JP2011101010A - パワー半導体モジュール - Google Patents
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Abstract
【解決手段】パワー半導体モジュールであって、少なくとも1つのパワー半導体を備えた基板が第1の接触領域10と第2の接触領域11とを有し、第1の接触要素3を表面に備えた第1の負荷接続要素1が第1の接触領域10に支持され、第2の接触要素4を表面に備えた第2の負荷接続要素2が第2の接触領域11に支持され、少なくとも1つのバネ要素19が、接触要素3、4と接触領域10、11との間に圧力接触を生じさせるために設けられるパワー半導体モジュールに関する。構造のサイズを小さくするために、接触要素3、4と接触領域10、11との間における圧力接触が、バネ要素19と負荷接続要素1、2の1つとの間に配置された少なくとも1つの電気構成要素12によってもたらされる。
【選択図】図2
Description
2 第2の負荷接続要素
3 第1の接触フット
4 第2の接触フット
5 絶縁層
6 穿孔
7 基板
8 パワー半導体
9 ボンディングワイヤ
10 第1の接触領域
11 第2の接触領域
12 電解コンデンサ
13 第1の接続部
14 第2の接続部
15 ロウワーハウジング要素
16 アッパーハウジング要素
17 円筒状のカットアウト部
18 カバー
19 発泡要素
20 ねじ穴
Claims (11)
- 少なくとも1つのパワー半導体(8)を備えた基板(7)が第1の接触領域(10)と第2の接触領域(11)とを有するパワー半導体モジュールであって、
表面に複数の第1の接触要素(3)を備えた第1の負荷接続要素(1)が前記第1の接触領域(10)に支持され、表面に複数の第2の接触要素(4)を備えた第2の負荷接続要素(2)が前記第2の接触領域(11)に支持されており、
前記接触要素(3、4)と前記接触領域(10、11)との間に圧力接触を生じさせるために少なくとも1つのバネ要素(19)を設けている、パワー半導体モジュールにおいて、
前記接触要素(3、4)と前記接触領域(10、11)の間での前記圧力接触が、前記バネ要素(19)と前記負荷接続要素(1、2)の1つとの間に配置された少なくとも1つの電気構成要素(12)によってもたらされることを特徴とする、パワー半導体モジュール。 - 前記電気構成要素(12)がコンデンサ、好ましくは電解コンデンサである、請求項1に記載のパワー半導体モジュール。
- 前記コンデンサを受容するアッパーハウジング要素(16)が、前記アッパーハウジング要素(16)に対応するロウワーハウジング要素(15)に接続され、前記ロウワーハウジング要素が前記基板(7)を受容するか又は前記基板(7)によって形成されている、請求項1又は2に記載のパワー半導体モジュール。
- 前記アッパーハウジング要素(16)が、前記コンデンサを実質的に確実ロック式に受容するための、少なくとも1つの円筒状のカットアウト部を有する、請求項1〜3のいずれか一項に記載のパワー半導体モジュール。
- 前記バネ要素(19)が、前記カットアウト部(17)のカバー(18)と前記カットアウト部(17)に受容された前記コンデンサとの間に設けられている、請求項1〜4のいずれか一項に記載のパワー半導体モジュール。
- 前記バネ要素(19)が、永続的に弾性の発泡要素から作り出されるか又はバネ舌部の形状に形成されている、請求項1〜5のいずれか一項に記載のパワー半導体モジュール。
- 前記バネ要素(19)が前記カットアウト部(17)のカバー(18)に一体成形されている、請求項1〜6のいずれか一項に記載のパワー半導体モジュール。
- 前記コンデンサから延びる第1の接続部(13)が前記第1の接触要素(3)の1つに接続され、前記コンデンサから延びる第2の接続部(14)が前記第2の接触要素(4)の1つに接続されている、請求項1〜7のいずれか一項に記載のパワー半導体モジュール。
- 前記第2の負荷接続要素(2)が少なくとも1つの穿孔(6)を有し、この少なくとも1つの穿孔(6)を介して、前記第1の接触要素(3)の1つ及び/又は第1の接続部(13)が導かれている、請求項1〜8のいずれか一項に記載のパワー半導体モジュール。
- 前記接続部(13、14)が前記接触要素(3、4)にロウ付けされ、又は溶接されている、請求項1〜9のいずれか一項に記載のパワー半導体モジュール。
- 前記接続部(13、14)が前記接触領域(10、11)と前記接触要素(3、4)との間に締め付けて保持されている、請求項1〜10のいずれか一項に記載のパワー半導体モジュール。
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Application Number | Priority Date | Filing Date | Title |
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DE102009046403.4 | 2009-11-04 | ||
DE102009046403.4A DE102009046403B4 (de) | 2009-11-04 | 2009-11-04 | Leistungshalbleitermodul in Druckkontakttechnik |
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JP2011101010A true JP2011101010A (ja) | 2011-05-19 |
JP2011101010A5 JP2011101010A5 (ja) | 2013-10-03 |
JP5695884B2 JP5695884B2 (ja) | 2015-04-08 |
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JP2010246204A Expired - Fee Related JP5695884B2 (ja) | 2009-11-04 | 2010-11-02 | パワー半導体モジュール |
