JP2011513956A - 小型ケーシングおよび少なくとも１つの小型ケーシングを備えた支持体装置 - Google Patents

小型ケーシングおよび少なくとも１つの小型ケーシングを備えた支持体装置 Download PDF

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Publication number
JP2011513956A
JP2011513956A JP2010547949A JP2010547949A JP2011513956A JP 2011513956 A JP2011513956 A JP 2011513956A JP 2010547949 A JP2010547949 A JP 2010547949A JP 2010547949 A JP2010547949 A JP 2010547949A JP 2011513956 A JP2011513956 A JP 2011513956A
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JP
Japan
Prior art keywords
support
casing
small
casing body
small casing
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Pending
Application number
JP2010547949A
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English (en)
Japanese (ja)
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JP2011513956A5 (enExample
Inventor
リー チャールズ
シェン フェン
ツォウ ジェニー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of JP2011513956A publication Critical patent/JP2011513956A/ja
Publication of JP2011513956A5 publication Critical patent/JP2011513956A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10651—Component having two leads, e.g. resistor, capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Casings For Electric Apparatus (AREA)
  • Led Device Packages (AREA)
JP2010547949A 2008-02-29 2009-02-18 小型ケーシングおよび少なくとも１つの小型ケーシングを備えた支持体装置 Pending JP2011513956A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008011862A DE102008011862A1 (de) 2008-02-29 2008-02-29 Miniaturgehäuse, Trägeranordnung mit mindestens einem Miniaturgehäuse, sowie ein Verfahren zur Herstellung einer Trägeranordnung
PCT/DE2009/000248 WO2009106051A2 (de) 2008-02-29 2009-02-18 Miniaturgehäuse und trägeranordnung mit mindestens einem miniaturgehäuse

Publications (2)

Publication Number Publication Date
JP2011513956A true JP2011513956A (ja) 2011-04-28
JP2011513956A5 JP2011513956A5 (enExample) 2011-11-24

Family

ID=40874967

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010547949A Pending JP2011513956A (ja) 2008-02-29 2009-02-18 小型ケーシングおよび少なくとも１つの小型ケーシングを備えた支持体装置

Country Status (7)

Country Link
US (1) US8633408B2 (enExample)
EP (1) EP2248190A2 (enExample)
JP (1) JP2011513956A (enExample)
KR (1) KR20100127758A (enExample)
CN (1) CN101960620B (enExample)
DE (1) DE102008011862A1 (enExample)
WO (1) WO2009106051A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013524485A (ja) * 2010-03-25 2013-06-17 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 発光デバイス用キャリア

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JP2792128B2 (ja) * 1989-08-02 1998-08-27 株式会社豊田自動織機製作所 ジェットルームにおける緯入れ制御方法
US8486761B2 (en) 2010-03-25 2013-07-16 Koninklijke Philips Electronics N.V. Hybrid combination of substrate and carrier mounted light emitting devices
DE102011004508A1 (de) * 2011-02-22 2012-08-23 Siemens Aktiengesellschaft Vorrichtung und Verfahren zum Kontaktieren eines LED-Chips
DE102011079708B4 (de) * 2011-07-25 2022-08-11 Osram Gmbh Trägervorrichtung, elektrische vorrichtung mit einer trägervorrichtung und verfahren zur herstellung dieser
DE102013101260A1 (de) * 2013-02-08 2014-08-14 Osram Opto Semiconductors Gmbh Vorrichtung mit zumindest einem optoelektronischen Halbleiterbauelement
JP6358132B2 (ja) * 2015-03-03 2018-07-18 オムロン株式会社 立体回路構造体
EP3239665A1 (de) * 2016-04-25 2017-11-01 Weickmann & Weickmann PartmbB Sensorgehäuse

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JPH0339863U (enExample) * 1989-08-30 1991-04-17
JP2003298119A (ja) * 2002-03-29 2003-10-17 Rohm Co Ltd バックライトモジュール用光源部、これを用いたバックライトモジュール、およびバックライトモジュールの接続構造

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JPH01100561A (ja) 1987-10-14 1989-04-18 Canon Inc 圧力定着性カプセルトナー
JPH0339863A (ja) 1989-07-07 1991-02-20 Arusu Japan:Kk 太陽熱温水装置
JP2802411B2 (ja) * 1992-05-26 1998-09-24 シャープ株式会社 光学装置
DE59402033D1 (de) 1993-09-30 1997-04-17 Siemens Ag Zweipoliges SMT-Miniatur-Gehäuse für Halbleiterbauelemente und Verfahren zu dessen Herstellung
US5506445A (en) 1994-06-24 1996-04-09 Hewlett-Packard Company Optical transceiver module
DE19751911A1 (de) * 1997-11-22 1999-06-02 Vishay Semiconductor Gmbh Leuchtdiode mit einem hermetisch dichten Gehäuse und Verfahren zu deren Herstellung
JP4178653B2 (ja) 1999-02-26 2008-11-12 日立化成工業株式会社 電気泳動用チップとその製造方法、該電気泳動用チップを用いた電気泳動装置及び荷電性物質の分離方法
HK1041367A1 (en) * 2000-02-09 2002-07-05 Nippon Leiz Corporation light source
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JP4211359B2 (ja) * 2002-03-06 2009-01-21 日亜化学工業株式会社 半導体装置の製造方法
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KR100593945B1 (ko) * 2005-05-30 2006-06-30 삼성전기주식회사 고출력 ｌｅｄ 패키지 및 그 제조방법
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JP4739851B2 (ja) * 2005-07-29 2011-08-03 スタンレー電気株式会社 表面実装型半導体装置
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JPH0339863U (enExample) * 1989-08-30 1991-04-17
JP2003298119A (ja) * 2002-03-29 2003-10-17 Rohm Co Ltd バックライトモジュール用光源部、これを用いたバックライトモジュール、およびバックライトモジュールの接続構造

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013524485A (ja) * 2010-03-25 2013-06-17 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 発光デバイス用キャリア

Also Published As

Publication number Publication date
CN101960620B (zh) 2013-06-12
EP2248190A2 (de) 2010-11-10
DE102008011862A1 (de) 2009-09-03
US20110100707A1 (en) 2011-05-05
WO2009106051A3 (de) 2009-12-30
CN101960620A (zh) 2011-01-26
WO2009106051A2 (de) 2009-09-03
US8633408B2 (en) 2014-01-21
KR20100127758A (ko) 2010-12-06

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