JP2011513957A5 - - Google Patents
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- JP2011513957A5 JP2011513957A5 JP2010547951A JP2010547951A JP2011513957A5 JP 2011513957 A5 JP2011513957 A5 JP 2011513957A5 JP 2010547951 A JP2010547951 A JP 2010547951A JP 2010547951 A JP2010547951 A JP 2010547951A JP 2011513957 A5 JP2011513957 A5 JP 2011513957A5
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- 239000004065 semiconductor Substances 0.000 claims 25
- 230000005693 optoelectronics Effects 0.000 claims 12
- 230000005670 electromagnetic radiation Effects 0.000 claims 7
- 238000000034 method Methods 0.000 claims 3
- 239000002019 doping agent Substances 0.000 claims 2
- 239000011810 insulating material Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000000151 deposition Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008011848A DE102008011848A1 (de) | 2008-02-29 | 2008-02-29 | Optoelektronischer Halbleiterkörper und Verfahren zur Herstellung eines solchen |
| DE102008011848.6 | 2008-02-29 | ||
| DE102008016525A DE102008016525A1 (de) | 2008-03-31 | 2008-03-31 | Optoelektronischer Halbleiterkörper und Verfahren zur Herstellung eines solchen |
| DE102008016525.5 | 2008-03-31 | ||
| PCT/DE2009/000267 WO2009106063A1 (de) | 2008-02-29 | 2009-02-25 | Monolithischer, optoelektronischer halbleiterkörper und verfahren zur herstellung eines solchen |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011513957A JP2011513957A (ja) | 2011-04-28 |
| JP2011513957A5 true JP2011513957A5 (enExample) | 2012-01-05 |
| JP5992662B2 JP5992662B2 (ja) | 2016-09-14 |
Family
ID=40802134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010547951A Active JP5992662B2 (ja) | 2008-02-29 | 2009-02-25 | モノリシックなオプトエレクトロニクス半導体ボディおよびその製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8643034B2 (enExample) |
| EP (1) | EP2245667B1 (enExample) |
| JP (1) | JP5992662B2 (enExample) |
| KR (1) | KR101571577B1 (enExample) |
| CN (1) | CN101960601B (enExample) |
| TW (1) | TWI400822B (enExample) |
| WO (1) | WO2009106063A1 (enExample) |
Families Citing this family (63)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008011848A1 (de) | 2008-02-29 | 2009-09-03 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterkörper und Verfahren zur Herstellung eines solchen |
| WO2009106063A1 (de) | 2008-02-29 | 2009-09-03 | Osram Opto Semiconductors Gmbh | Monolithischer, optoelektronischer halbleiterkörper und verfahren zur herstellung eines solchen |
| KR100986570B1 (ko) * | 2009-08-31 | 2010-10-07 | 엘지이노텍 주식회사 | 반도체 발광소자 및 그 제조방법 |
| DE102009060747B4 (de) | 2009-12-30 | 2025-01-09 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterchip |
| KR101106151B1 (ko) * | 2009-12-31 | 2012-01-20 | 서울옵토디바이스주식회사 | 발광 소자 및 그것을 제조하는 방법 |
| KR100986560B1 (ko) * | 2010-02-11 | 2010-10-07 | 엘지이노텍 주식회사 | 발광소자 및 그 제조방법 |
| US8604498B2 (en) * | 2010-03-26 | 2013-12-10 | Tsmc Solid State Lighting Ltd. | Single phosphor layer photonic device for generating white light or color lights |
| DE102010013494A1 (de) | 2010-03-31 | 2011-10-06 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip |
| KR101115570B1 (ko) | 2010-06-14 | 2012-03-05 | 서울옵토디바이스주식회사 | 발광 소자 및 그것을 제조하는 방법 |
| DE102010027679A1 (de) | 2010-07-20 | 2012-01-26 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
| US8598614B2 (en) | 2010-08-30 | 2013-12-03 | Epistar Corporation | Light-emitting devices |
| US9070851B2 (en) | 2010-09-24 | 2015-06-30 | Seoul Semiconductor Co., Ltd. | Wafer-level light emitting diode package and method of fabricating the same |
