CN107611110B - 功率半导体设备 - Google Patents
功率半导体设备 Download PDFInfo
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- CN107611110B CN107611110B CN201710565656.1A CN201710565656A CN107611110B CN 107611110 B CN107611110 B CN 107611110B CN 201710565656 A CN201710565656 A CN 201710565656A CN 107611110 B CN107611110 B CN 107611110B
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Abstract
本发明涉及功率半导体设备。该功能半导体设备包括基底、功率半导体组件、导电DC电压母线系统以及与该DC电压母线系统导电连接的电容器,其中该功率半导体设备具有电容器固定装置,该电容器固定装置包括收纳设备,其中从DC电压母线系统,导电母线系统端子元件在基底的方向上延伸,将实质性地键合到电容器固定装置上的且由弹性体形成的至少一个弹性第一变形元件布置在面向DC电压母线系统的电容器固定装置的一侧上,功率半导体设备具体实现为:电容器固定装置通过至少一个第一变形元件在基底的方向上挤压DC电压母线系统并且从而将母线系统端子元件压靠在基底的导电接触区域,使得母线系统端子元件与基底的所述接触区域导电性地压力接触。
Description
技术领域
本发明涉及一种功率半导体设备。
背景技术
DE10 2009 046 403 B4公开了一种功率半导体设备,该功率半导体设备包括基底,并且包括被布置在基底上并与基底导电连接的功率半导体组件,该功率半导体设备包括导电DC电压母线系统并且包括与该DC电压母线系统导电连接的电容器,其中,该功率半导体设备具有用于固定电容器的电容器固定装置,该电容器固定装置具有用于收纳电容器的收纳设备,在该收纳设备中布置有电容器,其中与DC电压母线系统导电连接的导电母线系统端子元件在朝着基底的方向上从DC电压母线系统延伸,其中,借助于布置在电容器固定装置的阻隔元件与电容器之间的且实质上未键合到电容器固定装置上的泡沫元件,经由电容器将该母线系统端子元件压靠在基底的导电接触区域,使得母线系统端子元件与基底的所述接触区域导电性地压力接触。
因为经由电容器在母线系统端子元件上引入了压力,因此前者受到严重的机械负载,这可导致对电容器的损坏或破坏。此外,在制造功率半导体设备期间,必须将泡沫元件放置在阻隔元件与电容器之间,这是耗时且容易出错的,因为存在忘记插入至少一个泡沫元件的风险。
发明内容
本发明的目的是提供一种高效可靠的功率半导体设备,其中该功率半导体设备的电容器受到很小的机械负载。
该目的是通过一种功能半导体设备实现的,该功能半导体设备包括基底并且包括布置在基底上并与基底导电连接的功率半导体组件,该功能半导体设备包括导电DC电压母线系统并且包括与该DC电压母线系统导电连接的电容器,其中该功率半导体设备具有用于固定电容器的电容器固定装置,该电容器固定装置包括用于收纳电容器的收纳设备,在该收纳设备中布置电容器的至少一部分,其中,导电连接到此的导电母线系统端子元件在基底的方向上从DC电压母线系统延伸,其中,将实质性地键合到电容器固定装置上并且由弹性体形成的至少一个弹性第一变形元件布置在面向DC电压母线系统的电容器固定装置的一侧上,其中,功率半导体设备以如下方式具体实现:电容器固定装置通过至少一个第一变形元件在基底的方向上挤压DC电压母线系统并且从而将母线系统端子元件压靠在基底的导电接触区域,使得母线系统端子元件与所述基底的接触区域导电性地压力接触。
