JP4395104B2 - 照明装置 - Google Patents
照明装置 Download PDFInfo
- Publication number
- JP4395104B2 JP4395104B2 JP2005167129A JP2005167129A JP4395104B2 JP 4395104 B2 JP4395104 B2 JP 4395104B2 JP 2005167129 A JP2005167129 A JP 2005167129A JP 2005167129 A JP2005167129 A JP 2005167129A JP 4395104 B2 JP4395104 B2 JP 4395104B2
- Authority
- JP
- Japan
- Prior art keywords
- lens
- lighting device
- led
- film
- conductive portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005286 illumination Methods 0.000 claims description 40
- 238000003825 pressing Methods 0.000 claims description 6
- 238000003860 storage Methods 0.000 description 28
- 238000004519 manufacturing process Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 239000000758 substrate Substances 0.000 description 7
- -1 polyethylene terephthalate Polymers 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 235000010627 Phaseolus vulgaris Nutrition 0.000 description 1
- 244000046052 Phaseolus vulgaris Species 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
- B60Q3/00—Arrangement of lighting devices for vehicle interiors; Lighting devices specially adapted for vehicle interiors
- B60Q3/70—Arrangement of lighting devices for vehicle interiors; Lighting devices specially adapted for vehicle interiors characterised by the purpose
- B60Q3/74—Arrangement of lighting devices for vehicle interiors; Lighting devices specially adapted for vehicle interiors characterised by the purpose for overall compartment lighting; for overall compartment lighting in combination with specific lighting, e.g. room lamps with reading lamps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
- B60Q3/00—Arrangement of lighting devices for vehicle interiors; Lighting devices specially adapted for vehicle interiors
- B60Q3/70—Arrangement of lighting devices for vehicle interiors; Lighting devices specially adapted for vehicle interiors characterised by the purpose
- B60Q3/76—Arrangement of lighting devices for vehicle interiors; Lighting devices specially adapted for vehicle interiors characterised by the purpose for spotlighting, e.g. reading lamps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
- B60Q3/00—Arrangement of lighting devices for vehicle interiors; Lighting devices specially adapted for vehicle interiors
- B60Q3/80—Circuits; Control arrangements
- B60Q3/82—Switches specially adapted for vehicle interior lighting, e.g. switching by tilting the lens
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Arrangements Of Lighting Devices For Vehicle Interiors, Mounting And Supporting Thereof, Circuits Therefore (AREA)
- Led Device Packages (AREA)
- Push-Button Switches (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Description
2 レンズ
2a 収納部
3 LED
4 配線部材
4a 導電部
4b 絶縁層
4c 反射膜
5 導電性接着剤
11 フィルム基材
12 転写フィルム
13 金型キャビティ
21 外部接続コネクタ
31 反射膜
32 レンズ筐体
33 スイッチ
34 プリント配線板
35 フレキシブル配線板(接続手段)
41 ブラシ(接続手段)
Claims (1)
- 発光ダイオードと、前記発光ダイオードの収納部を有し、前記発光ダイオードから放射された照明光を拡散するレンズと、導電部を有し、当該導電部が前記発光ダイオードに電気的に接続された配線部材と、導電部を有し、当該導電部にスイッチが実装されたプリント配線板と、当該プリント配線板に取り付けられたレンズ筐体と、前記配線部材の導電部と前記プリント配線板の導電部とを電気的に接続する接続手段とを備え、前記レンズを前記レンズ筐体内に押圧操作可能に収納し、前記レンズの押圧操作により前記スイッチの切替操作を行うことを特徴とする照明装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005167129A JP4395104B2 (ja) | 2004-11-08 | 2005-06-07 | 照明装置 |
US11/251,449 US7521739B2 (en) | 2004-11-08 | 2005-10-14 | Illuminating device and method of fabricating the same |
EP05256486A EP1674787A3 (en) | 2004-11-08 | 2005-10-19 | Illuminating device comprising LEDs |
CN2005101162930A CN1773164B (zh) | 2004-11-08 | 2005-11-07 | 照明装置及其制造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004323805 | 2004-11-08 | ||
JP2005167129A JP4395104B2 (ja) | 2004-11-08 | 2005-06-07 | 照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006151357A JP2006151357A (ja) | 2006-06-15 |
