TWI440094B - 基板上圖案化導體之方法 - Google Patents

基板上圖案化導體之方法 Download PDF

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Publication number
TWI440094B
TWI440094B TW098106538A TW98106538A TWI440094B TW I440094 B TWI440094 B TW I440094B TW 098106538 A TW098106538 A TW 098106538A TW 98106538 A TW98106538 A TW 98106538A TW I440094 B TWI440094 B TW I440094B
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TW
Taiwan
Prior art keywords
raised
stamp
pattern
features
linear
Prior art date
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TW098106538A
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English (en)
Chinese (zh)
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TW200945445A (en
Inventor
Lijun Zu
Matthew Henry Frey
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3M Innovative Properties Co
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Publication of TW200945445A publication Critical patent/TW200945445A/zh
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Publication of TWI440094B publication Critical patent/TWI440094B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/50—Recording sheets characterised by the coating used to improve ink, dye or pigment receptivity, e.g. for ink-jet or thermal dye transfer recording
    • B41M5/52—Macromolecular coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/30—Acidic compositions for etching other metallic material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0537—Transfer of pre-fabricated insulating pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Nanotechnology (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Human Computer Interaction (AREA)
  • Mathematical Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Printing Methods (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
TW098106538A 2008-02-28 2009-02-27 基板上圖案化導體之方法 TWI440094B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US3227308P 2008-02-28 2008-02-28

Publications (2)

Publication Number Publication Date
TW200945445A TW200945445A (en) 2009-11-01
TWI440094B true TWI440094B (zh) 2014-06-01

Family

ID=41012369

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098106538A TWI440094B (zh) 2008-02-28 2009-02-27 基板上圖案化導體之方法

Country Status (6)

Country Link
US (4) US8425792B2 (enExample)
EP (1) EP2257969B1 (enExample)
JP (3) JP2011517367A (enExample)
CN (1) CN102017071B (enExample)
TW (1) TWI440094B (enExample)
WO (1) WO2009108771A2 (enExample)

Families Citing this family (90)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2840609B2 (ja) 1989-11-08 1998-12-24 日本パイオニクス株式会社 シート状発熱体
EP2257969B1 (en) * 2008-02-28 2017-12-20 3M Innovative Properties Company Methods of patterning a conductor on a substrate
EP2327006A4 (en) 2008-08-01 2012-12-26 3M Innovative Properties Co METHODS OF MANUFACTURING COMPOSITE ELECTRODES
WO2010068531A1 (en) * 2008-12-11 2010-06-17 3M Innovative Properties Company Amide-linked perfluoropolyether thiol compounds and processes for their preparation and use
US10180746B1 (en) 2009-02-26 2019-01-15 Amazon Technologies, Inc. Hardware enabled interpolating sensor and display
