KR20100127758A - 초소형 하우징 및 적어도 하나의 초소형 하우징을 포함한 지지 장치 - Google Patents

초소형 하우징 및 적어도 하나의 초소형 하우징을 포함한 지지 장치 Download PDF

Info

Publication number
KR20100127758A
KR20100127758A KR1020107018290A KR20107018290A KR20100127758A KR 20100127758 A KR20100127758 A KR 20100127758A KR 1020107018290 A KR1020107018290 A KR 1020107018290A KR 20107018290 A KR20107018290 A KR 20107018290A KR 20100127758 A KR20100127758 A KR 20100127758A
Authority
KR
South Korea
Prior art keywords
housing
carrier
housing body
recess
microminiature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020107018290A
Other languages
English (en)
Korean (ko)
Inventor
찰스 리
펭 셍
제니 주
Original Assignee
오스람 옵토 세미컨덕터스 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오스람 옵토 세미컨덕터스 게엠베하 filed Critical 오스람 옵토 세미컨덕터스 게엠베하
Publication of KR20100127758A publication Critical patent/KR20100127758A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10651—Component having two leads, e.g. resistor, capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Casings For Electric Apparatus (AREA)
  • Led Device Packages (AREA)
KR1020107018290A 2008-02-29 2009-02-18 초소형 하우징 및 적어도 하나의 초소형 하우징을 포함한 지지 장치 Ceased KR20100127758A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008011862A DE102008011862A1 (de) 2008-02-29 2008-02-29 Miniaturgehäuse, Trägeranordnung mit mindestens einem Miniaturgehäuse, sowie ein Verfahren zur Herstellung einer Trägeranordnung
DE102008011862.1 2008-02-29

Publications (1)

Publication Number Publication Date
KR20100127758A true KR20100127758A (ko) 2010-12-06

Family

ID=40874967

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107018290A Ceased KR20100127758A (ko) 2008-02-29 2009-02-18 초소형 하우징 및 적어도 하나의 초소형 하우징을 포함한 지지 장치

Country Status (7)

Country Link
US (1) US8633408B2 (enExample)
EP (1) EP2248190A2 (enExample)
JP (1) JP2011513956A (enExample)
KR (1) KR20100127758A (enExample)
CN (1) CN101960620B (enExample)
DE (1) DE102008011862A1 (enExample)
WO (1) WO2009106051A2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2792128B2 (ja) * 1989-08-02 1998-08-27 株式会社豊田自動織機製作所 ジェットルームにおける緯入れ制御方法
US8486761B2 (en) 2010-03-25 2013-07-16 Koninklijke Philips Electronics N.V. Hybrid combination of substrate and carrier mounted light emitting devices
US8319247B2 (en) * 2010-03-25 2012-11-27 Koninklijke Philips Electronics N.V. Carrier for a light emitting device
DE102011004508A1 (de) * 2011-02-22 2012-08-23 Siemens Aktiengesellschaft Vorrichtung und Verfahren zum Kontaktieren eines LED-Chips
DE102011079708B4 (de) * 2011-07-25 2022-08-11 Osram Gmbh Trägervorrichtung, elektrische vorrichtung mit einer trägervorrichtung und verfahren zur herstellung dieser
DE102013101260A1 (de) * 2013-02-08 2014-08-14 Osram Opto Semiconductors Gmbh Vorrichtung mit zumindest einem optoelektronischen Halbleiterbauelement
JP6358132B2 (ja) * 2015-03-03 2018-07-18 オムロン株式会社 立体回路構造体
EP3239665A1 (de) * 2016-04-25 2017-11-01 Weickmann & Weickmann PartmbB Sensorgehäuse

