JP2011517367A - 基材上に導電体をパターン化する方法 - Google Patents

基材上に導電体をパターン化する方法 Download PDF

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Publication number
JP2011517367A
JP2011517367A JP2010548862A JP2010548862A JP2011517367A JP 2011517367 A JP2011517367 A JP 2011517367A JP 2010548862 A JP2010548862 A JP 2010548862A JP 2010548862 A JP2010548862 A JP 2010548862A JP 2011517367 A JP2011517367 A JP 2011517367A
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stamp
surface shape
pattern
raised surface
raised
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JP2011517367A5 (enExample
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ツ，リジュン
エイチ． フレイ，マシュー
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3M Innovative Properties Co
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3M Innovative Properties Co
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/50—Recording sheets characterised by the coating used to improve ink, dye or pigment receptivity, e.g. for ink-jet or thermal dye transfer recording
    • B41M5/52—Macromolecular coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/30—Acidic compositions for etching other metallic material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0537—Transfer of pre-fabricated insulating pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Nanotechnology (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Human Computer Interaction (AREA)
  • Mathematical Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Printing Methods (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
JP2010548862A 2008-02-28 2009-02-26 基材上に導電体をパターン化する方法 Withdrawn JP2011517367A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US3227308P 2008-02-28 2008-02-28
US61/032,273 2008-02-28
PCT/US2009/035271 WO2009108771A2 (en) 2008-02-28 2009-02-26 Methods of patterning a conductor on a substrate

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014036362A Division JP2014131071A (ja) 2008-02-28 2014-02-27 基材上に導電体をパターン化する方法

Publications (2)

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JP2011517367A true JP2011517367A (ja) 2011-06-02
JP2011517367A5 JP2011517367A5 (enExample) 2012-04-12

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JP2010548862A Withdrawn JP2011517367A (ja) 2008-02-28 2009-02-26 基材上に導電体をパターン化する方法
JP2014036362A Pending JP2014131071A (ja) 2008-02-28 2014-02-27 基材上に導電体をパターン化する方法
JP2016084407A Active JP6321716B2 (ja) 2008-02-28 2016-04-20 基材上に導電体をパターン化する方法

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JP2014036362A Pending JP2014131071A (ja) 2008-02-28 2014-02-27 基材上に導電体をパターン化する方法
JP2016084407A Active JP6321716B2 (ja) 2008-02-28 2016-04-20 基材上に導電体をパターン化する方法

Country Status (6)

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US (4) US8425792B2 (enExample)
EP (1) EP2257969B1 (enExample)
JP (3) JP2011517367A (enExample)
CN (1) CN102017071B (enExample)
TW (1) TWI440094B (enExample)
WO (1) WO2009108771A2 (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013030378A (ja) * 2011-07-29 2013-02-07 Mitsubishi Paper Mills Ltd 光透過性導電材料
JP2014526100A (ja) * 2011-09-27 2014-10-02 エルジー・ケム・リミテッド 伝導性パターンを含む伝導性基板およびそれを含むタッチパネル｛ｃｏｎｄｕｃｔｉｎｇｓｕｂｓｔｒａｔｅｃｏｍｐｒｉｓｉｎｇｃｏｎｄｕｃｔｉｎｇｐａｔｔｅｒｎａｎｄｔｏｕｃｈｐａｎｅｌｃｏｍｐｒｉｓｉｎｇｔｈｅｓａｍｅ｝
KR20150103713A (ko) * 2012-12-31 2015-09-11 쓰리엠 이노베이티브 프로퍼티즈 캄파니 롤-투-롤 공정에서 미세접촉 인쇄를 위한 재-잉킹 롤러
KR20150103695A (ko) * 2012-12-31 2015-09-11 쓰리엠 이노베이티브 프로퍼티즈 캄파니 롤-투-롤 공정에서 고 릴리이프 스탬프를 사용하는 미세접촉 인쇄
JP2016507801A (ja) * 2012-12-07 2016-03-10 スリーエム イノベイティブ プロパティズ カンパニー 導電性物品
WO2016084277A1 (ja) * 2014-11-27 2016-06-02 凸版印刷株式会社 微細線印刷物及びその製造方法
JP2016535433A (ja) * 2013-09-30 2016-11-10 スリーエム イノベイティブ プロパティズ カンパニー パターン化されたナノワイヤ透明導電体上の印刷された導電性パターンのための保護用コーティイグ

Families Citing this family (83)