本发明的有利实施例从从属权利要求是显而易见的。
被证明有利的是,如果至少一个第一变形元件的一部分被布置在电容器固定装置的切口中,所述切口被指配给相应的第一变形元件,因为至少一个第一变形元件以能够实现非常高的机械负载的方式与电容器固定装置相连。
被证明有利的是,如果功率半导体设备具有AC负载电流传导元件,其中电容器固定装置具有压力元件,其中实质性地键合到压力元件并且由弹性体形成的弹性第二变形元件被布置在压力元件的面向AC负载电流传导元件的一侧上,其中功率半导体设备以如下方式具体实现:电容器固定装置通过第二变形元件将AC负载电流传导元件压靠在基底的另一导电的接触区域上,使得AC负载电流传导元件与基底导电性地压力接触。其结果是,AC负载电流传导元件以非常可靠的方式与基底导电性地压力接触。
此外,被证明有利的是,如果第二变形元件的一部分被布置在压力元件的切口中,所述切口被指配给第二变形元件,因为第二变形元件以能够实现非常高的机械负载的方式与压力元件相连。
此外,被证明有利的是,如果功率半导体设备具有印刷电路板,其中电容器固定装置具有阻隔元件,其中实质性地键合到阻隔元件且由弹性体形成并且与印刷电路板机械接触的弹性第三变形元件被布置在阻隔元件的面向印刷电路板的一侧上。其结果是,作用在印刷电路板上的机械负载降低,特别是机械振动负载降低。
此外,被证明有利的是,如果第三变形元件的一部分被布置在阻隔元件的切口中,所述切口被分配给第三变形元件,因为第三变形元件以能够实现非常高的机械负载的方式与阻隔元件相连。
此外,被证明有利的是,如果收纳设备具有收纳元件,其中电容器被布置在收纳元件与DC电压母线系统之间,其中实质性地键合到收纳元件且由弹性体形成并且与电容器机械接触的弹性第四变形元件被布置在收纳元件的面向电容器的一侧上。其结果是,作用在收纳电容器上的机械负载降低,特别是机械振动负载降低。
此外,被证明有利的是,如果弹性体具体实现为交联的硅橡胶——特别是具体实现为交联的液体硅橡胶或交联的固体硅橡胶,因为硅橡胶具有特别好的弹性性能。
此外,被证明有利的是,如果DC电压母线系统具有下述导电正电位母线和导电负电位母线,所述导电正电位母线和导电负电位母线按照通过布置在正电位母线与负电位母线之间的非导电绝缘层而彼此电绝缘的方式来布置,因为正电位母线和导电负电位母线彼此可靠地电绝缘。
此外,被证明有利的是,如果相应母线系统端子元件与正电位母线或负电位母线一体地具体实现,因为母线系统端子元件可以以特别简单的方式制造的。
此外,被证明有利的是,如果至少一个第一变形元件与DC电压母线系统的机械接触区域最大为面向电容器固定装置的DC电压母线系统的区域的70%,特别是最大为40%,特别是最大为20%,其中至少一个第一变形元件与DC电压母线系统的被布置成与母线系统端子元件直接相邻的区域机械接触。其结果是,以有目的的方式在布置母线系统端子元件的位置中大大方便地机械发生从电容器固定装置向DC电压母线系统引入力,以实现使母线系统端子元件与基底的导电接触区域的压力接触。
此外,被证明有利的是,如果功率半导体设备具有金属主体和压力产生装置,其中基底被布置在主体上,其中压力产生装置在基底的方向上对电容器固定装置施加压力,并且使得电容器固定装置通过至少一个第一变形元件在基底的方向上挤压DC电压母线系统。其结果是,长期可靠且稳定地在基底的方向上对电容器固定装置施加压力。
此外,被证明有利的是,如果压力生成装置具体实现为至少一个螺丝,因为压力产生装置是以特别简单的方式具体实现的。
此外,被证明有利的是,如果基底是具体实现为直接铜键合基底或绝缘金属基底,因为这些以特别可靠的方式构成了所具体实现的基底。
附图说明
下面参考以下附图对本发明的示例性实施例说明,其中:
图1示出了根据本发明的功率半导体设备的透视截面图,
图2示出了从侧面看的图1的细节视图,
