CN101960620B - 小型壳体和带有至少一个小型壳体的支承装置 - Google Patents

小型壳体和带有至少一个小型壳体的支承装置 Download PDF

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Publication number
CN101960620B
CN101960620B CN2009801066588A CN200980106658A CN101960620B CN 101960620 B CN101960620 B CN 101960620B CN 2009801066588 A CN2009801066588 A CN 2009801066588A CN 200980106658 A CN200980106658 A CN 200980106658A CN 101960620 B CN101960620 B CN 101960620B
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CN
China
Prior art keywords
housing
housing body
small
carrier
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009801066588A
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English (en)
Chinese (zh)
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CN101960620A (zh
Inventor
C·李
F·盛
J·周
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of CN101960620A publication Critical patent/CN101960620A/zh
Application granted granted Critical
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Expired - Fee Related legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10651—Component having two leads, e.g. resistor, capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Casings For Electric Apparatus (AREA)
  • Led Device Packages (AREA)
CN2009801066588A 2008-02-29 2009-02-18 小型壳体和带有至少一个小型壳体的支承装置 Expired - Fee Related CN101960620B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008011862A DE102008011862A1 (de) 2008-02-29 2008-02-29 Miniaturgehäuse, Trägeranordnung mit mindestens einem Miniaturgehäuse, sowie ein Verfahren zur Herstellung einer Trägeranordnung
DE102008011862.1 2008-02-29
PCT/DE2009/000248 WO2009106051A2 (de) 2008-02-29 2009-02-18 Miniaturgehäuse und trägeranordnung mit mindestens einem miniaturgehäuse

Publications (2)

Publication Number Publication Date
CN101960620A CN101960620A (zh) 2011-01-26
CN101960620B true CN101960620B (zh) 2013-06-12

Family

ID=40874967

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801066588A Expired - Fee Related CN101960620B (zh) 2008-02-29 2009-02-18 小型壳体和带有至少一个小型壳体的支承装置

Country Status (7)

Country Link
US (1) US8633408B2 (enExample)
EP (1) EP2248190A2 (enExample)
JP (1) JP2011513956A (enExample)
KR (1) KR20100127758A (enExample)
CN (1) CN101960620B (enExample)
DE (1) DE102008011862A1 (enExample)
WO (1) WO2009106051A2 (enExample)

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JP2792128B2 (ja) * 1989-08-02 1998-08-27 株式会社豊田自動織機製作所 ジェットルームにおける緯入れ制御方法
US8319247B2 (en) * 2010-03-25 2012-11-27 Koninklijke Philips Electronics N.V. Carrier for a light emitting device
US8486761B2 (en) 2010-03-25 2013-07-16 Koninklijke Philips Electronics N.V. Hybrid combination of substrate and carrier mounted light emitting devices
DE102011004508A1 (de) * 2011-02-22 2012-08-23 Siemens Aktiengesellschaft Vorrichtung und Verfahren zum Kontaktieren eines LED-Chips
DE102011079708B4 (de) * 2011-07-25 2022-08-11 Osram Gmbh Trägervorrichtung, elektrische vorrichtung mit einer trägervorrichtung und verfahren zur herstellung dieser
DE102013101260A1 (de) 2013-02-08 2014-08-14 Osram Opto Semiconductors Gmbh Vorrichtung mit zumindest einem optoelektronischen Halbleiterbauelement
JP6358132B2 (ja) * 2015-03-03 2018-07-18 オムロン株式会社 立体回路構造体
EP3239665A1 (de) * 2016-04-25 2017-11-01 Weickmann & Weickmann PartmbB Sensorgehäuse

Citations (2)

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EP1217291A2 (en) * 2000-12-21 2002-06-26 Gamesman Limited Lamps
CN1685578A (zh) * 2002-09-30 2005-10-19 三洋电机株式会社 光发射元件