| KR101142965B1 (ko) * | 2010-09-24 | 2012-05-08 | 서울반도체 주식회사 | 웨이퍼 레벨 발광 다이오드 패키지 및 그것을 제조하는 방법 |
| DE102010048159B4 (de) * | 2010-10-11 | 2023-10-05 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Leuchtdiodenchip |
| TWI532214B (zh) | 2010-10-12 | 2016-05-01 | Lg伊諾特股份有限公司 | 發光元件及其封裝 |
| US8476649B2 (en) | 2010-12-16 | 2013-07-02 | Micron Technology, Inc. | Solid state lighting devices with accessible electrodes and methods of manufacturing |
| TWI488331B (zh) | 2011-03-23 | 2015-06-11 | Epistar Corp | 發光二極體陣列 |
| DE102011015821B4 (de) * | 2011-04-01 | 2023-04-20 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterchip |
| CN102760745B (zh) * | 2011-04-25 | 2016-04-20 | 晶元光电股份有限公司 | 发光二极管阵列 |
| KR102021273B1 (ko) * | 2011-05-27 | 2019-09-16 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 카바졸 화합물, 발광 소자, 발광 장치, 전자 기기, 및 조명 장치 |
| US9299742B2 (en) | 2011-08-15 | 2016-03-29 | Micron Technology, Inc. | High-voltage solid-state transducers and associated systems and methods |
| KR20130021300A (ko) | 2011-08-22 | 2013-03-05 | 엘지이노텍 주식회사 | 발광소자, 발광소자 패키지, 및 라이트 유닛 |
| KR101830719B1 (ko) * | 2011-09-01 | 2018-02-21 | 엘지이노텍 주식회사 | 발광 소자 |
| DE102011116232B4 (de) | 2011-10-17 | 2020-04-09 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung |
| KR101321002B1 (ko) * | 2011-12-06 | 2013-10-29 | 안상정 | 반도체 발광소자 |
| DE102011056888A1 (de) | 2011-12-22 | 2013-06-27 | Osram Opto Semiconductors Gmbh | Anzeigevorrichtung und Verfahren zur Herstellung einer Anzeigevorrichtung |
| DE102012101160A1 (de) | 2012-02-14 | 2013-08-14 | Osram Opto Semiconductors Gmbh | Lichtquellenmodul |
| DE102012101393A1 (de) | 2012-02-21 | 2013-08-22 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils und optoelektronisches Halbleiterbauteil |
| US9450152B2 (en) * | 2012-05-29 | 2016-09-20 | Micron Technology, Inc. | Solid state transducer dies having reflective features over contacts and associated systems and methods |
| US10388690B2 (en) * | 2012-08-07 | 2019-08-20 | Seoul Viosys Co., Ltd. | Wafer level light-emitting diode array |
| US10804316B2 (en) * | 2012-08-07 | 2020-10-13 | Seoul Viosys Co., Ltd. | Wafer level light-emitting diode array |
| DE102012108879B4 (de) * | 2012-09-20 | 2024-03-28 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterchip mit mehreren nebeneinander angeordneten aktiven Bereichen |
| JP5924231B2 (ja) * | 2012-10-24 | 2016-05-25 | 日亜化学工業株式会社 | 半導体発光素子 |
| DE102012112302A1 (de) | 2012-12-14 | 2014-06-18 | Osram Opto Semiconductors Gmbh | Anzeigevorrichtung und Verfahren zur Herstellung einer Anzeigevorrichtung |
| JP6067400B2 (ja) * | 2013-02-12 | 2017-01-25 | 株式会社東芝 | 半導体発光素子 |
| KR102065390B1 (ko) | 2013-02-15 | 2020-01-13 | 엘지이노텍 주식회사 | 발광소자, 발광소자 패키지 및 라이트 유닛 |
| DE102013102667A1 (de) * | 2013-03-15 | 2014-10-02 | Osram Opto Semiconductors Gmbh | Anzeigevorrichtung |
| KR102098110B1 (ko) * | 2013-04-11 | 2020-04-08 | 엘지이노텍 주식회사 | 발광소자, 발광소자 패키지 및 라이트 유닛 |
| JP6100598B2 (ja) | 2013-04-25 | 2017-03-22 | スタンレー電気株式会社 | 半導体発光素子及び半導体発光装置 |
| DE102013212294A1 (de) * | 2013-06-26 | 2014-12-31 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip |
| KR102098135B1 (ko) * | 2013-07-12 | 2020-04-08 | 엘지이노텍 주식회사 | 발광소자 |
| KR102163967B1 (ko) * | 2014-04-16 | 2020-10-12 | 엘지이노텍 주식회사 | 발광소자 및 조명시스템 |
| EP3131129B1 (en) | 2014-04-07 | 2020-07-15 | LG Innotek Co., Ltd. | Light-emitting element |
| KR102163956B1 (ko) * | 2014-04-07 | 2020-10-12 | 엘지이노텍 주식회사 | 발광소자 및 조명시스템 |
| KR102153125B1 (ko) * | 2014-06-11 | 2020-09-07 | 엘지이노텍 주식회사 | 발광소자 및 조명시스템 |
| KR102212666B1 (ko) * | 2014-06-27 | 2021-02-05 | 엘지이노텍 주식회사 | 발광소자 |