EP2401669B1 (en) 2009-02-26 2016-04-06 3M Innovative Properties Company Touch screen sensor and patterned substrate having overlaid micropatterns with low visibility
US9740341B1 (en) 2009-02-26 2017-08-22 Amazon Technologies, Inc. Capacitive sensing with interpolating force-sensitive resistor array
CN102803562B (zh) 2009-06-25 2015-09-30 3M创新有限公司 湿式蚀刻自组装单层图案化基材和金属图案化制品的方法
US8553400B2 (en) 2009-06-30 2013-10-08 3M Innovative Properties Company Electronic displays and metal micropatterned substrates having a graphic
US9244562B1 (en) 2009-07-31 2016-01-26 Amazon Technologies, Inc. Gestures and touches on force-sensitive input devices
US9785272B1 (en) 2009-07-31 2017-10-10 Amazon Technologies, Inc. Touch distinction
WO2011033907A1 (ja) * 2009-09-15 2011-03-24 シャープ株式会社 タッチパネルおよびこれを備えた表示装置
US9632628B2 (en) * 2009-10-23 2017-04-25 Atmel Corporation Interdigitated touchscreen electrodes
US8599150B2 (en) * 2009-10-29 2013-12-03 Atmel Corporation Touchscreen electrode configuration
TWI407340B (zh) * 2009-12-22 2013-09-01 Au Optronics Corp 觸控顯示面板
TWI526912B (zh) * 2010-03-16 2016-03-21 元太科技工業股份有限公司 電磁式觸控顯示器
US8941395B2 (en) 2010-04-27 2015-01-27 3M Innovative Properties Company Integrated passive circuit elements for sensing devices
US8325495B2 (en) * 2010-08-16 2012-12-04 The Boeing Company Electronic device protection
US8947892B1 (en) 2010-08-16 2015-02-03 The Boeing Company Electronic device protection
TWI426435B (zh) * 2010-09-14 2014-02-11 Sentelic Corp Capacitive touch panel and its manufacturing method
EP2619532A1 (en) * 2010-09-20 2013-07-31 Vanderbilt University Nanoscale porous gold film sers template
US20120125882A1 (en) * 2010-11-22 2012-05-24 3M Innovtive Properties Company Method of making touch-sensitive device with electrodes having location pattern included therein
US10620754B2 (en) * 2010-11-22 2020-04-14 3M Innovative Properties Company Touch-sensitive device with electrodes having location pattern included therein
CN103262342B (zh) 2010-12-16 2016-08-10 3M创新有限公司 透明性微图案化rfid天线以及装配透明性微图案化rfid天线的制品
GB2505291B (en) 2011-01-28 2015-08-12 Novalia Ltd Printed article
TWI583276B (zh) 2011-02-02 2017-05-11 ３Ｍ新設資產公司 具暗化導體跡線之圖案化基材
US8933906B2 (en) 2011-02-02 2015-01-13 3M Innovative Properties Company Patterned substrates with non-linear conductor traces
JP5683516B2 (ja) * 2011-03-30 2015-03-11 富士フイルム株式会社 プリント配線基板およびその製造方法、並びに、金属表面処理液
KR101927562B1 (ko) 2011-04-15 2018-12-10 쓰리엠 이노베이티브 프로퍼티즈 컴파니 전자 디스플레이를 위한 투명 전극
US9030425B2 (en) * 2011-04-19 2015-05-12 Sony Computer Entertainment Inc. Detection of interaction with virtual object from finger color change
JP5839541B2 (ja) * 2011-05-13 2016-01-06 富士フイルム株式会社 導電シート及びタッチパネル
JP5809475B2 (ja) * 2011-07-29 2015-11-11 三菱製紙株式会社 光透過性導電材料
WO2013048136A2 (ko) * 2011-09-27 2013-04-04 주식회사 엘지화학 전도성 패턴을 포함하는 전도성 기판 및 이를 포함하는 터치 패널
JP5273325B1 (ja) * 2011-11-29 2013-08-28 東レ株式会社 導電積層体およびそれを用いてなる表示体
KR101926539B1 (ko) * 2011-12-13 2018-12-10 엘지이노텍 주식회사 나노와이어 격자구조물 및 나노와이어 제조방법
EP2781996B1 (en) * 2011-12-16 2019-12-04 Fujifilm Corporation Conductive sheet and touch panel
WO2013095971A1 (en) 2011-12-21 2013-06-27 3M Innovative Properties Company Laser patterning of silver nanowire - based transparent electrically conducting coatings
