JP2008030047A - 無鉛ハンダ - Google Patents
無鉛ハンダ Download PDFInfo
- Publication number
- JP2008030047A JP2008030047A JP2006202768A JP2006202768A JP2008030047A JP 2008030047 A JP2008030047 A JP 2008030047A JP 2006202768 A JP2006202768 A JP 2006202768A JP 2006202768 A JP2006202768 A JP 2006202768A JP 2008030047 A JP2008030047 A JP 2008030047A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- solder
- conductivity
- temperature
- hardness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 29
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 21
- 239000000956 alloy Substances 0.000 claims abstract description 21
- 239000000203 mixture Substances 0.000 claims abstract description 12
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 4
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 4
- 229910052709 silver Inorganic materials 0.000 claims abstract description 4
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 4
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910052796 boron Inorganic materials 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000011521 glass Substances 0.000 abstract description 11
- 239000000919 ceramic Substances 0.000 abstract description 8
- 238000002844 melting Methods 0.000 abstract description 4
- 230000008018 melting Effects 0.000 abstract description 4
- 238000005476 soldering Methods 0.000 abstract description 2
- 229910052718 tin Inorganic materials 0.000 abstract description 2
- 238000012360 testing method Methods 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 10
- 239000010949 copper Substances 0.000 description 5
- 238000005304 joining Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910020994 Sn-Zn Inorganic materials 0.000 description 4
- 229910009069 Sn—Zn Inorganic materials 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229910052755 nonmetal Inorganic materials 0.000 description 3
- 150000002843 nonmetals Chemical class 0.000 description 3
- 238000009864 tensile test Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 229910009071 Sn—Zn—Bi Inorganic materials 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000005361 soda-lime glass Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 208000025599 Heat Stress disease Diseases 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910009078 Sn—Zn—In Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000007542 hardness measurement Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006202768A JP2008030047A (ja) | 2006-07-26 | 2006-07-26 | 無鉛ハンダ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006202768A JP2008030047A (ja) | 2006-07-26 | 2006-07-26 | 無鉛ハンダ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008030047A true JP2008030047A (ja) | 2008-02-14 |
| JP2008030047A5 JP2008030047A5 (enExample) | 2009-09-03 |
Family
ID=39120005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006202768A Pending JP2008030047A (ja) | 2006-07-26 | 2006-07-26 | 無鉛ハンダ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2008030047A (enExample) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009028746A (ja) * | 2007-07-25 | 2009-02-12 | Nippon Steel Materials Co Ltd | ハンダ合金、ハンダボール及びハンダバンプを有する電子部材 |
| JP2010514931A (ja) * | 2006-12-29 | 2010-05-06 | イルジン カッパー ホイル カンパニー リミテッド | 無鉛ソルダ合金 |
| CN101899589A (zh) * | 2009-05-25 | 2010-12-01 | 日立金属株式会社 | 焊锡合金及使用该焊锡合金的焊锡接合体 |