* Cited by examiner, † Cited by third party
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JP2840609B2 (ja) 1989-11-08 1998-12-24 日本パイオニクス株式会社 シート状発熱体
JP2011517367A (ja) 2008-02-28 2011-06-02 スリーエム イノベイティブ プロパティズ カンパニー 基材上に導電体をパターン化する方法
KR101432353B1 (ko) * 2008-08-01 2014-08-20 쓰리엠 이노베이티브 프로퍼티즈 컴파니 복합 전극을 갖는 터치 감응 장치
US8858813B2 (en) * 2008-12-11 2014-10-14 3M Innovative Properties Company Patterning process
WO2010099132A2 (en) 2009-02-26 2010-09-02 3M Innovative Properties Company Touch screen sensor and patterned substrate having overlaid micropatterns with low visibility
US10180746B1 (en) 2009-02-26 2019-01-15 Amazon Technologies, Inc. Hardware enabled interpolating sensor and display
US9740341B1 (en) 2009-02-26 2017-08-22 Amazon Technologies, Inc. Capacitive sensing with interpolating force-sensitive resistor array
WO2010151471A1 (en) 2009-06-25 2010-12-29 3M Innovative Properties Company Methods of wet etching a self-assembled monolayer patterned substrate and metal patterned articles
JP5747027B2 (ja) 2009-06-30 2015-07-08 スリーエム イノベイティブ プロパティズ カンパニー 図形を有する電子ディスプレイ及び金属微小パターン化基材
US9244562B1 (en) 2009-07-31 2016-01-26 Amazon Technologies, Inc. Gestures and touches on force-sensitive input devices
US9785272B1 (en) 2009-07-31 2017-10-10 Amazon Technologies, Inc. Touch distinction
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US9632628B2 (en) * 2009-10-23 2017-04-25 Atmel Corporation Interdigitated touchscreen electrodes
US8599150B2 (en) 2009-10-29 2013-12-03 Atmel Corporation Touchscreen electrode configuration
TWI407340B (zh) * 2009-12-22 2013-09-01 Au Optronics Corp 觸控顯示面板
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US8941395B2 (en) 2010-04-27 2015-01-27 3M Innovative Properties Company Integrated passive circuit elements for sensing devices
US8947892B1 (en) 2010-08-16 2015-02-03 The Boeing Company Electronic device protection
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TWI426435B (zh) * 2010-09-14 2014-02-11 Sentelic Corp Capacitive touch panel and its manufacturing method
WO2012039764A1 (en) * 2010-09-20 2012-03-29 Vanderbilt University Nanoscale porous gold film sers template
US10620754B2 (en) * 2010-11-22 2020-04-14 3M Innovative Properties Company Touch-sensitive device with electrodes having location pattern included therein
US20120125882A1 (en) * 2010-11-22 2012-05-24 3M Innovtive Properties Company Method of making touch-sensitive device with electrodes having location pattern included therein
CN103262342B (zh) 2010-12-16 2016-08-10 3M创新有限公司 透明性微图案化rfid天线以及装配透明性微图案化rfid天线的制品
GB2505292B (en) * 2011-01-28 2015-06-10 Novalia Ltd Printed article
US8933906B2 (en) * 2011-02-02 2015-01-13 3M Innovative Properties Company Patterned substrates with non-linear conductor traces
WO2012106417A2 (en) 2011-02-02 2012-08-09 3M Innovative Properties Company Patterned substrates with darkened conductor traces
KR101593560B1 (ko) * 2011-03-30 2016-02-15 후지필름 가부시키가이샤 프린트 배선기판 및 그 제조방법, 그리고 금속 표면 처리액
WO2012145157A1 (en) 2011-04-15 2012-10-26 3M Innovative Properties Company Transparent electrode for electronic displays
US9030425B2 (en) * 2011-04-19 2015-05-12 Sony Computer Entertainment Inc. Detection of interaction with virtual object from finger color change
JP5839541B2 (ja) * 2011-05-13 2016-01-06 富士フイルム株式会社 導電シート及びタッチパネル
EP2787512A4 (en) * 2011-11-29 2015-11-11 Toray Industries LADDER STACK BODY AND SHAPED DISPLAY BODY
KR101926539B1 (ko) * 2011-12-13 2018-12-10 엘지이노텍 주식회사 나노와이어 격자구조물 및 나노와이어 제조방법
WO2013089085A1 (ja) * 2011-12-16 2013-06-20 富士フイルム株式会社 導電シート及びタッチパネル
KR20140109965A (ko) 2011-12-21 2014-09-16 쓰리엠 이노베이티브 프로퍼티즈 컴파니 은 나노와이어-기반 투명 전기 전도성 코팅의 레이저 패턴화
JP2013149232A (ja) * 2011-12-22 2013-08-01 Fujifilm Corp 導電シート及びタッチパネル
WO2013119308A1 (en) 2012-02-10 2013-08-15 3M Innovative Properties Company Mesh patterns for touch sensor electrodes
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CN102722279A (zh) * 2012-05-09 2012-10-10 崔铮 金属网格导电层及其具备该导电层的触摸面板
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KR20140001504A (ko) * 2012-06-27 2014-01-07 엘지이노텍 주식회사 터치 패널의 전극 기판 및 그 제조 방법
TWI607542B (zh) 2012-11-22 2017-12-01 Ｌｇ伊諾特股份有限公司 觸控視窗
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WO2014088950A1 (en) 2012-12-07 2014-06-12 3M Innovative Properties Company Method of making transparent conductors on a substrate
US9889504B2 (en) 2012-12-11 2018-02-13 Vanderbilt University Porous nanomaterials having three-dimensional patterning
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