KR101556807B1 - Ｌｅｄ 다이를 가지는 발광체 및 그의 제조 - Google Patents

Ｌｅｄ 다이를 가지는 발광체 및 그의 제조 Download PDF

Info

Publication number
KR101556807B1
KR101556807B1 KR1020107013521A KR20107013521A KR101556807B1 KR 101556807 B1 KR101556807 B1 KR 101556807B1 KR 1020107013521 A KR1020107013521 A KR 1020107013521A KR 20107013521 A KR20107013521 A KR 20107013521A KR 101556807 B1 KR101556807 B1 KR 101556807B1
Authority
KR
South Korea
Prior art keywords
molding
led die
indentation
transparent plastic
open side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020107013521A
Other languages
English (en)
Korean (ko)
Other versions
KR20100115343A (ko
Inventor
안드레아 마이어-리히터
에카르트 폴틴
미하엘 로펠
페터 쉬블리
Original Assignee
바이엘 머티리얼사이언스 아게
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 바이엘 머티리얼사이언스 아게 filed Critical 바이엘 머티리얼사이언스 아게
Publication of KR20100115343A publication Critical patent/KR20100115343A/ko
Application granted granted Critical
Publication of KR101556807B1 publication Critical patent/KR101556807B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K2/00—Non-electric light sources using luminescence; Light sources using electrochemiluminescence
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45139—Silver (Ag) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
KR1020107013521A 2007-12-19 2008-12-09 Ｌｅｄ 다이를 가지는 발광체 및 그의 제조 Expired - Fee Related KR101556807B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007061261A DE102007061261A1 (de) 2007-12-19 2007-12-19 Leuchtkörper mit LED-DIEs und deren Herstellung
DE102007061261.5 2007-12-19

Publications (2)

Publication Number Publication Date
KR20100115343A KR20100115343A (ko) 2010-10-27
KR101556807B1 true KR101556807B1 (ko) 2015-10-01

Family

ID=40351577

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107013521A Expired - Fee Related KR101556807B1 (ko) 2007-12-19 2008-12-09 Ｌｅｄ 다이를 가지는 발광체 및 그의 제조

Country Status (8)

Country Link
US (2) US8487322B2 (enExample)
EP (1) EP2235429A1 (enExample)
JP (1) JP2011507291A (enExample)
KR (1) KR101556807B1 (enExample)
CN (1) CN102016387B (enExample)
DE (1) DE102007061261A1 (enExample)
TW (1) TW200945508A (enExample)
WO (1) WO2009077105A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2675390A1 (en) * 2009-08-13 2011-02-13 Norik Bonyadi Moulding with embedded lighting
DE102009060896A1 (de) * 2009-12-30 2011-07-07 ERCO GmbH, 58507 Lichtquellenmodul u. a.
DE102014110470A1 (de) * 2014-07-24 2016-01-28 Osram Opto Semiconductors Gmbh Beleuchtungsmodul
KR101847100B1 (ko) * 2017-01-02 2018-04-09 박승환 Uv 임프린팅 기술을 이용한 투명 발광장치 제조 방법 및 그에 따라 제조되는 투명 발광장치
DE102019106546A1 (de) * 2019-03-14 2020-09-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur herstellung von optoelektronischen halbleiterbauteilen und optoelektronisches halbleiterbauteil
CN112936734A (zh) * 2021-03-08 2021-06-11 东莞广华汽车饰件科技有限公司 一种灯板定位式胶膜汽车装饰件的注塑制造方法
DE102023107545A1 (de) 2023-03-24 2024-09-26 Marelli Automotive Lighting Reutlingen (Germany) GmbH Vorrichtung zum Ausleuchten eines Emblems oder eines Schriftzugs eines Kraftfahrzeugs, ausgeleuchtetes Emblem oder ausgeleuchteter Schriftzug und Anordnung umfassend ein Frontpanel eines Kraftfahrzeugs mit mehreren ausleuchtbaren Emblemen oder Schriftzügen und Vorrichtungen zum Ausleuchten der Embleme oder Schriftzüge

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003011416A (ja) 2001-06-28 2003-01-15 Kyocera Corp 光プリンタヘッド
JP2003158301A (ja) 2001-11-22 2003-05-30 Citizen Electronics Co Ltd 発光ダイオード
JP2003331523A (ja) 2002-05-14 2003-11-21 Kenwood Corp 電子機器および書き込み動作制御方法
JP2006151357A (ja) * 2004-11-08 2006-06-15 Alps Electric Co Ltd 照明装置及びその製造方法

