CN102016387B - 具有led管芯的发光体及其制造 - Google Patents

具有led管芯的发光体及其制造 Download PDF

Info

Publication number
CN102016387B
CN102016387B CN200880121777.6A CN200880121777A CN102016387B CN 102016387 B CN102016387 B CN 102016387B CN 200880121777 A CN200880121777 A CN 200880121777A CN 102016387 B CN102016387 B CN 102016387B
Authority
CN
China
Prior art keywords
recess
led die
molded part
open side
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200880121777.6A
Other languages
English (en)
Chinese (zh)
Other versions
CN102016387A (zh
Inventor
A·梅尔-里克特
E·福尔廷
M·罗佩尔
P·希布利
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Covestro Deutschland AG
Bayer Intellectual Property GmbH
Original Assignee
Bayer MaterialScience AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bayer MaterialScience AG filed Critical Bayer MaterialScience AG
Publication of CN102016387A publication Critical patent/CN102016387A/zh
Application granted granted Critical
Publication of CN102016387B publication Critical patent/CN102016387B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K2/00—Non-electric light sources using luminescence; Light sources using electrochemiluminescence
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45139—Silver (Ag) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
CN200880121777.6A 2007-12-19 2008-12-09 具有led管芯的发光体及其制造 Expired - Fee Related CN102016387B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007061261.5 2007-12-19
DE102007061261A DE102007061261A1 (de) 2007-12-19 2007-12-19 Leuchtkörper mit LED-DIEs und deren Herstellung
PCT/EP2008/010414 WO2009077105A1 (de) 2007-12-19 2008-12-09 Leuchtkörper mit led-dies und deren herstellung

Publications (2)

Publication Number Publication Date
CN102016387A CN102016387A (zh) 2011-04-13
CN102016387B true CN102016387B (zh) 2014-12-03

Family

ID=40351577

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200880121777.6A Expired - Fee Related CN102016387B (zh) 2007-12-19 2008-12-09 具有led管芯的发光体及其制造

Country Status (8)

Country Link
US (2) US8487322B2 (enExample)
EP (1) EP2235429A1 (enExample)
JP (1) JP2011507291A (enExample)
KR (1) KR101556807B1 (enExample)
CN (1) CN102016387B (enExample)
DE (1) DE102007061261A1 (enExample)
TW (1) TW200945508A (enExample)
WO (1) WO2009077105A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2675390A1 (en) * 2009-08-13 2011-02-13 Norik Bonyadi Moulding with embedded lighting
DE102009060896A1 (de) * 2009-12-30 2011-07-07 ERCO GmbH, 58507 Lichtquellenmodul u. a.
DE102014110470A1 (de) * 2014-07-24 2016-01-28 Osram Opto Semiconductors Gmbh Beleuchtungsmodul
KR101847100B1 (ko) * 2017-01-02 2018-04-09 박승환 Uv 임프린팅 기술을 이용한 투명 발광장치 제조 방법 및 그에 따라 제조되는 투명 발광장치
DE102019106546A1 (de) * 2019-03-14 2020-09-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur herstellung von optoelektronischen halbleiterbauteilen und optoelektronisches halbleiterbauteil
CN112936734A (zh) * 2021-03-08 2021-06-11 东莞广华汽车饰件科技有限公司 一种灯板定位式胶膜汽车装饰件的注塑制造方法
DE102023107545A1 (de) 2023-03-24 2024-09-26 Marelli Automotive Lighting Reutlingen (Germany) GmbH Vorrichtung zum Ausleuchten eines Emblems oder eines Schriftzugs eines Kraftfahrzeugs, ausgeleuchtetes Emblem oder ausgeleuchteter Schriftzug und Anordnung umfassend ein Frontpanel eines Kraftfahrzeugs mit mehreren ausleuchtbaren Emblemen oder Schriftzügen und Vorrichtungen zum Ausleuchten der Embleme oder Schriftzüge

