JP2011061113A5 - - Google Patents

Download PDF

Info

Publication number
JP2011061113A5
JP2011061113A5 JP2009211368A JP2009211368A JP2011061113A5 JP 2011061113 A5 JP2011061113 A5 JP 2011061113A5 JP 2009211368 A JP2009211368 A JP 2009211368A JP 2009211368 A JP2009211368 A JP 2009211368A JP 2011061113 A5 JP2011061113 A5 JP 2011061113A5
Authority
JP
Japan
Prior art keywords
layer
adhesion layer
substrate
wiring
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009211368A
Other languages
English (en)
Japanese (ja)
Other versions
JP5436995B2 (ja
JP2011061113A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009211368A priority Critical patent/JP5436995B2/ja
Priority claimed from JP2009211368A external-priority patent/JP5436995B2/ja
Priority to US12/869,805 priority patent/US8288659B2/en
Publication of JP2011061113A publication Critical patent/JP2011061113A/ja
Publication of JP2011061113A5 publication Critical patent/JP2011061113A5/ja
Application granted granted Critical
Publication of JP5436995B2 publication Critical patent/JP5436995B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2009211368A 2009-09-14 2009-09-14 配線基板及びその製造方法 Active JP5436995B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009211368A JP5436995B2 (ja) 2009-09-14 2009-09-14 配線基板及びその製造方法
US12/869,805 US8288659B2 (en) 2009-09-14 2010-08-27 Wiring board and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009211368A JP5436995B2 (ja) 2009-09-14 2009-09-14 配線基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2011061113A JP2011061113A (ja) 2011-03-24
JP2011061113A5 true JP2011061113A5 (enExample) 2012-08-16
JP5436995B2 JP5436995B2 (ja) 2014-03-05

Family

ID=43729373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009211368A Active JP5436995B2 (ja) 2009-09-14 2009-09-14 配線基板及びその製造方法

Country Status (2)

Country Link
US (1) US8288659B2 (enExample)
JP (1) JP5436995B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5602584B2 (ja) * 2010-10-28 2014-10-08 新光電気工業株式会社 配線基板及びその製造方法
KR20220033838A (ko) * 2020-09-10 2022-03-17 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법
EP4319510A4 (en) * 2021-03-22 2024-10-02 Panasonic Intellectual Property Management Co., Ltd. WIRING BODY, MOUNTING SUBSTRATE, WIRING TRANSFER BOARD WITH WIRING, INTERMEDIATE MATERIAL FOR WIRING BODY, AND METHOD FOR MANUFACTURING WIRING BODY
WO2025154262A1 (ja) * 2024-01-19 2025-07-24 株式会社レゾナック 配線基板を製造する方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05287500A (ja) * 1992-04-07 1993-11-02 Nissin Electric Co Ltd フィルムキャリア形基板の製造方法
MY139405A (en) * 1998-09-28 2009-09-30 Ibiden Co Ltd Printed circuit board and method for its production
TW498510B (en) * 2001-06-05 2002-08-11 Chipbond Technology Corp Metallized surface wafer level package structure
JP2003218516A (ja) 2002-01-23 2003-07-31 Shinko Electric Ind Co Ltd 配線基板の製造方法
US7060364B2 (en) * 2002-12-26 2006-06-13 Mitsui Mining & Smelting Co., Ltd. Film carrier tape for mounting electronic devices thereon
US20050224977A1 (en) * 2004-01-29 2005-10-13 Yusuke Yoshimura Wiring substrate and method using the same
JP4086803B2 (ja) * 2004-03-23 2008-05-14 松下電器産業株式会社 フレキシブルプリント回路基板の製造方法
JP4494873B2 (ja) * 2004-06-02 2010-06-30 株式会社アルバック プリント配線板、プリント配線板の製造方法およびその製造装置
JP2006306009A (ja) * 2004-07-27 2006-11-09 Kakogawa Plastic Kk ２層フィルム、２層フィルムの製造方法およびプリント基板の製造方法
JP2007245646A (ja) * 2006-03-17 2007-09-27 Kakogawa Plastic Kk ２層フィルム、２層フィルムの製造方法およびプリント基板の製造方法
JP4968266B2 (ja) * 2007-01-24 2012-07-04 住友金属鉱山株式会社 ２層フレキシブル基板とその製造方法及び該２層フレキシブル基板より得られたフレキシブルプリント配線基板
JP5113544B2 (ja) * 2008-01-30 2013-01-09 新光電気工業株式会社 配線基板の製造方法
JP2009188324A (ja) * 2008-02-08 2009-08-20 Shinko Electric Ind Co Ltd 配線基板及びその製造方法

Similar Documents

Publication Publication Date Title
JP2011082537A5 (enExample)
JP2012094734A5 (enExample)
MY161680A (en) Copper foil for printed wiring board, method for producing said copper foil, resin substrate for printed wiring board and printed wiring board
WO2008049019A3 (en) Copper deposition for filling features in manufacture of microelectronic devices
JP2011061113A5 (enExample)
TWI716518B (zh) 銅蝕刻劑組成物之用途
WO2014051511A3 (en) Electroless metal through silicon via
JP2012099598A5 (enExample)
JP2016541113A5 (enExample)
US20100301010A1 (en) ETCHANT COMPOSITIONS AND ETCHING METHOD FOR METALS Cu/Mo
JP2010534413A5 (enExample)
JP2015002193A5 (enExample)
TW200718806A (en) Stabilized etch solutions for Cu and Cu/Ni layers
JP2011077434A5 (enExample)
IL308906A (en) Etching compositions
JP2008277749A5 (enExample)
KR101745721B1 (ko) 구리 배선의 형성을 위한 식각액 조성물
JP2008277749A (ja) 配線基板およびその製造方法
JP5436995B2 (ja) 配線基板及びその製造方法
JP2009164471A5 (enExample)
US8946087B2 (en) Electroless copper deposition
JP2008141204A5 (enExample)
KR20180041365A (ko) 금속막 식각액 조성물
JP2014012873A5 (enExample)
JP2008030047A5 (enExample)