图3示出了功率半导体设备的DC电压母线系统的透视图,所述DC电压母线系统被布置在基底上,
图4示出了从功率半导体设备的电容器固定装置和第一变形元件的下面看的透视图,以及
图5示出了功率半导体设备的电容器固定装置和第一变形元件的截面图。
图1图示了根据本发明的功率半导体设备1的透视截面图,并且图2图示了从侧面看的图1的细节视图。图3至图5图示了根据本发明的功率半导体设备1的元件的不同视图。
具体实施方式
根据本发明的功率半导体设备1具有基底2,其上布置有与基底2导电连接的功率半导体组件3。相应的功率半导体组件3优选地优选地以功率半导体开关或二极管的形式存在。在这种情况下,功率半导体开关通常以诸如例如IGBT(绝缘栅双极晶体管)或MOSFET(金属氧化物半导体场效应晶体管)的晶体管的形式存在,或者以晶闸管的形式存在。基底2具有绝缘物质体32(例如陶瓷体)和导电结构化的第一传导层31,该导电结构化的第一传导层31被布置在绝缘物质体32的第一侧上且与绝缘物质体32相连,并且由于其结构而形成了导电接触区域11。优选地,基底2具有导电的——优选地为非结构化的第二传导层33,其中绝缘物质体32被布置在结构化的第一传导层31与第二传导层33之间。如在示例性实施例中,基底2可例如以直接铜键合基底(DCB基底)的形式或以绝缘金属基底(IMS)的形式存在。功率半导体组件3优选地以实质性地键合的方式(例如借助于焊接或烧结层)与基底6的所指配的接触区域6a连接。
功率半导体设备1进一步具有导电DC电压母线系统4以及通过其电端子元件56与DC电压母线系统4导电连接的电容器44。DC电压母线系统4具有导电正电位母线7和导电负电位母线8,该导电正电位母线7和导电负电位母线8优选地按照通过布置在正电位母线7与负电位母线8之间的非导电绝缘层55(例如塑料膜)而彼此电绝缘的方式来布置。
在示例性实施例的上下文中,功率半导体组件3电互连以形成例如可用于对电压和电流进行整流并使其反相的半桥电路。功率半导体设备1具有电容器44以作为电储能器,所述电容器缓冲在功率半导体设备1处发生的DC电压。在示例性实施例中,电容器44以这种方式用作链路电容器,但也可用于不同目的。在最简单的情况下,也可能仅存在单个电容器44。
功率半导体设备1具有用于固定电容器44的电容器固定装置6,该电容器固定装置6具有用于收纳电容器44的收纳设备30。相应电容器44的至少一部分被布置在相应收纳设备30中。在示例性实施例的上下文中,电容器固定装置6具有为电容器44提供有开口的电容器固定板13,平板网17被布置在所述板的开口周围,该平板网用网框住电容器44,并且按照这种方式形成收纳设备30,在远离基底3的方向上延伸。电容器固定装置6优选地以整体方式具体实现。电容器固定装置6优选地由塑料形成的,特别是作为塑料注塑件形成的。
从DC电压母线系统4,与DC电压母线系统4导电连接的导电母线系统端子元件5和5'在基底2的方向上延伸。电容器44的电端子元件56以实质性地键合的方式(例如通过焊接、烧结、或者焊接连接)与母线系统端子元件5和5'导电接触。相应的母线系统端子元件5和5'与正电位母线7或负电位母线8一体地具体实现。
实质性地键合到电容器固定装置6并由弹性体形成的至少一个弹性第一变形元件12被布置在电容器固定装置6的面向DC电压母系统4的一侧9上,其中,优选地,多个第一变形元件12被布置在电容器固定装置6的面向DC电压母线系统4的一侧9上。功率半导体设备1以如下方式具体实现:电容器固定装置6经由至少一个第一变形元件12在基底2的方向上挤压DC电压母线系统4,并且从而将母线系统端子元件5和5'压靠在基底2的导电接触区域11,使得母线系统端子元件5和5'与基底2的所述接触区域11导电性地压力接触。
