JP2011198892A - 基板洗浄処理装置 - Google Patents

基板洗浄処理装置 Download PDF

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Publication number
JP2011198892A
JP2011198892A JP2010062152A JP2010062152A JP2011198892A JP 2011198892 A JP2011198892 A JP 2011198892A JP 2010062152 A JP2010062152 A JP 2010062152A JP 2010062152 A JP2010062152 A JP 2010062152A JP 2011198892 A JP2011198892 A JP 2011198892A
Authority
JP
Japan
Prior art keywords
substrate
water
nozzle
cleaning
washing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010062152A
Other languages
English (en)
Japanese (ja)
Inventor
Takuto Kawakami
拓人 川上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Priority to JP2010062152A priority Critical patent/JP2011198892A/ja
Priority to CN201010522628XA priority patent/CN102194657B/zh
Priority to KR1020100110982A priority patent/KR101073340B1/ko
Priority to TW100100088A priority patent/TWI428969B/zh
Publication of JP2011198892A publication Critical patent/JP2011198892A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
JP2010062152A 2010-03-18 2010-03-18 基板洗浄処理装置 Pending JP2011198892A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010062152A JP2011198892A (ja) 2010-03-18 2010-03-18 基板洗浄処理装置
CN201010522628XA CN102194657B (zh) 2010-03-18 2010-10-26 基板清洗处理装置
KR1020100110982A KR101073340B1 (ko) 2010-03-18 2010-11-09 기판 세정 처리 장치
TW100100088A TWI428969B (zh) 2010-03-18 2011-01-03 Substrate cleaning treatment device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010062152A JP2011198892A (ja) 2010-03-18 2010-03-18 基板洗浄処理装置

Publications (1)

Publication Number Publication Date
JP2011198892A true JP2011198892A (ja) 2011-10-06

Family

ID=44602521

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010062152A Pending JP2011198892A (ja) 2010-03-18 2010-03-18 基板洗浄処理装置

Country Status (4)

Country Link
JP (1) JP2011198892A (zh)
KR (1) KR101073340B1 (zh)
CN (1) CN102194657B (zh)
TW (1) TWI428969B (zh)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103177986A (zh) * 2011-12-22 2013-06-26 大日本网屏制造株式会社 涂布装置
WO2018216612A1 (ja) * 2017-05-26 2018-11-29 シャープ株式会社 基板処理装置
JP2019013897A (ja) * 2017-07-10 2019-01-31 パナソニックＩｐマネジメント株式会社 洗浄方法及び洗浄装置
CN109786290A (zh) * 2017-11-14 2019-05-21 东京毅力科创株式会社 基板处理装置的清洗装置和清洗方法
CN111463152A (zh) * 2020-04-17 2020-07-28 重庆芯洁科技有限公司 半导体衬底的高压水洗设备及其使用方法
CN112992731A (zh) * 2021-02-05 2021-06-18 昆山基侑电子科技有限公司 一种晶圆往复循环清洗设备
JP7451781B2 (ja) 2022-03-18 2024-03-18 芝浦メカトロニクス株式会社 基板処理装置

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103065994B (zh) * 2011-10-19 2015-01-21 中芯国际集成电路制造(上海)有限公司 清洗硅片的装置及使用该装置清洗硅片的方法
DE102011118441B8 (de) * 2011-11-12 2018-10-04 RENA Technologies GmbH Anlage und Verfahren zur Behandlung von flachen Substraten
JP2015023138A (ja) * 2013-07-18 2015-02-02 株式会社ディスコ スピンナ洗浄装置
KR102250366B1 (ko) * 2014-05-28 2021-05-12 세메스 주식회사 기판 처리 장치 및 방법
KR102239520B1 (ko) * 2014-05-30 2021-04-14 세메스 주식회사 기판 처리 장치 및 방법
CN104588351A (zh) * 2014-12-02 2015-05-06 深圳市华星光电技术有限公司 基板清洗装置和使用其清洗基板的方法
KR20160125585A (ko) * 2015-04-21 2016-11-01 삼성전자주식회사 기판 처리 장치 및 기판 처리 방법
CN105618414A (zh) * 2016-03-15 2016-06-01 李赵和 一种半导体硅片清洗机双头清洗枪
JP2018065109A (ja) * 2016-10-20 2018-04-26 東京応化工業株式会社 洗浄装置および洗浄方法
CN108620239A (zh) * 2017-03-24 2018-10-09 北京淘氪科技有限公司 喷嘴及应用其的自清洗免维护静电净化系统
CN107224879A (zh) * 2017-06-30 2017-10-03 河南新投环保科技股份有限公司 一种平板膜擦洗装置
CN107552522A (zh) * 2017-09-05 2018-01-09 深圳市华星光电技术有限公司 一种湿法剥离机的水洗装置及水洗方法
CN108325900B (zh) * 2017-09-19 2021-02-02 福建晟哲自动化科技有限公司 一种液晶面板清洗设备
CN107755346B (zh) * 2017-10-31 2024-02-27 上海格尔恒精材料科技有限公司 一种高效的工件表面清洗系统及其清洗方法
CN108526097A (zh) * 2018-04-28 2018-09-14 武汉华星光电技术有限公司 基板清洗设备
CN110052449B (zh) * 2019-05-24 2024-07-05 深圳市山木电子设备有限公司 一种吸嘴清洗机
TWI811885B (zh) * 2021-12-10 2023-08-11 力晶積成電子製造股份有限公司 清洗裝置與清洗方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3552187B2 (ja) * 1997-04-07 2004-08-11 大日本スクリーン製造株式会社 基板処理装置及び方法
JP3695917B2 (ja) * 1997-11-27 2005-09-14 大日本スクリーン製造株式会社 基板処理装置

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103177986A (zh) * 2011-12-22 2013-06-26 大日本网屏制造株式会社 涂布装置
WO2018216612A1 (ja) * 2017-05-26 2018-11-29 シャープ株式会社 基板処理装置
JP2019013897A (ja) * 2017-07-10 2019-01-31 パナソニックＩｐマネジメント株式会社 洗浄方法及び洗浄装置
CN109786290A (zh) * 2017-11-14 2019-05-21 东京毅力科创株式会社 基板处理装置的清洗装置和清洗方法
CN109786290B (zh) * 2017-11-14 2024-03-12 东京毅力科创株式会社 基板处理装置的清洗装置和清洗方法
CN111463152A (zh) * 2020-04-17 2020-07-28 重庆芯洁科技有限公司 半导体衬底的高压水洗设备及其使用方法
CN111463152B (zh) * 2020-04-17 2023-03-14 重庆芯洁科技有限公司 半导体衬底的高压水洗设备及其使用方法
CN112992731A (zh) * 2021-02-05 2021-06-18 昆山基侑电子科技有限公司 一种晶圆往复循环清洗设备
JP7451781B2 (ja) 2022-03-18 2024-03-18 芝浦メカトロニクス株式会社 基板処理装置

Also Published As

Publication number Publication date
KR20110105327A (ko) 2011-09-26
CN102194657A (zh) 2011-09-21
TW201135819A (en) 2011-10-16
CN102194657B (zh) 2013-06-05
TWI428969B (zh) 2014-03-01
KR101073340B1 (ko) 2011-10-14

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