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1693969A (zh) * 2004-04-29 2005-11-09 Lg.菲利浦Lcd株式会社 发光二极管灯单元

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0553511A (ja) * 1991-08-28 1993-03-05 Toyoda Gosei Co Ltd カラーデイスプレイ装置
JPH10150227A (ja) * 1996-11-15 1998-06-02 Rohm Co Ltd チップ型発光素子
JPH10308535A (ja) * 1997-05-02 1998-11-17 Citizen Electron Co Ltd 表面実装型発光ダイオード及びその製造方法
JP3116085B2 (ja) * 1997-09-16 2000-12-11 東京農工大学長 半導体素子形成法
JP3746173B2 (ja) * 1999-03-12 2006-02-15 松下電器産業株式会社 面照明装置及びそれを用いた携帯端末装置
JP3774616B2 (ja) * 2000-06-29 2006-05-17 株式会社日立製作所 照明装置及び導光板の製造方法
US6614103B1 (en) * 2000-09-01 2003-09-02 General Electric Company Plastic packaging of LED arrays
JP4431925B2 (ja) * 2000-11-30 2010-03-17 信越半導体株式会社 発光素子の製造方法
JP2003011416A (ja) 2001-06-28 2003-01-15 Kyocera Corp 光プリンタヘッド
JP2003023183A (ja) * 2001-07-06 2003-01-24 Stanley Electric Co Ltd 面実装型ｌｅｄランプ
JP4067802B2 (ja) * 2001-09-18 2008-03-26 松下電器産業株式会社 照明装置
US20050073846A1 (en) * 2001-09-27 2005-04-07 Kenji Takine Lightemitting device and method of manufacturing the same
JP4108318B2 (ja) * 2001-11-13 2008-06-25 シチズン電子株式会社 発光装置
JP2003158301A (ja) 2001-11-22 2003-05-30 Citizen Electronics Co Ltd 発光ダイオード
JP3875914B2 (ja) 2002-05-14 2007-01-31 株式会社ケンウッド 電子機器および書き込み動作制御方法
WO2004017407A1 (de) * 2002-07-31 2004-02-26 Osram Opto Semiconductors Gmbh Oberflächenmontierbares halbleiterbauelement und verfahren zu dessen herstellung
US20040048033A1 (en) * 2002-09-11 2004-03-11 Osram Opto Semiconductors (Malaysia) Sdn. Bhd. Oled devices with improved encapsulation
BE1015302A3 (fr) * 2003-01-10 2005-01-11 Glaverbel Vitrage comportant des composants electroniques.
DE202004005799U1 (de) * 2003-04-29 2004-06-24 Potthoff, Marc Leuchtkörper
KR20050092300A (ko) * 2004-03-15 2005-09-21 삼성전기주식회사 고출력 발광 다이오드 패키지
US7055969B2 (en) * 2004-04-29 2006-06-06 Hewlett-Packard Development Company, L.P. Reflective optical assembly
US7997771B2 (en) * 2004-06-01 2011-08-16 3M Innovative Properties Company LED array systems
JP4395104B2 (ja) * 2004-11-08 2010-01-06 アルプス電気株式会社 照明装置
DE102004054822A1 (de) 2004-11-13 2006-05-18 Schefenacker Vision Systems Germany Gmbh Leuchte für Fahrzeuge, vorzugsweise für Kraftfahrzeuge
JP2006179572A (ja) * 2004-12-21 2006-07-06 Sharp Corp 発光ダイオード、バックライト装置および発光ダイオードの製造方法
JP5209177B2 (ja) * 2005-11-14 2013-06-12 新光電気工業株式会社 半導体装置および半導体装置の製造方法
KR100828891B1 (ko) * 2006-02-23 2008-05-09 엘지이노텍 주식회사 Ｌｅｄ 패키지
TWM302039U (en) * 2006-03-13 2006-12-01 Belletech Technology Co Ltd LED backlight module of display
US20070263408A1 (en) * 2006-05-09 2007-11-15 Chua Janet Bee Y Backlight module and method of making the module
JP5028562B2 (ja) * 2006-12-11 2012-09-19 株式会社ジャパンディスプレイイースト 照明装置及びこの照明装置を用いた表示装置
US9024349B2 (en) * 2007-01-22 2015-05-05 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1693969A (zh) * 2004-04-29 2005-11-09 Lg.菲利浦Lcd株式会社 发光二极管灯单元