JP2013149232A (ja) * 2011-12-22 2013-08-01 Fujifilm Corp 導電シート及びタッチパネル
WO2013119308A1 (en) 2012-02-10 2013-08-15 3M Innovative Properties Company Mesh patterns for touch sensor electrodes
US9302452B2 (en) 2012-03-02 2016-04-05 Ppg Industries Ohio, Inc. Transparent laminates comprising inkjet printed conductive lines and methods of forming the same
CN102722279A (zh) * 2012-05-09 2012-10-10 崔铮 金属网格导电层及其具备该导电层的触摸面板
US20130319275A1 (en) * 2012-05-30 2013-12-05 Elsie A. Fohrenkamm Method for providing a printed pattern
KR20140001504A (ko) 2012-06-27 2014-01-07 엘지이노텍 주식회사 터치 패널의 전극 기판 및 그 제조 방법
US9560738B2 (en) 2012-11-22 2017-01-31 Lg Innotek Co., Ltd. Touch window
US9164607B2 (en) 2012-11-30 2015-10-20 3M Innovative Properties Company Complementary touch panel electrodes
CN104838449B (zh) 2012-12-07 2018-06-15 3M创新有限公司 导电制品
BR112015013033A2 (pt) 2012-12-07 2017-07-11 3M Innovative Properties Co método de fabricação de condutores transparentes sobre substrato
US9889504B2 (en) 2012-12-11 2018-02-13 Vanderbilt University Porous nanomaterials having three-dimensional patterning
BR112015015856A2 (pt) * 2012-12-31 2017-07-11 3M Innovative Properties Co cilindro de reaplicação de tinta para impressão por microcontato em um processo rolo a rolo
EP2938501B1 (en) * 2012-12-31 2019-03-27 3M Innovative Properties Company Microcontact printing with high relief stamps in a roll-to-roll process
US20140218637A1 (en) * 2013-02-06 2014-08-07 Nanchang O-Film Tech. Co., Ltd. Conductive film, manufacturing method thereof, and touch screen including the conducting film
FR3008809B1 (fr) 2013-07-18 2017-07-07 Fogale Nanotech Dispositif accessoire garde pour un appareil electronique et/ou informatique, et appareil equipe d'un tel dispositif accessoire
SG11201601614YA (en) * 2013-09-10 2016-04-28 Univ Nanyang Tech Electrochromic device
US9304617B2 (en) 2013-09-19 2016-04-05 Atmel Corporation Mesh design for touch sensors
EP3053012B1 (en) * 2013-09-30 2019-10-23 3M Innovative Properties Company Protective coating for printed conductive pattern on patterned nanowire transparent conductors
EP3065951B1 (en) * 2013-11-06 2019-07-31 3M Innovative Properties Company Microcontact printing stamps with functional features
KR101725075B1 (ko) * 2013-11-11 2017-04-11 주식회사 아모센스 터치 스크린 패널용 터치 센서와 그 제조방법
FR3013472B1 (fr) 2013-11-19 2016-07-08 Fogale Nanotech Dispositif accessoire couvrant pour un appareil portable electronique et/ou informatique, et appareil equipe d'un tel dispositif accessoire
KR101682773B1 (ko) * 2013-12-13 2016-12-05 주식회사 엘지화학 터치 센서 및 이의 제조방법
DE102013226475A1 (de) * 2013-12-18 2015-06-18 Robert Bosch Gmbh Berührungs-Sensorelement zur Detektion kritischer Situationen einer Batteriezelle
US20150212609A1 (en) * 2014-01-28 2015-07-30 Apple Inc. Light block for transparent touch sensors
US9454252B2 (en) 2014-02-14 2016-09-27 Atmel Corporation Touch-sensor mesh design for display with complex-shaped sub-pixels
US20150234219A1 (en) * 2014-02-19 2015-08-20 Uni-Pixel Displays, Inc. Method of passivating a conductive pattern with self-assembling monolayers
WO2015126372A1 (en) * 2014-02-19 2015-08-27 Uni-Pixel Displays, Inc. Method of passivating a conductive pattern with self-assembling monolayers