JP4395104B2 true JP4395104B2 (ja) | 2010-01-06 |
Family
ID=36297288
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005167129A Expired - Fee Related JP4395104B2 (ja) | 2004-11-08 | 2005-06-07 | 照明装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7521739B2 (ja) |
EP (1) | EP1674787A3 (ja) |
JP (1) | JP4395104B2 (ja) |
CN (1) | CN1773164B (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007061261A1 (de) * | 2007-12-19 | 2009-07-02 | Bayer Materialscience Ag | Leuchtkörper mit LED-DIEs und deren Herstellung |
JP5208282B2 (ja) * | 2009-10-15 | 2013-06-12 | パナソニック株式会社 | 表示パネル装置、表示装置および表示パネル装置の製造方法 |
JP2013098927A (ja) * | 2011-11-04 | 2013-05-20 | Ricoh Co Ltd | コイルアンテナ、コイルアンテナ実装体、コイルアンテナの製造方法及びコイルアンテナ実装体の製造方法 |
DE102012204732A1 (de) * | 2012-03-23 | 2013-09-26 | Ford-Werke Gmbh | Ladeboden sowie Profilelement für einen Ladeboden |
WO2013168253A1 (ja) * | 2012-05-09 | 2013-11-14 | テイ・エス テック株式会社 | 発光装置 |
CN102721021B (zh) * | 2012-05-30 | 2014-08-06 | 广州菁彩光电科技有限公司 | 自动化生产的导热散热一体化led灯具生产方法 |
DE102012212963B4 (de) | 2012-07-24 | 2022-09-15 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils |
JP5680036B2 (ja) * | 2012-08-29 | 2015-03-04 | 株式会社テーアンテー | 車載用室内灯ユニット |
TWM481346U (zh) * | 2013-12-11 | 2014-07-01 | Delta Electronics Inc | 多燈源裝置 |
JP6636233B2 (ja) * | 2014-04-07 | 2020-01-29 | 株式会社小糸製作所 | 車両用灯具 |
FR3026692B1 (fr) | 2014-10-02 | 2017-12-01 | Valeo Vision | Dispositif d'eclairage d'un habitacle de vehicule automobile |
CN109424925A (zh) * | 2017-08-23 | 2019-03-05 | 株式会社小糸制作所 | 车辆用灯具 |
JP6717400B2 (ja) | 2018-08-03 | 2020-07-01 | 日亜化学工業株式会社 | 発光モジュール |
CN110794614B (zh) * | 2018-08-03 | 2022-10-25 | 日亚化学工业株式会社 | 发光模块 |
JP6680349B1 (ja) | 2018-12-28 | 2020-04-15 | 日亜化学工業株式会社 | 発光モジュール |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5321294A (en) * | 1992-08-31 | 1994-06-14 | Matsushita Electric Industrial Co., Ltd. | Shift register having optically bistable elements coupled by an optical waveguide layer |
JP3228864B2 (ja) | 1995-12-13 | 2001-11-12 | アルプス電気株式会社 | 発光装置およびその製造方法 |
US6388254B1 (en) * | 1998-09-10 | 2002-05-14 | Knox Company | Handheld heat detection device |
JP2000269551A (ja) * | 1999-03-18 | 2000-09-29 | Rohm Co Ltd | チップ型発光装置 |
JP3896743B2 (ja) | 1999-11-30 | 2007-03-22 | スズキ株式会社 | 車両用標識灯装置 |
CN2426640Y (zh) * | 2000-05-19 | 2001-04-11 | 张开开 | 定向光高效发光二极管 |
JP3977004B2 (ja) | 2000-10-13 | 2007-09-19 | 株式会社小糸製作所 | 室内照明灯 |
JP2002311449A (ja) * | 2001-02-06 | 2002-10-23 | Seiko Epson Corp | 液晶装置、液晶装置の製造方法及び電子機器 |
CN1396667A (zh) * | 2001-07-16 | 2003-02-12 | 诠兴开发科技股份有限公司 | 发光二极管的封装 |
US6799875B2 (en) | 2002-09-20 | 2004-10-05 | Innotec Corporation | Vehicle interior light |
BE1015302A3 (fr) | 2003-01-10 | 2005-01-11 | Glaverbel | Vitrage comportant des composants electroniques. |
US20040137656A1 (en) | 2003-01-15 | 2004-07-15 | Gurbir Singh | Low thermal resistance light emitting diode package and a method of making the same |
US7170151B2 (en) * | 2003-01-16 | 2007-01-30 | Philips Lumileds Lighting Company, Llc | Accurate alignment of an LED assembly |
-
2005
- 2005-06-07 JP JP2005167129A patent/JP4395104B2/ja not_active Expired - Fee Related
- 2005-10-14 US US11/251,449 patent/US7521739B2/en not_active Expired - Fee Related
- 2005-10-19 EP EP05256486A patent/EP1674787A3/en not_active Withdrawn
- 2005-11-07 CN CN2005101162930A patent/CN1773164B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1773164A (zh) | 2006-05-17 |
EP1674787A3 (en) | 2007-10-03 |
US7521739B2 (en) | 2009-04-21 |
CN1773164B (zh) | 2010-05-05 |
JP2006151357A (ja) | 2006-06-15 |
EP1674787A2 (en) | 2006-06-28 |
US20060097291A1 (en) | 2006-05-11 |
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