| DE102015104144A1 (de) * | 2015-03-19 | 2016-09-22 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterkörper und Verfahren zur Herstellung eines optoelektronischen Halbleiterkörpers |
| KR102299735B1 (ko) * | 2015-04-13 | 2021-09-10 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광소자 및 조명시스템 |
| CN104795474B (zh) * | 2015-04-20 | 2018-10-16 | 映瑞光电科技(上海)有限公司 | 大功率led芯片及其制造方法 |
| DE102015111574A1 (de) | 2015-07-16 | 2017-01-19 | Osram Opto Semiconductors Gmbh | Optoelektronische Anordnung sowie Verfahren zur Herstellung einer optoelektronischen Anordnung |
| DE102015112538B4 (de) * | 2015-07-30 | 2023-08-03 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauelement und ein Verfahren zur Herstellung eines optoelektronischen Bauelements |
| KR102378952B1 (ko) * | 2015-08-27 | 2022-03-25 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광소자 및 이를 포함하는 발광소자 패키지 |
| FR3048066B1 (fr) * | 2016-02-24 | 2018-03-23 | Valeo Vision | Dispositif lumineux avec une source lumineuse a batonnets lumineux pour differentes fonctions photometriques |
| CN205944139U (zh) | 2016-03-30 | 2017-02-08 | 首尔伟傲世有限公司 | 紫外线发光二极管封装件以及包含此的发光二极管模块 |
| DE102018119688B4 (de) * | 2018-08-14 | 2024-06-27 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Halbleiterbauelement mit einem ersten Kontaktelement, welches einen ersten und einen zweiten Abschnitt aufweist sowie Verfahren zur Herstellung des optoelektronischen Halbleiterbauelements |
| JP6909983B2 (ja) * | 2018-11-29 | 2021-07-28 | 日亜化学工業株式会社 | 発光素子 |
| DE102019103638A1 (de) | 2019-02-13 | 2020-08-13 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches halbleiterbauelement mit abschnitten einer leitfähigen schicht und verfahren zur herstellung eines optoelektronischen halbleiterbauelements |
| JP7014973B2 (ja) * | 2019-08-28 | 2022-02-02 | 日亜化学工業株式会社 | 発光装置 |
| CN110707191B (zh) * | 2019-10-22 | 2021-11-16 | 錼创显示科技股份有限公司 | 微型发光二极管晶粒及微型发光二极管晶圆 |
| TWI712180B (zh) | 2019-10-22 | 2020-12-01 | 錼創顯示科技股份有限公司 | 微型發光二極體晶粒及微型發光二極體晶圓 |
| EP3905326B1 (en) | 2020-04-28 | 2023-01-04 | Nichia Corporation | Light-emitting device |
| CN115799294A (zh) * | 2022-11-29 | 2023-03-14 | 厦门三安光电有限公司 | 发光元件、发光组件及制作方法 |
| CN115732533A (zh) * | 2022-11-29 | 2023-03-03 | 厦门三安光电有限公司 | 发光组件、发光元件及制作方法 |
Family Cites Families (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5684309A (en) * | 1996-07-11 | 1997-11-04 | North Carolina State University | Stacked quantum well aluminum indium gallium nitride light emitting diodes |
| WO1998031055A1 (en) * | 1997-01-09 | 1998-07-16 | Nichia Chemical Industries, Ltd. | Nitride semiconductor device |
| US5831277A (en) * | 1997-03-19 | 1998-11-03 | Northwestern University | III-nitride superlattice structures |
| US5798691A (en) * | 1997-03-20 | 1998-08-25 | Tim Kao; Nien Tsu | Accessory brake light system for automobile |
| EP2169733B1 (de) | 1997-09-29 | 2017-07-19 | OSRAM Opto Semiconductors GmbH | Halbleiterlichtquelle |
| US5952681A (en) * | 1997-11-24 | 1999-09-14 | Chen; Hsing | Light emitting diode emitting red, green and blue light |
| DE19955747A1 (de) | 1999-11-19 | 2001-05-23 | Osram Opto Semiconductors Gmbh | Optische Halbleitervorrichtung mit Mehrfach-Quantentopf-Struktur |
| US6514782B1 (en) | 1999-12-22 | 2003-02-04 | Lumileds Lighting, U.S., Llc | Method of making a III-nitride light-emitting device with increased light generating capability |
| US20020017652A1 (en) | 2000-08-08 | 2002-02-14 | Stefan Illek | Semiconductor chip for optoelectronics |
| JP4960665B2 (ja) | 2006-08-11 | 2012-06-27 | キヤノン株式会社 | 発光素子アレイ及び画像形成装置 |