US9280246B2 (en) 2014-04-08 2016-03-08 Atmel Corporation Line spacing in mesh designs for touch sensors
CN103984436A (zh) * 2014-04-10 2014-08-13 业成光电（深圳）有限公司 高边缘触控性能的触控面板
WO2015174133A1 (ja) * 2014-05-16 2015-11-19 富士フイルム株式会社 タッチパネル及びその製造方法
GB2541336B (en) * 2014-06-03 2017-07-05 Peter Binstead Ronald Method and apparatus for forming a wire structure
US20150352828A1 (en) * 2014-06-09 2015-12-10 Gregory L. Zwadlo Reducing print line width on flexo plates
US10054482B2 (en) * 2014-09-22 2018-08-21 Antonio Maccari Tool for positioning a scanning device
JP7233163B2 (ja) * 2014-09-30 2023-03-06 スリーエム イノベイティブ プロパティズ カンパニー 広い線幅を有する導電性パターン及びその製造方法
US9285942B1 (en) 2014-10-27 2016-03-15 Atmel Corporation Optical-band visibility for touch-sensor mesh designs
JP6739895B2 (ja) * 2014-11-27 2020-08-12 凸版印刷株式会社 微細線印刷物
JP6508333B2 (ja) * 2015-05-14 2019-05-08 株式会社村田製作所 電子回路モジュール
CN107850834A (zh) * 2015-07-03 2018-03-27 加拿大国家研究委员会 基于金属纳米粒子光子烧结的自对准金属图案化
CA2990278C (en) 2015-07-03 2024-02-13 National Research Council Of Canada Method of printing ultranarrow-gap lines
JP2018529218A (ja) 2015-07-03 2018-10-04 ナショナル リサーチ カウンシル オブ カナダ 極細配線を印刷する方法
US9986669B2 (en) * 2015-11-25 2018-05-29 Ppg Industries Ohio, Inc. Transparency including conductive mesh including a closed shape having at least one curved side
CN106449707B (zh) * 2016-10-31 2020-02-07 上海天马微电子有限公司 一种有机发光显示面板及其制造方法
CN108062187A (zh) * 2016-11-07 2018-05-22 京东方科技集团股份有限公司 触控结构及其制作方法和触控装置
CN110069152A (zh) * 2018-01-24 2019-07-30 祥达光学（厦门）有限公司 触控面板与触控传感器卷带
US10721815B2 (en) 2018-07-06 2020-07-21 Raytheon Company Method of making patterned conductive microstructures within a heat shrinkable substrate
CN108803937B (zh) * 2018-07-06 2021-08-17 京东方科技集团股份有限公司 一种触控结构及其制备方法、触控装置、触控显示装置
US11404589B2 (en) * 2018-08-21 2022-08-02 Eastman Kodak Company Open electrodes for in-plane field generation
US11745702B2 (en) 2018-12-11 2023-09-05 Ppg Industries Ohio, Inc. Coating including electrically conductive lines directly on electrically conductive layer
KR102786212B1 (ko) 2019-05-06 2025-03-24 쓰리엠 이노베이티브 프로퍼티즈 컴파니 전기 전도성 요소를 포함하는 패턴화된 물품
CN111949153B (zh) * 2019-11-29 2022-07-26 合肥微晶材料科技有限公司 一种可解决蚀刻痕的纳米银线触控电极及其制作方法
CN111176078B (zh) * 2020-02-20 2022-06-14 上海华力集成电路制造有限公司 一种修正光学平坦度探测结果的方法
CN111832687B (zh) * 2020-06-23 2022-09-20 厦门大学 一种rfid标签及其制备方法
KR102461794B1 (ko) * 2020-08-13 2022-11-02 한국과학기술연구원 은 나노와이어 메쉬 전극 및 이의 제조방법

Family Cites Families (92)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4087625A (en) * 1976-12-29 1978-05-02 International Business Machines Corporation Capacitive two dimensional tablet with single conductive layer
US5126007A (en) * 1990-11-16 1992-06-30 At&T Bell Laboratories Method for etching a pattern in layer of gold
US5113041A (en) 1990-12-28 1992-05-12 At&T Bell Laboratories Information processing
US5492611A (en) * 1991-03-20 1996-02-20 Fujitsu Limited Miniaturized oxygen electrode
JPH0769767B2 (ja) * 1991-10-16 1995-07-31 インターナショナル・ビジネス・マシーンズ・コーポレイション フィンガ・タッチまたはスタイラスの位置を検出するためのタッチ・オーバーレイ、および検出システム
US5512131A (en) * 1993-10-04 1996-04-30 President And Fellows Of Harvard College Formation of microstamped patterns on surfaces and derivative articles