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0553511A (ja) * 1991-08-28 1993-03-05 Toyoda Gosei Co Ltd カラーデイスプレイ装置
JPH10150227A (ja) * 1996-11-15 1998-06-02 Rohm Co Ltd チップ型発光素子
JPH10308535A (ja) * 1997-05-02 1998-11-17 Citizen Electron Co Ltd 表面実装型発光ダイオード及びその製造方法
JP3116085B2 (ja) * 1997-09-16 2000-12-11 東京農工大学長 半導体素子形成法
JP3746173B2 (ja) * 1999-03-12 2006-02-15 松下電器産業株式会社 面照明装置及びそれを用いた携帯端末装置
JP3774616B2 (ja) * 2000-06-29 2006-05-17 株式会社日立製作所 照明装置及び導光板の製造方法
US6614103B1 (en) * 2000-09-01 2003-09-02 General Electric Company Plastic packaging of LED arrays
JP4431925B2 (ja) * 2000-11-30 2010-03-17 信越半導体株式会社 発光素子の製造方法
JP2003023183A (ja) * 2001-07-06 2003-01-24 Stanley Electric Co Ltd 面実装型ｌｅｄランプ
JP4067802B2 (ja) * 2001-09-18 2008-03-26 松下電器産業株式会社 照明装置
US20050073846A1 (en) * 2001-09-27 2005-04-07 Kenji Takine Lightemitting device and method of manufacturing the same
JP4108318B2 (ja) * 2001-11-13 2008-06-25 シチズン電子株式会社 発光装置
JP2005535144A (ja) * 2002-07-31 2005-11-17 オスラム　オプト　セミコンダクターズ　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング 表面実装可能な半導体素子及び該半導体素子の製造のための方法
US20040048033A1 (en) * 2002-09-11 2004-03-11 Osram Opto Semiconductors (Malaysia) Sdn. Bhd. Oled devices with improved encapsulation
BE1015302A3 (fr) * 2003-01-10 2005-01-11 Glaverbel Vitrage comportant des composants electroniques.
DE202004005799U1 (de) * 2003-04-29 2004-06-24 Potthoff, Marc Leuchtkörper
KR20050092300A (ko) * 2004-03-15 2005-09-21 삼성전기주식회사 고출력 발광 다이오드 패키지
KR101085144B1 (ko) * 2004-04-29 2011-11-21 엘지디스플레이 주식회사 Ｌｅｄ 램프 유닛
US7055969B2 (en) * 2004-04-29 2006-06-06 Hewlett-Packard Development Company, L.P. Reflective optical assembly
US7997771B2 (en) * 2004-06-01 2011-08-16 3M Innovative Properties Company LED array systems
DE102004054822A1 (de) * 2004-11-13 2006-05-18 Schefenacker Vision Systems Germany Gmbh Leuchte für Fahrzeuge, vorzugsweise für Kraftfahrzeuge
JP2006179572A (ja) * 2004-12-21 2006-07-06 Sharp Corp 発光ダイオード、バックライト装置および発光ダイオードの製造方法
JP5209177B2 (ja) * 2005-11-14 2013-06-12 新光電気工業株式会社 半導体装置および半導体装置の製造方法
KR100828891B1 (ko) * 2006-02-23 2008-05-09 엘지이노텍 주식회사 Ｌｅｄ 패키지
TWM302039U (en) * 2006-03-13 2006-12-01 Belletech Technology Co Ltd LED backlight module of display
US20070263408A1 (en) * 2006-05-09 2007-11-15 Chua Janet Bee Y Backlight module and method of making the module
JP5028562B2 (ja) * 2006-12-11 2012-09-19 株式会社ジャパンディスプレイイースト 照明装置及びこの照明装置を用いた表示装置
US9024349B2 (en) * 2007-01-22 2015-05-05 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003011416A (ja) 2001-06-28 2003-01-15 Kyocera Corp 光プリンタヘッド
JP2003158301A (ja) 2001-11-22 2003-05-30 Citizen Electronics Co Ltd 発光ダイオード
JP2003331523A (ja) 2002-05-14 2003-11-21 Kenwood Corp 電子機器および書き込み動作制御方法
JP2006151357A (ja) * 2004-11-08 2006-06-15 Alps Electric Co Ltd 照明装置及びその製造方法

Also Published As

Publication number Publication date
TW200945508A (en) 2009-11-01
DE102007061261A1 (de) 2009-07-02
CN102016387A (zh) 2011-04-13
US20130277695A1 (en) 2013-10-24
CN102016387B (zh) 2014-12-03
US8487322B2 (en) 2013-07-16
KR20100115343A (ko) 2010-10-27
JP2011507291A (ja) 2011-03-03
WO2009077105A1 (de) 2009-06-25
US20090242903A1 (en) 2009-10-01
EP2235429A1 (de) 2010-10-06

Similar Documents

Publication Publication Date Title
KR101556807B1 (ko) Ｌｅｄ 다이를 가지는 발광체 및 그의 제조
CN102598345B (zh) 具有保护覆盖物的oled器件
TWI434443B (zh) 發光裝置封裝件
US20060262533A1 (en) Modular light emitting diode
CN101807657B (zh) 发光器件封装和包括其的照明系统
CN101877382B (zh) 发光器件封装和包括该发光器件封装的照明系统
US10113705B2 (en) Light source module and lighting device having the same
CN101365907B (zh) 照明系统和显示设备
US8716744B2 (en) LED package, method for making the LED package and light source having the same
KR101217593B1 (ko) 전자기파를 방출하는 광전 소자를 위한 하우징, 전자기파를방출하는 소자, 및 하우징 또는 소자의 제조 방법
US20120205703A1 (en) Light-Emitting Diode Package Device and Method for Making the Same
US20120228649A1 (en) Led module, method for manufacturing the same, and led channel letter including the same
US20170343204A1 (en) Led device
KR101039974B1 (ko) 발광소자, 발광 소자 제조방법 및 발광 소자 패키지
KR101916137B1 (ko) 발광소자 패키지
US10074779B2 (en) LED module, method for manufacturing the same, and LED channel letter including the same
KR101876948B1 (ko) 조명 램프
HK1152095A (en) Illuminant having led-dies and the production thereof
KR20110107637A (ko) 인쇄회로기판 및 그 제조방법, 발광 소자 패키지, 발광 장치 및 조명 시스템
KR102634319B1 (ko) 측면 발광형 발광소자 패키지 및 그 제조방법
US20140175483A1 (en) Light emitting diode package
KR102509010B1 (ko) 발광 소자 및 이를 구비한 라이트 유닛
KR102131348B1 (ko) 발광소자 패키지
KR20150049533A (ko) 발광소자 패키지
KR20140145413A (ko) 발광 소자 및 이를 구비한 조명 장치

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20180924

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20180924