DE102011118441B8 - Anlage und Verfahren zur Behandlung von flachen Substraten - Google Patents

Anlage und Verfahren zur Behandlung von flachen Substraten Download PDF

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Publication number
DE102011118441B8
DE102011118441B8 DE102011118441.8A DE102011118441A DE102011118441B8 DE 102011118441 B8 DE102011118441 B8 DE 102011118441B8 DE 102011118441 A DE102011118441 A DE 102011118441A DE 102011118441 B8 DE102011118441 B8 DE 102011118441B8
Authority
DE
Germany
Prior art keywords
plant
treatment
flat substrates
substrates
flat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102011118441.8A
Other languages
English (en)
Other versions
DE102011118441B4 (de
DE102011118441A1 (de
Inventor
Enrico Hauchwitz
Dietmar Bernauer
Florian Kaltenbach
Sebastian Patzig-Klein
Dirk Bareis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RENA Technologies GmbH
Original Assignee
RENA Technologies GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RENA Technologies GmbH filed Critical RENA Technologies GmbH
Priority to DE102011118441.8A priority Critical patent/DE102011118441B8/de
Priority to TW101141010A priority patent/TWI536444B/zh
Priority to CN2012104478583A priority patent/CN103107079A/zh
Priority to KR1020120126492A priority patent/KR102174364B1/ko
Publication of DE102011118441A1 publication Critical patent/DE102011118441A1/de
Publication of DE102011118441B4 publication Critical patent/DE102011118441B4/de
Application granted granted Critical
Publication of DE102011118441B8 publication Critical patent/DE102011118441B8/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
DE102011118441.8A 2011-11-12 2011-11-12 Anlage und Verfahren zur Behandlung von flachen Substraten Active DE102011118441B8 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE102011118441.8A DE102011118441B8 (de) 2011-11-12 2011-11-12 Anlage und Verfahren zur Behandlung von flachen Substraten
TW101141010A TWI536444B (zh) 2011-11-12 2012-11-05 Apparatus and method for processing flat substrates
CN2012104478583A CN103107079A (zh) 2011-11-12 2012-11-09 用于处理平的衬底的设备和方法
KR1020120126492A KR102174364B1 (ko) 2011-11-12 2012-11-09 평면형 기판을 처리하기 위한 장치 및 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102011118441.8A DE102011118441B8 (de) 2011-11-12 2011-11-12 Anlage und Verfahren zur Behandlung von flachen Substraten

Publications (3)

Publication Number Publication Date
DE102011118441A1 DE102011118441A1 (de) 2013-05-16
DE102011118441B4 DE102011118441B4 (de) 2018-08-02
DE102011118441B8 true DE102011118441B8 (de) 2018-10-04

Family

ID=48145092

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102011118441.8A Active DE102011118441B8 (de) 2011-11-12 2011-11-12 Anlage und Verfahren zur Behandlung von flachen Substraten

Country Status (4)

Country Link
KR (1) KR102174364B1 (de)
CN (1) CN103107079A (de)
DE (1) DE102011118441B8 (de)
TW (1) TWI536444B (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101538431B1 (ko) * 2013-12-11 2015-07-22 주식회사 엠엠테크 글라스 강화 처리 장치
TWI809115B (zh) 2018-06-04 2023-07-21 德商雷納科技有限公司 物品處理程序及執行程序之設備

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005012093A (ja) * 2003-06-20 2005-01-13 Sumitomo Precision Prod Co Ltd エッチング装置
WO2005093788A1 (de) * 2004-03-22 2005-10-06 Rena Sondermaschinen Gmbh Verfahren zur behandlung von substratoberflächen
DE102005062528A1 (de) * 2005-12-16 2007-06-21 Gebr. Schmid Gmbh & Co. Vorrichtung und Verfahren zur Oberflächenbehandlung von Substraten
DE102007054090A1 (de) * 2007-11-13 2009-05-20 Rena Sondermaschinen Gmbh Vorrichtung und Verfahren zur einseitigen Nassbehandlung von Gut

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4776380B2 (ja) * 2006-01-20 2011-09-21 株式会社東芝 処理装置及び処理方法
JP2011100872A (ja) * 2009-11-06 2011-05-19 Mitsubishi Electric Corp 基板表面処理装置、基板処理方法および光起電力装置の製造方法
JP2011198892A (ja) * 2010-03-18 2011-10-06 Dainippon Screen Mfg Co Ltd 基板洗浄処理装置
JP6621273B2 (ja) * 2015-02-23 2019-12-18 株式会社マキタ 送風装置および当該送風装置が装着される衣服

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005012093A (ja) * 2003-06-20 2005-01-13 Sumitomo Precision Prod Co Ltd エッチング装置
WO2005093788A1 (de) * 2004-03-22 2005-10-06 Rena Sondermaschinen Gmbh Verfahren zur behandlung von substratoberflächen
DE102005062528A1 (de) * 2005-12-16 2007-06-21 Gebr. Schmid Gmbh & Co. Vorrichtung und Verfahren zur Oberflächenbehandlung von Substraten
DE102007054090A1 (de) * 2007-11-13 2009-05-20 Rena Sondermaschinen Gmbh Vorrichtung und Verfahren zur einseitigen Nassbehandlung von Gut

Also Published As

Publication number Publication date
KR102174364B1 (ko) 2020-11-05
DE102011118441B4 (de) 2018-08-02
TW201347029A (zh) 2013-11-16
KR20130053372A (ko) 2013-05-23
TWI536444B (zh) 2016-06-01
CN103107079A (zh) 2013-05-15
DE102011118441A1 (de) 2013-05-16

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R012 Request for examination validly filed
R016 Response to examination communication
R016 Response to examination communication
R081 Change of applicant/patentee

Owner name: RENA TECHNOLOGIES GMBH, DE

Free format text: FORMER OWNER: RENA GMBH, 78148 GUETENBACH, DE

R082 Change of representative

Representative=s name: JOACHIM STUERKEN PATENTANWALTSGESELLSCHAFT MBH, DE

Representative=s name: OSTERTAG & PARTNER, PATENTANWAELTE MBB, DE

R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0021304000

Ipc: H01L0021306000

R018 Grant decision by examination section/examining division
R082 Change of representative

Representative=s name: OSTERTAG & PARTNER, PATENTANWAELTE MBB, DE

R020 Patent grant now final