因为在本发明的情况下在母线系统端子元件5和5'上引入压力经由电容器44仅很小程度地发生或根本不发生,而是经由电容器固定装置6的面向DC电压母线系统4的一侧9,在本发明的情况下所述电容器仅承受非常低的机械负载并且因而具有非常长的寿命。因为至少一个第一变形元件12实质上地键合到电容器固定装置6并且电容器固定装置6和至少一个第一变形元件12因而形成结构化单元42,因此在功率半导体设备1的制造期间不可能忘记技术上的例如泡沫元件的常规插入,使得功率半导体设备1以可靠的方式有效地制造。
至少一个第一变形元件12与DC电压母线系统4的机械接触区域50优选地是DC电压母线系统4的面向电容器固定装置6的区域51的最大70%(参见图3),特别是最大40%,特别是最大20%,其中至少一个第一变形元件12与被布置成与母线系统端子元件5和5'直接相邻的DC电母线系统4的区域53机械接触。其结果是,基本上以有目的的方式并且从而机械方便地在布置母系统端子元件5和5'的位置上实现将力从电容器固定装置6引入到DC电压母线系统4以实现母线系统端子元件5和5'与基底2的导电接触区域11的压力接触。
至少一个第一变形元件5的一部分被布置在电容器固定装置6的切口43(参见图5)中,所述切口被指配给至少一个第一变形元件5。
第一变形元件5可通过由形成了变形元件5的弹性体所形成的连接部56彼此连接。
功率半导体设备1优选地具有AC负载电流传导元件16和压力元件19,其中将实质性地键合到压力元件19并由弹性体形成的弹性第二变形元件20布置在压力元件19的面向AC负载电流传导元件16的一侧21上,其中功能半导体设备1以如下方式具体实现:电容器固定装置6通过第二变形元件20将AC负载电流传导元件16压靠在基底2的另一个导电接触区域11,使得AC负载电流传导元件16与基底2导电性地压力接触。
功率半导体设备1进一步优选地具有印刷电路板27,并且电容器固定装置6具有阻隔元件23。实质性地键合到阻隔元件23并由弹性体形成并且与印刷电路板27具有机械接触的弹性第三变形元件20被布置在阻隔元件23的面向印刷电路板27的一侧25上。印刷电路板27经由弹性第三变形元件24以抗振的方式与功率半导体设备1的其余部分连接。通过弹性第三变形元件24减小了作用在印刷电路板27上的机械负载——特别是机械振动负载。优选地将第三变形元件24的一部分布置在阻隔元件23的切口26中,所述切口被指配给第三变形元件24。作为示例,可将用于驱动功率半导体组件3的驱动电路布置在印刷电路板27上。
收纳设备30优选地具有收纳元件28,其中将电容器44布置在收纳元件28与DC电压母线系统4之间。实质上地键合到收纳元件28并由弹性体形成并且与电容器44具有机械接触的弹性第四变形元件29被布置在收纳元件28的面向电容器44的一侧61上。通过弹性第四变形元件29减小了作用在相应电容器44上的机械负载——特别是振动负载。
弹性体优选地作为交联的硅橡胶具体实现,特别是作为交联的液体硅橡胶或交联的固体硅橡胶具体实现。
电容器固定装置6与变形元件12,20,24,29一起形成结构化单元42使得特别有效地制造功率半导体设备1。结构化单元42优选地以如下方式制造的:电容器固定装置6作为塑料注塑件制造,并且随后将其布置在被设计成通过注射技术形成弹性变形元件的反模中,并且此后将用于形成弹性变形元件的未交联的化学前体形式(例如未交联的硅橡胶)的弹性体注入到反模中,并在其中经历交联。
在最简单的情况下,电容器固定装置6可借助于由下述重力所产生的必要压力而通过至少一个第一变形元件12在基底2的方向上挤压DC电压母线系统4,所述重力用于在如果相对于地球的中心而言将电容器固定装置6布置在DC电压母系统4的上方的情况下将电容器固定装置6压向DC电压母系统4。