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JP特开2000-331523A 2000.11.30 *
JP特开平5-53551A 1993.03.05 *

Also Published As

Publication number Publication date
WO2009077105A1 (de) 2009-06-25
KR20100115343A (ko) 2010-10-27
CN102016387A (zh) 2011-04-13
DE102007061261A1 (de) 2009-07-02
JP2011507291A (ja) 2011-03-03
US20090242903A1 (en) 2009-10-01
US20130277695A1 (en) 2013-10-24
TW200945508A (en) 2009-11-01
US8487322B2 (en) 2013-07-16
KR101556807B1 (ko) 2015-10-01
EP2235429A1 (de) 2010-10-06

Similar Documents

Publication Publication Date Title
CN102016387B (zh) 具有led管芯的发光体及其制造
CN101364585B (zh) 一种芯片封装结构及其制造方法
CN101807657B (zh) 发光器件封装和包括其的照明系统
CN210128319U (zh) 车辆用照明装置和车辆用灯具
CN102163682A (zh) 发光器件封装
CN101877382A (zh) 发光器件封装和包括该发光器件封装的照明系统
US8975651B2 (en) Light emitting diode package and method for manufacturing the same
CN102194981A (zh) 发光器件封装及具有发光器件封装的显示设备和发光系统
US20120228649A1 (en) Led module, method for manufacturing the same, and led channel letter including the same
US20100301365A1 (en) Light emitting diode module and manufacture method thereof
US10074779B2 (en) LED module, method for manufacturing the same, and LED channel letter including the same
KR101916137B1 (ko) 발광소자 패키지
CN202327707U (zh) 发光装置
KR101797755B1 (ko) 발광 소자 패키지 및 발광 소자 패키지용 몸체의 제조 방법
HK1152095A (en) Illuminant having led-dies and the production thereof
KR101876948B1 (ko) 조명 램프
CN110649009B (zh) 一种双模压成型的led产品及制作工艺
CN101556982B (zh) 发光二极管的封装结构
CN104791734A (zh) 带嵌入式线路的散热体及其制造方法、led模组及其制造方法
CN100347869C (zh) 发光芯片的封装结构
CN203733845U (zh) Led封装结构
CN103090210B (zh) 发光装置及其灯具的制作方法
KR102294340B1 (ko) 3d 프린팅을 이용한 배광제어용 led 조명장치 및 그 제조방법
KR101924014B1 (ko) 발광 소자 패키지 및 이를 구비한 조명 시스템
US20130242569A1 (en) Substrate for Carrying Light Emitting Diodes and Manufacturing Method Thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
REG Reference to a national code

Ref country code: HK

Ref legal event code: DE

Ref document number: 1152095

Country of ref document: HK

C14 Grant of patent or utility model
GR01 Patent grant
C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20160622

Address after: German Monheim

Patentee after: BAYER INTELLECTUAL PROPERTY GmbH

Address before: Germany Leverkusen

Patentee before: BAYER MATERIALSCIENCE AG

Effective date of registration: 20160622

Address after: Leverkusen, Germany

Patentee after: COVESTRO DEUTSCHLAND AG

Address before: German Monheim

Patentee before: BAYER INTELLECTUAL PROPERTY GmbH

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20141203

Termination date: 20161209

REG Reference to a national code

Ref country code: HK

Ref legal event code: WD

Ref document number: 1152095

Country of ref document: HK