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JPH01100561A (ja) 1987-10-14 1989-04-18 Canon Inc 圧力定着性カプセルトナー
JPH0339863A (ja) 1989-07-07 1991-02-20 Arusu Japan:Kk 太陽熱温水装置
JPH0339863U (enExample) * 1989-08-30 1991-04-17
JP2802411B2 (ja) * 1992-05-26 1998-09-24 シャープ株式会社 光学装置
DE59402033D1 (de) 1993-09-30 1997-04-17 Siemens Ag Zweipoliges SMT-Miniatur-Gehäuse für Halbleiterbauelemente und Verfahren zu dessen Herstellung
US5506445A (en) * 1994-06-24 1996-04-09 Hewlett-Packard Company Optical transceiver module
DE19751911A1 (de) * 1997-11-22 1999-06-02 Vishay Semiconductor Gmbh Leuchtdiode mit einem hermetisch dichten Gehäuse und Verfahren zu deren Herstellung
JP4178653B2 (ja) 1999-02-26 2008-11-12 日立化成工業株式会社 電気泳動用チップとその製造方法、該電気泳動用チップを用いた電気泳動装置及び荷電性物質の分離方法
CN1225801C (zh) * 2000-02-09 2005-11-02 日本光源股份有限公司 光源装置
DE10122705B4 (de) * 2000-05-11 2012-07-26 Mitutoyo Corp. Einrichtung mit funktionalem Bauelement und Verfahren zu seiner Herstellung
US6578986B2 (en) * 2001-06-29 2003-06-17 Permlight Products, Inc. Modular mounting arrangement and method for light emitting diodes
DE10140831A1 (de) * 2001-08-21 2003-03-13 Osram Opto Semiconductors Gmbh Leiterrahmen und Gehäuse für ein strahlungsemittierendes Bauelement, strahlungsemittierendes Bauelement und Anzeige- und/oder Beleuchtungsanordnung mit strahlungsemittierenden Bauelementen
JP4211359B2 (ja) * 2002-03-06 2009-01-21 日亜化学工業株式会社 半導体装置の製造方法
JP3699414B2 (ja) * 2002-03-29 2005-09-28 ローム株式会社 バックライトモジュールの接続構造
TWI292961B (en) * 2002-09-05 2008-01-21 Nichia Corp Semiconductor device and an optical device using the semiconductor device
US7692206B2 (en) * 2002-12-06 2010-04-06 Cree, Inc. Composite leadframe LED package and method of making the same
KR100550856B1 (ko) * 2003-06-03 2006-02-10 삼성전기주식회사 발광 다이오드(ｌｅｄ) 소자의 제조 방법
KR100586944B1 (ko) * 2003-12-26 2006-06-07 삼성전기주식회사 고출력 발광다이오드 패키지 및 제조방법
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KR100593945B1 (ko) * 2005-05-30 2006-06-30 삼성전기주식회사 고출력 ｌｅｄ 패키지 및 그 제조방법
KR100691179B1 (ko) * 2005-06-01 2007-03-09 삼성전기주식회사 측면 발광형 엘이디 패키지 및 그 제조 방법
KR100638874B1 (ko) * 2005-07-06 2006-10-27 삼성전기주식회사 Ｌｅｄ 광원이 도광판에 삽입된 백라이트 장치의광원-도광판 구조 및 이를 포함하는 백라이트 장치
JP4739851B2 (ja) * 2005-07-29 2011-08-03 スタンレー電気株式会社 表面実装型半導体装置
KR100637476B1 (ko) * 2005-11-09 2006-10-23 알티전자 주식회사 측면발광 다이오드 및 그 제조방법
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EP1217291A2 (en) * 2000-12-21 2002-06-26 Gamesman Limited Lamps
CN1685578A (zh) * 2002-09-30 2005-10-19 三洋电机株式会社 光发射元件

Also Published As

Publication number Publication date
US20110100707A1 (en) 2011-05-05
CN101960620A (zh) 2011-01-26
EP2248190A2 (de) 2010-11-10
WO2009106051A3 (de) 2009-12-30
DE102008011862A1 (de) 2009-09-03
WO2009106051A2 (de) 2009-09-03
KR20100127758A (ko) 2010-12-06
JP2011513956A (ja) 2011-04-28
US8633408B2 (en) 2014-01-21

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130612

Termination date: 20190218