FR2920253B3 - Structure de conditionnement d'une diode electroluminescente - Google Patents
Structure de conditionnement d'une diode electroluminescenteInfo
- Publication number
- FR2920253B3 FR2920253B3 FR0803973A FR0803973A FR2920253B3 FR 2920253 B3 FR2920253 B3 FR 2920253B3 FR 0803973 A FR0803973 A FR 0803973A FR 0803973 A FR0803973 A FR 0803973A FR 2920253 B3 FR2920253 B3 FR 2920253B3
- Authority
- FR
- France
- Prior art keywords
- chip
- mold
- circuit board
- transparent material
- electroluminescent diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/34—Moulds having venting means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW96213912U TWM329857U (en) | 2007-08-21 | 2007-08-21 | LED package structure |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2920253A3 FR2920253A3 (fr) | 2009-02-27 |
FR2920253B3 true FR2920253B3 (fr) | 2009-07-24 |
Family
ID=39718048
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0803973A Expired - Fee Related FR2920253B3 (fr) | 2007-08-21 | 2008-07-11 | Structure de conditionnement d'une diode electroluminescente |
Country Status (4)
Country | Link |
---|---|
DE (1) | DE202008009435U1 (fr) |
FR (1) | FR2920253B3 (fr) |
GB (1) | GB2452121A (fr) |
TW (1) | TWM329857U (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013510446A (ja) * | 2009-11-05 | 2013-03-21 | ルミニット エルエルシー | カプセル化高輝度ledチップ用のミクロ構造の製造方法 |
JP2013157408A (ja) * | 2012-01-27 | 2013-08-15 | Nitto Denko Corp | 発光ダイオード装置およびその製造方法 |
CN108465613A (zh) * | 2018-04-27 | 2018-08-31 | 延锋伟世通汽车电子有限公司 | 去除电路板和ic芯片之间气泡的电路板涂胶系统及方法 |
CN114347395B (zh) * | 2022-03-17 | 2022-06-03 | 威海嘉瑞光电科技股份有限公司 | 半导体光学器件的封装方法及其使用的装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3193194B2 (ja) * | 1993-07-09 | 2001-07-30 | 三菱電線工業株式会社 | 基板に実装されたledチップにレンズ被覆層をモールドする方法およびそのモールド用基板構造 |
JPH08111132A (ja) * | 1994-10-12 | 1996-04-30 | Japan Aviation Electron Ind Ltd | 照光式キートップ |
JP2829567B2 (ja) * | 1994-11-21 | 1998-11-25 | スタンレー電気株式会社 | チップマウント型led |
JP2000049386A (ja) * | 1998-07-30 | 2000-02-18 | Stanley Electric Co Ltd | 面実装部品の製造方法 |
KR200181152Y1 (ko) * | 1999-12-17 | 2000-05-15 | 윤순관 | 전자회로기판상에 휘메일 타입의 리드를 형성한 발광다이오드 램프 |
JP3876250B2 (ja) * | 2003-06-24 | 2007-01-31 | スタンレー電気株式会社 | 表面実装型半導体電子部品および製造方法 |
TWI231609B (en) * | 2003-09-01 | 2005-04-21 | Solidlite Corp | High heat-conductive PCB type surface mounted light emitting diode |
KR100638611B1 (ko) * | 2004-08-12 | 2006-10-26 | 삼성전기주식회사 | 다중 렌즈 발광 다이오드 |
TW200701507A (en) * | 2005-06-24 | 2007-01-01 | Epitech Technology Corp | Light-emitting diode |
-
2007
- 2007-08-21 TW TW96213912U patent/TWM329857U/zh not_active IP Right Cessation
-
2008
- 2008-07-07 GB GB0812350A patent/GB2452121A/en not_active Withdrawn
- 2008-07-11 FR FR0803973A patent/FR2920253B3/fr not_active Expired - Fee Related
- 2008-07-14 DE DE200820009435 patent/DE202008009435U1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
GB0812350D0 (en) | 2008-08-13 |
FR2920253A3 (fr) | 2009-02-27 |
TWM329857U (en) | 2008-04-01 |
GB2452121A (en) | 2009-02-25 |
DE202008009435U1 (de) | 2008-09-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2009041767A3 (fr) | Boîtier de diode électroluminescente et unité de rétro-éclairage utilisant un tel boîtier | |
TW200739969A (en) | Light emitting diode package | |
TW200637031A (en) | Compact light emitting device package with enhanced heat dissipation and method for making the package | |
CN105448939A (zh) | 图像模块封装及其制作方法 | |
WO2008112128A3 (fr) | Diode à émission de lumière pour environnements hostiles | |
WO2013148573A8 (fr) | Dispositifs à diodes électroluminescentes (del) à base de céramique, composants et procédés | |
EP2455991A4 (fr) | Ensemble puce à del, boîtier de del et procédé de fabrication de boîtier de del | |
TW200618326A (en) | Package structure of a surface mount device light emitting diode | |
TW200733420A (en) | Light emitting diode package and fabricating method thereof | |
TW200746410A (en) | Optoelectronic headlight, its manufacturing method and light-emitting diode chip | |
TW200640044A (en) | Semiconductor light emitting device and semiconductor light emitting unit | |
DE602005012259D1 (de) | Gehäuse mit lichtemittierender Hochleistungsdiode und Reflexionslinse, sowie zugehöriges Herstellungsverfahren | |
TW200735167A (en) | Method of assembling semiconductor devices with LEDs | |
MY159521A (en) | Resin-sealed light emitting device and its manufacturing method | |
TW200623468A (en) | Encapsulated light emitting diodes and methods of making | |
MY149770A (en) | Semiconductor die package including embedded flip chip | |
EP2463923A3 (fr) | Conditionnement de diode électroluminescente et procédé de fabrication correspondant | |
EP2355191A3 (fr) | Emballage de dispositif électroluminescent et système d'éclairage | |
EP2398051A3 (fr) | Structure de paquets DEL | |
FR2920253B3 (fr) | Structure de conditionnement d'une diode electroluminescente | |
EP2533312A3 (fr) | Boîtier pour diode électroluminescente | |
TW200744233A (en) | Light emitting diode(LED) package structure and a method for packaging light emitting diodes | |
USD619977S1 (en) | Light emitting diode | |
US9041022B2 (en) | Light emitting diode package and method for manufacturing the same | |
EP2211394A3 (fr) | Structure de boîtier pour diode électroluminescente |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TQ | Partial transmission of property | ||
ST | Notification of lapse |
Effective date: 20110331 |