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US (1) | US8427836B2 (ja) |
EP (1) | EP2320459A2 (ja) |
JP (1) | JP5695884B2 (ja) |
KR (1) | KR101688663B1 (ja) |
CN (1) | CN102097391B (ja) |
DE (1) | DE102009046403B4 (ja) |
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CN107611110A (zh) * | 2016-07-12 | 2018-01-19 | 赛米控电子股份有限公司 | 功率半导体设备 |
WO2021166520A1 (ja) * | 2020-02-21 | 2021-08-26 | パナソニックIpマネジメント株式会社 | 電子部品ホルダ及び電気機器 |
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JP5932704B2 (ja) * | 2013-04-04 | 2016-06-08 | 株式会社日本自動車部品総合研究所 | 電力変換装置 |
DE102013104950B3 (de) * | 2013-05-14 | 2014-04-30 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul und Anordnung hiermit |
DE102013209431B4 (de) | 2013-05-22 | 2018-04-05 | Siemens Aktiengesellschaft | Leistungshalbleitermodul |
DE102014101024B3 (de) * | 2014-01-29 | 2014-12-04 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitereinrichtung |
DE102014116058B3 (de) * | 2014-11-04 | 2015-12-17 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitereinrichtung |
DE102015115140B4 (de) * | 2015-09-09 | 2023-12-21 | Infineon Technologies Ag | Stromrichteranordnung mit verbesserter Befestigung |
US10555425B2 (en) * | 2016-02-18 | 2020-02-04 | Magna Closures Inc. | Enclosure assembly for an electronic controller having an over-molded part to protect electronic components |
DE102016105783B4 (de) * | 2016-03-30 | 2019-05-16 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitereinrichtung |
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- 2010-10-29 KR KR1020100106789A patent/KR101688663B1/ko active IP Right Grant
- 2010-11-02 JP JP2010246204A patent/JP5695884B2/ja not_active Expired - Fee Related
- 2010-11-03 US US12/939,004 patent/US8427836B2/en not_active Expired - Fee Related
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CN107611110A (zh) * | 2016-07-12 | 2018-01-19 | 赛米控电子股份有限公司 | 功率半导体设备 |
CN107611110B (zh) * | 2016-07-12 | 2023-05-09 | 赛米控电子股份有限公司 | 功率半导体设备 |
WO2021166520A1 (ja) * | 2020-02-21 | 2021-08-26 | パナソニックIpマネジメント株式会社 | 電子部品ホルダ及び電気機器 |
Also Published As
Publication number | Publication date |
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DE102009046403B4 (de) | 2015-05-28 |
US20110103024A1 (en) | 2011-05-05 |
KR20110049690A (ko) | 2011-05-12 |
CN102097391B (zh) | 2014-12-10 |
EP2320459A2 (de) | 2011-05-11 |
KR101688663B1 (ko) | 2016-12-21 |
JP5695884B2 (ja) | 2015-04-08 |
CN102097391A (zh) | 2011-06-15 |
US8427836B2 (en) | 2013-04-23 |
DE102009046403A1 (de) | 2011-05-05 |
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