粒子を約0.01重量%〜約2.6重量%の範囲で含むパラジウム系複合コーティングは、約40°〜約120°の範囲のより高い界面接触角を有し、比較的より高い疎水性を示した。高疎水性のコーティングは、約0.05μm(50nm)〜約0.1μm(100nm)の範囲の平均粒径を有するフルオロポリマーからなるナノ粒子を約4.5重量%〜約8.5重量%の範囲で含むパラジウム系複合コーティングを含み、約80°〜約130°の範囲のかなり高い界面接触角を有していた。
デポジットのための3つの浴 A)パラジウム、B)フルオロポリマーからなる比較的大きなナノ粒子を含むパラジウム系複合物、及びC)本発明のフルオロポリマーからなるナノ粒子を含むパラジウム系複合物を調製した。
Claims (10)
- 基材の表面を、
(a)亜鉛、パラジウム、銀、ニッケル、銅、金、プラチナ、ロジウム、ルテニウム、クロム及びこれらの合金からなる群より選ばれるデポジット金属のデポジット金属イオン源、及び
(b)10〜150ナノメーターの平均粒径を有し、少なくとも30容量%の粒子が100nmより小さい粒径を有すること(以下「所定の粒径分布」と言う)を特徴とし、フルオロポリマーのナノ粒子が、その表面に界面活性剤分子の予混合コーティングを有し、 界面活性剤分子あたり+0.1から+1の平均電荷を有するフルオロポリマー粒子の予混合分散体で、前記電解めっき溶液中に前記金属イオン源以外の金属イオン源を含まず、前記平均粒径、前記所定の粒径分布および前記平均電荷を有するフルオロポリマーのナノ粒子以外の、前記電解めっき溶液に不溶性のフルオロポリマー粒子を含まないもの、
を含む電解めっき溶液と接触させる工程、並びに
外界の電子源を前記電解めっき溶液に適用して、それによって前記フルオロポリマーのナノ粒子を含む金属系複合コーティングを表面上に電解デポジットする工程
を含むことを特徴とする基材の表面上に耐腐食性を与える方法。 - 前記電解めっき組成物が、電解めっき組成物の1〜10重量%の濃度のフルオロポリマーのナノ粒子を含むことを特徴とする請求項1に記載の方法。
- 前記フルオロポリマーのナノ粒子が、200nm未満の粒径を有する少なくとも80容量%の粒子の粒度分布を有すること特徴とするフルオロポリマー粒子からなる請求項1または2に記載の方法。
- 前記複合コーティングがデポジット金属および、1重量%〜5重量%のフルオロポリマーのナノ粒子からなる請求項1〜3の何れかに記載の方法。
- 前記デポジット金属がパラジウムからなる請求項1〜4の何れかに記載の方法。
- 前記デポジット金属が亜鉛からなる請求項1〜4の何れかに記載の方法。
- 前記デポジット金属が銀からなる請求項1〜4の何れかに記載の方法。
- 前記デポジット金属がニッケルからなる請求項1〜4の何れかに記載の方法。
- 前記フルオロポリマーのナノ粒子が、50〜100nmの平均粒子径を有するフルオロポリマーのナノ粒子である請求項1〜8の何れかに記載の方法。
- コネクタおよびその他の電子部品、自動車部品、金属化プラスチック、並びに射出成形金型で用いられる付着防止部品から選ばれる基材で、前記基材は請求項1〜9の何れかの方法によって塗布された金属系複合コーティングを有する。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US1280907P | 2007-12-11 | 2007-12-11 | |
US61/012,809 | 2007-12-11 | ||
PCT/US2008/086210 WO2009076430A1 (en) | 2007-12-11 | 2008-12-10 | Electrolytic deposition of metal-based composite coatings comprising nano-particles |
Publications (3)
Publication Number | Publication Date |
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JP2011518944A JP2011518944A (ja) | 2011-06-30 |
JP2011518944A5 JP2011518944A5 (ja) | 2012-02-09 |
JP5554718B2 true JP5554718B2 (ja) | 2014-07-23 |
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JP2010538121A Active JP5554718B2 (ja) | 2007-12-11 | 2008-12-10 | ナノ粒子を含む金属系複合コーティングの電解デポジット |
Country Status (8)
Country | Link |
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US (1) | US9217205B2 (ja) |
EP (1) | EP2242873B1 (ja) |
JP (1) | JP5554718B2 (ja) |
CN (1) | CN101946029B (ja) |
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ES2694027T3 (es) | 2018-12-17 |
CN101946029B (zh) | 2012-12-19 |
EP2242873A1 (en) | 2010-10-27 |
TR201816579T4 (tr) | 2018-11-21 |
CN101946029A (zh) | 2011-01-12 |
EP2242873A4 (en) | 2015-11-18 |
JP2011518944A (ja) | 2011-06-30 |
WO2009076430A1 (en) | 2009-06-18 |
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