GB9406702D0 (en) * 1994-04-05 1994-05-25 Binstead Ronald P Multiple input proximity detector and touchpad system
GB9422911D0 (en) * 1994-11-14 1995-01-04 Moonstone Technology Ltd Capacitive touch detectors
JPH09292511A (ja) * 1996-04-24 1997-11-11 Sumitomo Chem Co Ltd カラーフィルター及びその製造方法
JP3490304B2 (ja) 1997-10-17 2004-01-26 シャープ株式会社 無線通信装置
US7663607B2 (en) 2004-05-06 2010-02-16 Apple Inc. Multipoint touchscreen
JP2000081510A (ja) 1998-09-04 2000-03-21 Toyobo Co Ltd 赤外線吸収フィルタ
DE69831860T2 (de) * 1998-07-04 2006-07-20 Au Optronics Corp. Elektrode zur verwendung in elektrooptischen bauelementen
US6188391B1 (en) 1998-07-09 2001-02-13 Synaptics, Inc. Two-layer capacitive touchpad and method of making same
US6549193B1 (en) * 1998-10-09 2003-04-15 3M Innovative Properties Company Touch panel with improved linear response and minimal border width electrode pattern
US6933991B2 (en) 1999-01-22 2005-08-23 White Electronic Designs Corp. Super bright low reflectance liquid crystal display
DE60044482D1 (de) * 1999-03-05 2010-07-15 Canon Kk Bilderzeugungsvorrichtung
US6297811B1 (en) * 1999-06-02 2001-10-02 Elo Touchsystems, Inc. Projective capacitive touchscreen
US6212769B1 (en) * 1999-06-29 2001-04-10 International Business Machines Corporation Process for manufacturing a printed wiring board
KR20030043783A (ko) 2000-02-02 2003-06-02 쓰리엠 터치 시스템, 인크. 편광자를 갖는 터치 스크린 및 그의 제조 방법
US6380101B1 (en) * 2000-04-18 2002-04-30 International Business Machines Corporation Method of forming patterned indium zinc oxide and indium tin oxide films via microcontact printing and uses thereof
US6652981B2 (en) * 2000-05-12 2003-11-25 3M Innovative Properties Company Etching process for making electrodes
JP2002014772A (ja) 2000-06-30 2002-01-18 Minolta Co Ltd タッチパネル、表示パネル及び表示装置
US6771327B2 (en) 2000-09-18 2004-08-03 Citizen Watch Co., Ltd. Liquid crystal display device with an input panel
WO2002033461A2 (en) * 2000-10-16 2002-04-25 Ozin Geoffrey A Method of self-assembly and optical applications of crystalline colloidal patterns on substrates
US7041232B2 (en) * 2001-03-26 2006-05-09 International Business Machines Corporation Selective etching of substrates with control of the etch profile
US6798464B2 (en) * 2001-05-11 2004-09-28 International Business Machines Corporation Liquid crystal display
JP3808037B2 (ja) * 2001-05-15 2006-08-09 インターナショナル・ビジネス・マシーンズ・コーポレーション 基板上の金属の無電界堆積およびパターニングのための方法
US7338613B2 (en) * 2001-09-10 2008-03-04 Surface Logix, Inc. System and process for automated microcontact printing
TWI268441B (en) 2001-10-29 2006-12-11 Beauty Up Co Ltd Digital touch display system can be manufactured by off-the-shelf manufacturing tools and the size of panel can be enlarged according to actual demand
JP2005521238A (ja) * 2001-12-06 2005-07-14 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ ソース及びドレイン並びにそれらの間のギャップを規定するための方法
JP3953412B2 (ja) * 2001-12-11 2007-08-08 インターナショナル・ビジネス・マシーンズ・コーポレーション ポジ型マイクロコンタクト印刷を使用して物品の表面にパターンを形成する方法
US6972155B2 (en) * 2002-01-18 2005-12-06 North Carolina State University Gradient fabrication to direct transport on a surface