| JP2011031253A (ja) * | 2009-07-30 | 2011-02-17 | Eishin Kogyo Kk | 無鉛ハンダ合金 |
| CN102029478A (zh) * | 2010-12-10 | 2011-04-27 | 株洲冶炼集团股份有限公司 | 一种无铅焊料 |
| WO2012137901A1 (ja) * | 2011-04-08 | 2012-10-11 | 株式会社日本スペリア社 | はんだ合金 |
| US8501088B2 (en) | 2007-07-25 | 2013-08-06 | Nippon Steel & Sumikin Materials Co., Ltd. | Solder alloy, solder ball and electronic member having solder bump |
| TWI412604B (zh) * | 2009-05-25 | 2013-10-21 | Hitachi Metals Ltd | 焊錫合金及使用該焊錫合金的焊錫接合體 |
| WO2014034863A1 (ja) * | 2012-08-31 | 2014-03-06 | 千住金属工業株式会社 | 導電性密着材料 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000119046A (ja) * | 1998-10-09 | 2000-04-25 | Nippon Sheet Glass Co Ltd | ガラスパネルの周縁部封止構造 |
| JP2000141078A (ja) * | 1998-09-08 | 2000-05-23 | Nippon Sheet Glass Co Ltd | 無鉛ハンダ |
| JP2000326088A (ja) * | 1999-03-16 | 2000-11-28 | Nippon Sheet Glass Co Ltd | 無鉛ハンダ |
| JP2004082199A (ja) * | 2002-08-29 | 2004-03-18 | Kuroda Techno Co Ltd | 無鉛ハンダ |
| JP2004261863A (ja) * | 2003-01-07 | 2004-09-24 | Senju Metal Ind Co Ltd | 鉛フリーはんだ |
-
2006
- 2006-07-26 JP JP2006202768A patent/JP2008030047A/ja active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000141078A (ja) * | 1998-09-08 | 2000-05-23 | Nippon Sheet Glass Co Ltd | 無鉛ハンダ |
| JP2000119046A (ja) * | 1998-10-09 | 2000-04-25 | Nippon Sheet Glass Co Ltd | ガラスパネルの周縁部封止構造 |
| JP2000326088A (ja) * | 1999-03-16 | 2000-11-28 | Nippon Sheet Glass Co Ltd | 無鉛ハンダ |
| JP2004082199A (ja) * | 2002-08-29 | 2004-03-18 | Kuroda Techno Co Ltd | 無鉛ハンダ |
| JP2004261863A (ja) * | 2003-01-07 | 2004-09-24 | Senju Metal Ind Co Ltd | 鉛フリーはんだ |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010514931A (ja) * | 2006-12-29 | 2010-05-06 | イルジン カッパー ホイル カンパニー リミテッド | 無鉛ソルダ合金 |
| JP2009028746A (ja) * | 2007-07-25 | 2009-02-12 | Nippon Steel Materials Co Ltd | ハンダ合金、ハンダボール及びハンダバンプを有する電子部材 |
| US8501088B2 (en) | 2007-07-25 | 2013-08-06 | Nippon Steel & Sumikin Materials Co., Ltd. | Solder alloy, solder ball and electronic member having solder bump |
| TWI412604B (zh) * | 2009-05-25 | 2013-10-21 | Hitachi Metals Ltd | 焊錫合金及使用該焊錫合金的焊錫接合體 |
| CN101899589A (zh) * | 2009-05-25 | 2010-12-01 | 日立金属株式会社 | 焊锡合金及使用该焊锡合金的焊锡接合体 |
| KR101173531B1 (ko) | 2009-05-25 | 2012-08-13 | 히타치 긴조쿠 가부시키가이샤 | 땜납 합금 및 이를 이용한 땜납 접합체 |
| JP2011031253A (ja) * | 2009-07-30 | 2011-02-17 | Eishin Kogyo Kk | 無鉛ハンダ合金 |
| CN102029478A (zh) * | 2010-12-10 | 2011-04-27 | 株洲冶炼集团股份有限公司 | 一种无铅焊料 |
| WO2012137901A1 (ja) * | 2011-04-08 | 2012-10-11 | 株式会社日本スペリア社 | はんだ合金 |
| JP5973992B2 (ja) * | 2011-04-08 | 2016-08-23 | 株式会社日本スペリア社 | はんだ合金 |
| US9999945B2 (en) | 2011-04-08 | 2018-06-19 | Nihon Superior Co., Ltd. | Solder alloy |
| WO2014034863A1 (ja) * | 2012-08-31 | 2014-03-06 | 千住金属工業株式会社 | 導電性密着材料 |
| JPWO2014034863A1 (ja) * | 2012-08-31 | 2016-08-08 | 千住金属工業株式会社 | 導電性密着材料 |
| US9487846B2 (en) | 2012-08-31 | 2016-11-08 | Senju Metal Industry Co., Ltd. | Electroconductive bonding material |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090722 |
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| A621 | Written request for application examination |
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| A977 | Report on retrieval |
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| A521 | Written amendment |
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| A02 | Decision of refusal |
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