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01100561A (ja) 1987-10-14 1989-04-18 Canon Inc 圧力定着性カプセルトナー
JPH0339863A (ja) 1989-07-07 1991-02-20 Arusu Japan:Kk 太陽熱温水装置
JPH0339863U (enExample) * 1989-08-30 1991-04-17
JP2802411B2 (ja) * 1992-05-26 1998-09-24 シャープ株式会社 光学装置
DE59402033D1 (de) 1993-09-30 1997-04-17 Siemens Ag Zweipoliges SMT-Miniatur-Gehäuse für Halbleiterbauelemente und Verfahren zu dessen Herstellung
US5506445A (en) 1994-06-24 1996-04-09 Hewlett-Packard Company Optical transceiver module
DE19751911A1 (de) * 1997-11-22 1999-06-02 Vishay Semiconductor Gmbh Leuchtdiode mit einem hermetisch dichten Gehäuse und Verfahren zu deren Herstellung
JP4178653B2 (ja) 1999-02-26 2008-11-12 日立化成工業株式会社 電気泳動用チップとその製造方法、該電気泳動用チップを用いた電気泳動装置及び荷電性物質の分離方法
HK1041367A1 (en) * 2000-02-09 2002-07-05 Nippon Leiz Corporation light source
US6600231B2 (en) * 2000-05-11 2003-07-29 Mitutoyo Corporation Functional device unit and method of producing the same
ATE363628T1 (de) * 2000-12-21 2007-06-15 Gamesman Ltd Leuchten
US6578986B2 (en) * 2001-06-29 2003-06-17 Permlight Products, Inc. Modular mounting arrangement and method for light emitting diodes
DE10140831A1 (de) * 2001-08-21 2003-03-13 Osram Opto Semiconductors Gmbh Leiterrahmen und Gehäuse für ein strahlungsemittierendes Bauelement, strahlungsemittierendes Bauelement und Anzeige- und/oder Beleuchtungsanordnung mit strahlungsemittierenden Bauelementen
JP4211359B2 (ja) * 2002-03-06 2009-01-21 日亜化学工業株式会社 半導体装置の製造方法
JP3699414B2 (ja) 2002-03-29 2005-09-28 ローム株式会社 バックライトモジュールの接続構造
TWI292961B (en) * 2002-09-05 2008-01-21 Nichia Corp Semiconductor device and an optical device using the semiconductor device
EP1548905A4 (en) * 2002-09-30 2006-08-09 Sanyo Electric Co LIGHT-EMITTING ITEM
US7692206B2 (en) * 2002-12-06 2010-04-06 Cree, Inc. Composite leadframe LED package and method of making the same
KR100550856B1 (ko) * 2003-06-03 2006-02-10 삼성전기주식회사 발광 다이오드(ｌｅｄ) 소자의 제조 방법
KR100586944B1 (ko) * 2003-12-26 2006-06-07 삼성전기주식회사 고출력 발광다이오드 패키지 및 제조방법
TWM258416U (en) * 2004-06-04 2005-03-01 Lite On Technology Corp Power LED package module
DE102004047061B4 (de) * 2004-09-28 2018-07-26 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements
US7285802B2 (en) * 2004-12-21 2007-10-23 3M Innovative Properties Company Illumination assembly and method of making same
WO2006123917A1 (en) * 2005-05-20 2006-11-23 Luxpia Co., Ltd. Light emitting diode package having a reflector cup by metal thin film and its manufacturing method
WO2006126809A1 (en) * 2005-05-26 2006-11-30 Luxpia Co., Ltd. Very small light emitting diode package and manufacturing methods of it
KR100593945B1 (ko) * 2005-05-30 2006-06-30 삼성전기주식회사 고출력 ｌｅｄ 패키지 및 그 제조방법
KR100691179B1 (ko) * 2005-06-01 2007-03-09 삼성전기주식회사 측면 발광형 엘이디 패키지 및 그 제조 방법
KR100638874B1 (ko) * 2005-07-06 2006-10-27 삼성전기주식회사 Ｌｅｄ 광원이 도광판에 삽입된 백라이트 장치의광원-도광판 구조 및 이를 포함하는 백라이트 장치
JP4739851B2 (ja) * 2005-07-29 2011-08-03 スタンレー電気株式会社 表面実装型半導体装置
KR100637476B1 (ko) * 2005-11-09 2006-10-23 알티전자 주식회사 측면발광 다이오드 및 그 제조방법
US20070230182A1 (en) * 2006-03-28 2007-10-04 Yun Tai Led module
KR100757826B1 (ko) * 2006-09-29 2007-09-11 서울반도체 주식회사 측면 발광 다이오드 패키지
DE102007006583A1 (de) * 2007-02-09 2008-08-28 Wen-Kung Sung Verfahren zum Herstellen einer seitlich leuchtenden Diode und deren Aufbau
JP5060172B2 (ja) 2007-05-29 2012-10-31 岩谷産業株式会社 半導体発光装置
TWM329243U (en) * 2007-08-29 2008-03-21 Harvatek Corp LED chip package structure with a high-efficiency light-emitting effect

Also Published As

Publication number Publication date
CN101960620B (zh) 2013-06-12
EP2248190A2 (de) 2010-11-10
DE102008011862A1 (de) 2009-09-03
US20110100707A1 (en) 2011-05-05
WO2009106051A3 (de) 2009-12-30
CN101960620A (zh) 2011-01-26
WO2009106051A2 (de) 2009-09-03
JP2011513956A (ja) 2011-04-28
US8633408B2 (en) 2014-01-21

Similar Documents

Publication Publication Date Title
KR20100127758A (ko) 초소형 하우징 및 적어도 하나의 초소형 하우징을 포함한 지지 장치
US8052310B2 (en) Lighting device
CN101469817B (zh) 发光装置
CN101424824B (zh) 液晶显示装置
EP2481973B1 (en) Lamp apparatus and luminaire
CN101174750B (zh) 灯座及具有该灯座的显示装置
CN1327274C (zh) 后照灯模块用光源、用其光源的该模块及模块的连接结构
JP5681451B2 (ja) ランプ及び照明装置
KR100969144B1 (ko) 발광 다이오드 패키지
US8016471B2 (en) Light emitting diode device and applications thereof
TWI652867B (zh) Light-emitting element housing member, array member, and light-emitting device
EP2772957A1 (en) Lighting device
CN103925519B (zh) 电路板和包括该电路板的平板显示器
JP5277610B2 (ja) 発光装置及び面発光装置並びに発光装置用パッケージ
JP2008270106A (ja) 立体回路部品の取付構造
CN100498050C (zh) 光源组件及面光源装置
CN104025331B (zh) 灯具
JP4656382B2 (ja) 光源支持体及び光源装置
KR101050042B1 (ko) 엘이디 조명 모듈
WO2013128733A1 (ja) 発光装置およびそれを用いた照明器具
EP2458655A2 (en) Light emitting device package
KR20150078935A (ko) 백라이트 장치
CN107830502B (zh) Led贴片灯、发光组件及移动终端
CN100468154C (zh) 背光模组和液晶显示装置
KR100792034B1 (ko) 측면발광 다이오드

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20100817

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20140117

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20141230

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20151028

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20141230

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I