AU2003216481A1 (en) * 2002-03-01 2003-09-16 Planar Systems, Inc. Reflection resistant touch screens
US7463246B2 (en) * 2002-06-25 2008-12-09 Synaptics Incorporated Capacitive sensing device
US7019734B2 (en) 2002-07-17 2006-03-28 3M Innovative Properties Company Resistive touch sensor having microstructured conductive layer
AU2003254831A1 (en) * 2002-08-08 2004-02-25 Dai Nippon Printing Co., Ltd. Electromagnetic wave-shielding sheet
US7202859B1 (en) * 2002-08-09 2007-04-10 Synaptics, Inc. Capacitive sensing pattern
US7583326B2 (en) 2002-08-20 2009-09-01 Samsung Electronics Co., Ltd. Light guide plate and liquid crystal display having the same
US7180508B2 (en) * 2002-09-17 2007-02-20 Tyco Electronics Corporation Dynamic corrections for a non-linear touchscreen
EP1583715A2 (en) * 2002-12-06 2005-10-12 Eikos, Inc. Optically transparent nanostructured electrical conductors
JP2004192093A (ja) 2002-12-09 2004-07-08 Micro Gijutsu Kenkyusho:Kk 透明タッチパネル及びその製造方法
GB0229236D0 (en) 2002-12-12 2003-01-22 Koninkl Philips Electronics Nv AMLCD with integrated touch input
US7129935B2 (en) * 2003-06-02 2006-10-31 Synaptics Incorporated Sensor patterns for a capacitive sensing apparatus
US20070128905A1 (en) * 2003-06-12 2007-06-07 Stuart Speakman Transparent conducting structures and methods of production thereof
US7265686B2 (en) * 2003-07-15 2007-09-04 Tyco Electronics Corporation Touch sensor with non-uniform resistive band
GB0319714D0 (en) * 2003-08-21 2003-09-24 Philipp Harald Anisotropic touch screen element
JP2005084475A (ja) 2003-09-10 2005-03-31 Dainippon Printing Co Ltd 光学フィルタおよびこれを用いたディスプレイ
GB0323902D0 (en) * 2003-10-11 2003-11-12 Koninkl Philips Electronics Nv Method for patterning a substrate surface
US8068186B2 (en) 2003-10-15 2011-11-29 3M Innovative Properties Company Patterned conductor touch screen having improved optics
GB0326904D0 (en) * 2003-11-19 2003-12-24 Koninkl Philips Electronics Nv Formation of self-assembled monolayers
US8435603B2 (en) * 2003-12-05 2013-05-07 Conductive Inkjet Technology Limited Formation of solid layers on substrates
US7339579B2 (en) * 2003-12-15 2008-03-04 3M Innovative Properties Company Wiring harness and touch sensor incorporating same
US7307624B2 (en) * 2003-12-30 2007-12-11 3M Innovative Properties Company Touch sensor with linearized response
US7658860B2 (en) 2004-01-15 2010-02-09 Panasonic Corporation Metal pattern and process for producing the same
KR100590727B1 (ko) * 2004-02-24 2006-06-19 한국기계연구원 임프린트된 나노구조물을 이용한 미세접촉 인쇄기법과이의 나노 구조물
KR100586659B1 (ko) * 2004-04-01 2006-06-07 주식회사 디피아이 솔루션스 유기 전극 코팅용 조성물 및 이를 이용한 고투명성 유기전극의 제조방법
US7382139B2 (en) 2004-06-03 2008-06-03 Synaptics Incorporated One layer capacitive sensing apparatus having varying width sensing elements
JP4463013B2 (ja) 2004-06-09 2010-05-12 日本写真印刷株式会社 狭額縁タッチパネル用の回路形成装置及びこれを用いた回路形成方法
US20060007171A1 (en) 2004-06-24 2006-01-12 Burdi Roger D EMI resistant balanced touch sensor and method
US7294405B2 (en) 2004-08-26 2007-11-13 3M Innovative Properties Company Antiglare coating and articles
GB0424005D0 (en) * 2004-10-29 2004-12-01 Eastman Kodak Co Method of coating
AU2005317037A1 (en) * 2004-11-05 2006-06-22 Mattel, Inc. Multi-user touch-responsive entertainment device