功率半导体设备1优选地具有金属主体63和压力产生装置62。基底2被布置在主体63上。在这种情况下,基底2可经由布置主体63与基底2之间的焊接或烧结层而实质上地键合到主体63。或者,可在基底2与主体63之间布置导热膏。压力产生装置62在基底2的方向上对电容器固定装置6施加压力。因此,电容器固定装置6在基底2的方向上经由至少一个第一变形元件12挤压DC电压母线系统4,使得母线系统端子元件5和5'压靠在基底2的导电接触区域11。压力产生装置62优选地具体实现为为至少一个螺钉62。在示例性实施例的上下文中,电容器固定装置6具有通孔41,螺钉62的一部分被引导通过所述通孔41并且螺钉62被拧入提供有内螺纹的主体63中的孔40之中。或者,主体63中的孔40还可以不具有内螺纹,并且螺钉62穿过孔40并且与螺母一起拧紧在主体63的背离基底2的一侧上。
例如,如在示例性实施例中,主体63例如可具体实现为散热器63。散热器63可具有优选地从散热器63的基板14延伸出的散热片15或冷却针片(cooling pin)。基底2被布置在散热器63的基板14上。散热器63可具体实现为基于空气的散热器或基于水的散热器。或者,主体还可具体实现为为了安装到散热器(例如基于空气的散热器或基于水的散热器)上而提供的基板14(不具有散热片15或冷却针片)。
不言而喻,除了自身排除,以单数所提到的特征,特别是第二、第三、以及第四变形元件,还可在根据本发明的功率半导体设备中呈现为多个。
在此应当注意的是,当然可对本发明的不同示例性实施例的特征进行任意地互相组合,只要这些特征不相互排斥。
Claims (15)
1.一种功率半导体设备,所述功率半导体设备包括基底并且包括被布置在所述基底上并与所述基底导电地连接的功率半导体组件,所述功率半导体设备包括导电的DC电压母线系统并且包括与所述DC电压母线系统导电地连接的电容器,
其中,所述功率半导体设备具有用于固定所述电容器的电容器固定装置,所述电容器固定装置包括用于收纳所述电容器的收纳设备,所述电容器的至少一部分被布置在所述收纳设备中,
其中,导电地连接到所述DC电压母线系统的导电的母线系统端子元件在所述基底的方向上从所述DC电压母线系统延伸,
其中,被实质性地键合到所述电容器固定装置的、并且由弹性体形成的至少一个具有弹性的第一变形元件被布置在所述电容器固定装置的面向所述DC电压母线系统的一侧上,
其中,所述功率半导体设备以如下方式来被具体实现:
所述电容器固定装置经由所述至少一个第一变形元件来在所述基底的方向上挤压所述DC电压母线系统,并且从而将所述母线系统端子元件压靠在所述基底的导电的接触区域,使得所述母线系统端子元件与所述基底的所述接触区域导电性地压力接触,
其中,所述功率半导体设备具有AC负载电流传导元件,
其中,所述电容器固定装置具有压力元件,
其中,被实质性地键合到所述压力元件的、并且由弹性体形成的具有弹性的第二变形元件被布置在所述压力元件的面向所述AC负载电流传导元件的一侧上,
其中,所述功率半导体设备以如下方式来被具体实现:
所述电容器固定装置经由所述第二变形元件将所述AC负载电流传导元件压靠在所述基底的另一导电的接触区域上,使得所述AC负载电流传导元件与所述基底导电性地压力接触。
2.根据权利要求1所述的功率半导体设备,其特征在于,
所述至少一个第一变形元件的一部分被布置在所述电容器固定装置的切口中,该切口被指配给相应的第一变形元件。
3.根据权利要求1所述的功率半导体设备,其特征在于,
所述第二变形元件的一部分被布置在所述压力元件的切口中,该切口被指配给所述第二变形元件。
4.根据权利要求1所述的功率半导体设备,其特征在于,
所述收纳设备具有收纳元件,
其中,所述电容器被布置在所述收纳元件与所述DC电压母线系统之间,
其中,被实质性地键合到所述收纳元件的、由弹性体形成的、并且与所述电容器机械地接触的具有弹性的第四变形元件被布置在所述收纳元件的面向所述电容器的一侧上。
5.根据权利要求1所述的功率半导体设备,其特征在于,
