JP2008030047A5 - - Google Patents

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Publication number
JP2008030047A5
JP2008030047A5 JP2006202768A JP2006202768A JP2008030047A5 JP 2008030047 A5 JP2008030047 A5 JP 2008030047A5 JP 2006202768 A JP2006202768 A JP 2006202768A JP 2006202768 A JP2006202768 A JP 2006202768A JP 2008030047 A5 JP2008030047 A5 JP 2008030047A5
Authority
JP
Japan
Prior art keywords
lead
free solder
solder according
present
further containing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006202768A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008030047A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006202768A priority Critical patent/JP2008030047A/ja
Priority claimed from JP2006202768A external-priority patent/JP2008030047A/ja
Publication of JP2008030047A publication Critical patent/JP2008030047A/ja
Publication of JP2008030047A5 publication Critical patent/JP2008030047A5/ja
Pending legal-status Critical Current

Links

JP2006202768A 2006-07-26 2006-07-26 無鉛ハンダ Pending JP2008030047A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006202768A JP2008030047A (ja) 2006-07-26 2006-07-26 無鉛ハンダ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006202768A JP2008030047A (ja) 2006-07-26 2006-07-26 無鉛ハンダ

Publications (2)

Publication Number Publication Date
JP2008030047A JP2008030047A (ja) 2008-02-14
JP2008030047A5 true JP2008030047A5 (enExample) 2009-09-03

Family

ID=39120005

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006202768A Pending JP2008030047A (ja) 2006-07-26 2006-07-26 無鉛ハンダ

Country Status (1)

Country Link
JP (1) JP2008030047A (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008082191A1 (en) * 2006-12-29 2008-07-10 Iljin Copper Foil Co., Ltd. Pb-free solder alloy
JP5230974B2 (ja) * 2007-07-25 2013-07-10 新日鉄住金マテリアルズ株式会社 ハンダ合金、ハンダボール及びハンダバンプを有する電子部材
US8501088B2 (en) 2007-07-25 2013-08-06 Nippon Steel & Sumikin Materials Co., Ltd. Solder alloy, solder ball and electronic member having solder bump
KR101173531B1 (ko) * 2009-05-25 2012-08-13 히타치 긴조쿠 가부시키가이샤 땜납 합금 및 이를 이용한 땜납 접합체
JP2011005545A (ja) * 2009-05-25 2011-01-13 Hitachi Metals Ltd はんだ合金およびこれを用いたはんだ接合体
JP2011031253A (ja) * 2009-07-30 2011-02-17 Eishin Kogyo Kk 無鉛ハンダ合金
CN102029478A (zh) * 2010-12-10 2011-04-27 株洲冶炼集团股份有限公司 一种无铅焊料
US9999945B2 (en) 2011-04-08 2018-06-19 Nihon Superior Co., Ltd. Solder alloy
KR101965037B1 (ko) * 2012-08-31 2019-04-02 센주긴조쿠고교 가부시키가이샤 피막, 전자 부품의 접착 방법, 피막의 형성 및 박리 방법, 및 도전성 밀착 재료

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000141078A (ja) * 1998-09-08 2000-05-23 Nippon Sheet Glass Co Ltd 無鉛ハンダ
JP2000119046A (ja) * 1998-10-09 2000-04-25 Nippon Sheet Glass Co Ltd ガラスパネルの周縁部封止構造
JP2000326088A (ja) * 1999-03-16 2000-11-28 Nippon Sheet Glass Co Ltd 無鉛ハンダ
JP3664308B2 (ja) * 2002-08-29 2005-06-22 黒田テクノ株式会社 無鉛ハンダ
JP4144415B2 (ja) * 2003-01-07 2008-09-03 千住金属工業株式会社 鉛フリーはんだ

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