| JP4151284B2 (ja) | 2001-03-05 | 2008-09-17 | 日亜化学工業株式会社 | 窒化物半導体発光素子及び発光装置並びにそれらの製造方法 |
| US6635902B1 (en) * | 2002-05-24 | 2003-10-21 | Para Light Electronics Co., Ltd. | Serial connection structure of light emitting diode chip |
| TWI249148B (en) * | 2004-04-13 | 2006-02-11 | Epistar Corp | Light-emitting device array having binding layer |
| US6958494B2 (en) * | 2003-08-14 | 2005-10-25 | Dicon Fiberoptics, Inc. | Light emitting diodes with current spreading layer |
| JP4474892B2 (ja) * | 2003-10-14 | 2010-06-09 | 日亜化学工業株式会社 | フリップチップ型led |
| US8835937B2 (en) * | 2004-02-20 | 2014-09-16 | Osram Opto Semiconductors Gmbh | Optoelectronic component, device comprising a plurality of optoelectronic components, and method for the production of an optoelectronic component |
| TWI254469B (en) | 2004-04-14 | 2006-05-01 | Osram Opto Semiconductors Gmbh | Luminous diode chip |
| DE102005016592A1 (de) * | 2004-04-14 | 2005-11-24 | Osram Opto Semiconductors Gmbh | Leuchtdiodenchip |
| JP3904571B2 (ja) | 2004-09-02 | 2007-04-11 | ローム株式会社 | 半導体発光装置 |
| US20060113548A1 (en) * | 2004-11-29 | 2006-06-01 | Ching-Chung Chen | Light emitting diode |
| EP1825515B1 (en) | 2004-12-06 | 2015-11-25 | Koninklijke Philips N.V. | Single chip led as compact color variable light source |
| WO2006098545A2 (en) | 2004-12-14 | 2006-09-21 | Seoul Opto Device Co., Ltd. | Light emitting device having a plurality of light emitting cells and package mounting the same |
| US7221044B2 (en) | 2005-01-21 | 2007-05-22 | Ac Led Lighting, L.L.C. | Heterogeneous integrated high voltage DC/AC light emitter |
| JP4462249B2 (ja) | 2005-09-22 | 2010-05-12 | ソニー株式会社 | 発光ダイオードの製造方法、集積型発光ダイオードの製造方法および窒化物系iii−v族化合物半導体の成長方法 |
| TWI291246B (en) | 2005-10-20 | 2007-12-11 | Epistar Corp | Light emitting device and method of forming the same |
| TWI331406B (en) | 2005-12-14 | 2010-10-01 | Advanced Optoelectronic Tech | Single chip with multi-led |
| TW200739952A (en) * | 2005-12-22 | 2007-10-16 | Rohm Co Ltd | Light emitting device and illumination instrument |
| JP2007324581A (ja) | 2006-05-01 | 2007-12-13 | Mitsubishi Chemicals Corp | 集積型半導体発光装置およびその製造方法 |
| DE102006055884B4 (de) * | 2006-09-29 | 2023-03-16 | Pictiva Displays International Limited | Strahlungsemittierende Vorrichtung und Verfahren zu ihrer Herstellung |
| WO2008091837A2 (en) | 2007-01-22 | 2008-07-31 | Cree Led Lighting Solutions, Inc. | Fault tolerant light emitters, systems incorporating fault tolerant light emitters and methods of fabricating fault tolerant light emitters |
| DE102007019775B4 (de) | 2007-04-26 | 2024-11-28 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauelement |
| DE102007022947B4 (de) * | 2007-04-26 | 2022-05-05 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterkörper und Verfahren zur Herstellung eines solchen |
| WO2009106063A1 (de) | 2008-02-29 | 2009-09-03 | Osram Opto Semiconductors Gmbh | Monolithischer, optoelektronischer halbleiterkörper und verfahren zur herstellung eines solchen |
-
2009
- 2009-02-25 WO PCT/DE2009/000267 patent/WO2009106063A1/de not_active Ceased
- 2009-02-25 EP EP09714749.0A patent/EP2245667B1/de active Active
- 2009-02-25 JP JP2010547951A patent/JP5992662B2/ja active Active
- 2009-02-25 KR KR1020107019882A patent/KR101571577B1/ko active Active
- 2009-02-25 US US12/920,317 patent/US8643034B2/en active Active
- 2009-02-25 CN CN2009801070992A patent/CN101960601B/zh active Active
- 2009-02-27 TW TW098106285A patent/TWI400822B/zh not_active IP Right Cessation
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