所述弹性体被具体实现为交联的硅橡胶。
6.根据权利要求1所述的功率半导体设备,其特征在于,
所述DC电压母线系统具有导电的正电位母线和导电的负电位母线,通过被布置在所述正电位母线与所述负电位母线之间的非导电绝缘层来以彼此电绝缘的方式布置所述正电位母线和所述负电位母线。
7.根据权利要求6所述的功率半导体设备,其特征在于,
各个所述母线系统端子元件与所述正电位母线或与所述负电位母线来被一体地具体实现。
8.根据权利要求1所述的功率半导体设备,其特征在于,
所述至少一个第一变形元件与所述DC电压母线系统这两者的机械地接触区域最大为所述DC电压母线系统的面向所述电容器固定装置的区域的70%,
其中,所述至少一个第一变形元件与所述DC电压母线系统中的被布置成与所述母线系统端子元件直接相邻的区域机械地接触。
9.根据权利要求1所述的功率半导体设备,其特征在于,
所述功率半导体设备具有金属主体和压力产生装置,
其中,所述基底被布置在所述主体上,
其中,所述压力产生装置在所述基底的方向上对所述电容器固定装置施加压力,并且所述电容器固定装置从而经由所述至少一个第一变形元件来在所述基底的方向上挤压所述DC电压母线系统。
10.根据权利要求9所述的功率半导体设备,其特征在于,
所述压力生成装置被具体实现为至少一个螺丝。
11.根据权利要求1所述的功率半导体设备,其特征在于,
所述弹性体被具体实现为交联的液体硅橡胶或交联的固体硅橡胶。
12.根据权利要求1所述的功率半导体设备,其特征在于,
所述至少一个第一变形元件与所述DC电压母线系统这两者的机械地接触区域最大为所述DC电压母线系统的面向所述电容器固定装置的区域的40%,
其中,所述至少一个第一变形元件与所述DC电压母线系统中的被布置成与所述母线系统端子元件直接相邻的区域机械地接触。
13.根据权利要求1所述的功率半导体设备,其特征在于,
所述至少一个第一变形元件与所述DC电压母线系统这两者的机械地接触区域最大为所述DC电压母线系统的面向所述电容器固定装置的区域的20%,
其中,所述至少一个第一变形元件与所述DC电压母线系统中的被布置成与所述母线系统端子元件直接相邻的区域机械地接触。
14.一种功率半导体设备,所述功率半导体设备包括基底并且包括被布置在所述基底上并与所述基底导电地连接的功率半导体组件,所述功率半导体设备包括导电的DC电压母线系统并且包括与所述DC电压母线系统导电地连接的电容器,
其中,所述功率半导体设备具有用于固定所述电容器的电容器固定装置,所述电容器固定装置包括用于收纳所述电容器的收纳设备,所述电容器的至少一部分被布置在所述收纳设备中,
其中,导电地连接到所述DC电压母线系统的导电的母线系统端子元件在所述基底的方向上从所述DC电压母线系统延伸,
其中,被实质性地键合到所述电容器固定装置的、并且由弹性体形成的至少一个具有弹性的第一变形元件被布置在所述电容器固定装置的面向所述DC电压母线系统的一侧上,
其中,所述功率半导体设备以如下方式来被具体实现:
所述电容器固定装置经由所述至少一个第一变形元件来在所述基底的方向上挤压所述DC电压母线系统,并且从而将所述母线系统端子元件压靠在所述基底的导电的接触区域,使得所述母线系统端子元件与所述基底的所述接触区域导电性地压力接触,
其中,所述功率半导体设备具有印刷电路板,
其中,所述电容器固定装置具有阻隔元件,
其中,被实质性地键合到所述阻隔元件的、由弹性体形成的、并且与所述印刷电路板机械地接触的具有弹性的第三变形元件被布置在所述阻隔元件的面向所述印刷电路板的一侧上。
15.根据权利要求14所述的功率半导体设备,其特征在于,
所述第三变形元件的一部分被布置在所述阻隔元件的切口中,该切口被指配给所述第三变形元件。
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