US7196281B2 (en) * 2004-11-12 2007-03-27 Eastman Kodak Company Resistive touch screen having conductive mesh
JP4055019B2 (ja) 2005-05-26 2008-03-05 グンゼ株式会社 透明面状体及び透明タッチスイッチ
JP4610416B2 (ja) * 2005-06-10 2011-01-12 日本写真印刷株式会社 静電容量型タッチパネル
EP1746488A2 (en) * 2005-07-21 2007-01-24 TPO Displays Corp. Electromagnetic digitizer sensor array structure
JP4873410B2 (ja) 2005-07-21 2012-02-08 奇美電子股▲ふん▼有限公司 電磁デジタイザセンサアレイ構造
JP2007042887A (ja) * 2005-08-03 2007-02-15 Bridgestone Corp 光透過性電磁波シールド性窓材及びその製造方法
US7410825B2 (en) * 2005-09-15 2008-08-12 Eastman Kodak Company Metal and electronically conductive polymer transfer
US7864160B2 (en) * 2005-10-05 2011-01-04 3M Innovative Properties Company Interleaved electrodes for touch sensing
DE112007000148T5 (de) * 2006-01-12 2008-11-20 3M Innovative Properties Co., St. Paul Licht kollimierender Film
KR101163789B1 (ko) 2006-02-07 2012-07-09 삼성전자주식회사 투명전극 및 그의 제조방법
US8264466B2 (en) 2006-03-31 2012-09-11 3M Innovative Properties Company Touch screen having reduced visibility transparent conductor pattern
US20090165296A1 (en) * 2006-04-04 2009-07-02 Yoash Carmi Patterns of conductive objects on a substrate and method of producing thereof
TWI322374B (en) 2006-04-14 2010-03-21 Ritdisplay Corp Light transmission touch panel and manufacturing method thereof
US8552989B2 (en) * 2006-06-09 2013-10-08 Apple Inc. Integrated display and touch screen
US7796123B1 (en) * 2006-06-20 2010-09-14 Eastman Kodak Company Touchscreen with carbon nanotube conductive layers
US20120046887A1 (en) 2006-07-31 2012-02-23 Xiaoping Jiang Two-pin coupling slider
KR100797092B1 (ko) * 2006-07-31 2008-01-22 한국기계연구원 미세 접촉 인쇄를 이용한 유기박막 구동소자의 제조방법
US20080095988A1 (en) * 2006-10-18 2008-04-24 3M Innovative Properties Company Methods of patterning a deposit metal on a polymeric substrate
US8764996B2 (en) * 2006-10-18 2014-07-01 3M Innovative Properties Company Methods of patterning a material on polymeric substrates
US7968804B2 (en) * 2006-12-20 2011-06-28 3M Innovative Properties Company Methods of patterning a deposit metal on a substrate
US7920129B2 (en) * 2007-01-03 2011-04-05 Apple Inc. Double-sided touch-sensitive panel with shield and drive combined layer
TW200901014A (en) * 2007-06-28 2009-01-01 Sense Pad Tech Co Ltd Touch panel device
EP2222755B1 (en) * 2007-12-07 2016-10-05 Agfa-Gevaert N.V. Layer configuration with improved stability to sunlight exposure
US20090163256A1 (en) 2007-12-21 2009-06-25 Motorola, Inc. Translucent single layer touch screen devices having vertically oriented pattern traces
US8310454B2 (en) 2007-12-21 2012-11-13 Motorola Mobility Llc Translucent touch screens including invisible electronic component connections
US8358276B2 (en) 2007-12-21 2013-01-22 Apple Inc. Touch pad electrode design
US20090174675A1 (en) 2008-01-09 2009-07-09 Dave Gillespie Locating multiple objects on a capacitive touch pad
EP2257969B1 (en) * 2008-02-28 2017-12-20 3M Innovative Properties Company Methods of patterning a conductor on a substrate
US8599150B2 (en) * 2009-10-29 2013-12-03 Atmel Corporation Touchscreen electrode configuration

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