JP2011507291A5 - - Google Patents

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Publication number
JP2011507291A5
JP2011507291A5 JP2010538409A JP2010538409A JP2011507291A5 JP 2011507291 A5 JP2011507291 A5 JP 2011507291A5 JP 2010538409 A JP2010538409 A JP 2010538409A JP 2010538409 A JP2010538409 A JP 2010538409A JP 2011507291 A5 JP2011507291 A5 JP 2011507291A5
Authority
JP
Japan
Prior art keywords
recess
led die
molded article
transparent plastic
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010538409A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011507291A (ja
Filing date
Publication date
Priority claimed from DE102007061261A external-priority patent/DE102007061261A1/de
Application filed filed Critical
Publication of JP2011507291A publication Critical patent/JP2011507291A/ja
Publication of JP2011507291A5 publication Critical patent/JP2011507291A5/ja
Pending legal-status Critical Current

Links

JP2010538409A 2007-12-19 2008-12-09 Ｌｅｄｄｉｅを有する発光体およびその製造方法 Pending JP2011507291A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007061261A DE102007061261A1 (de) 2007-12-19 2007-12-19 Leuchtkörper mit LED-DIEs und deren Herstellung
PCT/EP2008/010414 WO2009077105A1 (de) 2007-12-19 2008-12-09 Leuchtkörper mit led-dies und deren herstellung

Publications (2)

Publication Number Publication Date
JP2011507291A JP2011507291A (ja) 2011-03-03
JP2011507291A5 true JP2011507291A5 (enExample) 2012-01-19

Family

ID=40351577

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010538409A Pending JP2011507291A (ja) 2007-12-19 2008-12-09 Ｌｅｄｄｉｅを有する発光体およびその製造方法

Country Status (8)

Country Link
US (2) US8487322B2 (enExample)
EP (1) EP2235429A1 (enExample)
JP (1) JP2011507291A (enExample)
KR (1) KR101556807B1 (enExample)
CN (1) CN102016387B (enExample)
DE (1) DE102007061261A1 (enExample)
TW (1) TW200945508A (enExample)
WO (1) WO2009077105A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2675390A1 (en) * 2009-08-13 2011-02-13 Norik Bonyadi Moulding with embedded lighting
DE102009060896A1 (de) * 2009-12-30 2011-07-07 ERCO GmbH, 58507 Lichtquellenmodul u. a.
DE102014110470A1 (de) * 2014-07-24 2016-01-28 Osram Opto Semiconductors Gmbh Beleuchtungsmodul
KR101847100B1 (ko) * 2017-01-02 2018-04-09 박승환 Uv 임프린팅 기술을 이용한 투명 발광장치 제조 방법 및 그에 따라 제조되는 투명 발광장치
DE102019106546A1 (de) * 2019-03-14 2020-09-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur herstellung von optoelektronischen halbleiterbauteilen und optoelektronisches halbleiterbauteil
CN112936734A (zh) * 2021-03-08 2021-06-11 东莞广华汽车饰件科技有限公司 一种灯板定位式胶膜汽车装饰件的注塑制造方法
DE102023107545A1 (de) 2023-03-24 2024-09-26 Marelli Automotive Lighting Reutlingen (Germany) GmbH Vorrichtung zum Ausleuchten eines Emblems oder eines Schriftzugs eines Kraftfahrzeugs, ausgeleuchtetes Emblem oder ausgeleuchteter Schriftzug und Anordnung umfassend ein Frontpanel eines Kraftfahrzeugs mit mehreren ausleuchtbaren Emblemen oder Schriftzügen und Vorrichtungen zum Ausleuchten der Embleme oder Schriftzüge

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JPH10308535A (ja) * 1997-05-02 1998-11-17 Citizen Electron Co Ltd 表面実装型発光ダイオード及びその製造方法
JP3116085B2 (ja) * 1997-09-16 2000-12-11 東京農工大学長 半導体素子形成法
JP3746173B2 (ja) * 1999-03-12 2006-02-15 松下電器産業株式会社 面照明装置及びそれを用いた携帯端末装置
JP3774616B2 (ja) * 2000-06-29 2006-05-17 株式会社日立製作所 照明装置及び導光板の製造方法
US6614103B1 (en) * 2000-09-01 2003-09-02 General Electric Company Plastic packaging of LED arrays
JP4431925B2 (ja) * 2000-11-30 2010-03-17 信越半導体株式会社 発光素子の製造方法
JP2003011416A (ja) 2001-06-28 2003-01-15 Kyocera Corp 光プリンタヘッド
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JP4067802B2 (ja) * 2001-09-18 2008-03-26 松下電器産業株式会社 照明装置
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JP4108318B2 (ja) * 2001-11-13 2008-06-25 シチズン電子株式会社 発光装置
JP2003158301A (ja) 2001-11-22 2003-05-30 Citizen Electronics Co Ltd 発光ダイオード
JP3875914B2 (ja) 2002-05-14 2007-01-31 株式会社ケンウッド 電子機器および書き込み動作制御方法
WO2004017407A1 (de) * 2002-07-31 2004-02-26 Osram Opto Semiconductors Gmbh Oberflächenmontierbares halbleiterbauelement und verfahren zu dessen herstellung
US20040048033A1 (en) * 2002-09-11 2004-03-11 Osram Opto Semiconductors (Malaysia) Sdn. Bhd. Oled devices with improved encapsulation
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JP2006179572A (ja) * 2004-12-21 2006-07-06 Sharp Corp 発光ダイオード、バックライト装置および発光ダイオードの製造方法
JP5209177B2 (ja) * 2005-11-14 2013-06-12 新光電気工業株式会社 半導体装置および半導体装置の製造方法
KR100828891B1 (ko) * 2006-02-23 2008-05-09 엘지이노텍 주식회사 Ｌｅｄ 패키지
TWM302039U (en) * 2006-03-13 2006-12-01 Belletech Technology Co Ltd LED backlight module of display
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JP5028562B2 (ja) * 2006-12-11 2012-09-19 株式会社ジャパンディスプレイイースト 照明装置及びこの照明装置を用いた表示装置
US9024349B2 (en) * 2007-01-22 2015-05-05 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method

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