JP2011003906A - 分離型形状適応遮蔽領域を形成するシステムおよび方法 - Google Patents
分離型形状適応遮蔽領域を形成するシステムおよび方法 Download PDFInfo
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0043—Casings being flexible containers, e.g. pouch, pocket, bag
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
【解決手段】形状適応構造(10)の誘電体被覆(18)は、回路部品(16)が搭載された電気システム(12)上に配置され、電気システム(12)の表面に共形になるように形状設定され、電気システムの表面上にあるコンタクトパッド(22)の上に配置された複数の開口(20)を有する。形状適応構造(10)は、導電性被覆(24)であって、誘電体被覆(18)上に層状に重ねられ、かつ導電性被覆(24)とコンタクトパッド(22)の間に電気接続が形成されるようにコンタクトパッド(22)上に層状に重ねられた導電性被覆(24)も含む。誘電体被覆(18)および導電性被覆(24)は、所望の回路部品(16)または回路部品群を覆う形状適応構造のそれぞれの遮蔽領域(26)を分離するように貫通して形成された複数の重なり合う経路開口(27)を有する。
【選択図】図2
Description
12 回路アセンブリ、電気システム
14 回路基板
16 回路部品
17 はんだマスク、はんだ層
18 誘電体層、誘電体被覆
19 上面
20 開口
22 コンタクトパッド
23 グランドプレーン
24 金属層、導電層、導電性被覆
25 パッケージフィードスルー
26 局所的な接地遮蔽構造、分離型遮蔽構造、分離型遮蔽領域、遮蔽部分
27 レーザ切断経路、レーザ切断経路開口
28 相互接続
Claims (10)
- 回路部品(16)が搭載された電気システム(12)上に配置された誘電体被覆(18)であって、前記電気システム(12)の表面に共形になるように形状設定され、前記電気システムの前記表面上にあるコンタクトパッド(22)の上に配置された複数の開口(20)を有する誘電体被覆(18)と、
導電性被覆(24)であって、前記誘電体被覆(18)上に層状に重ねられ、かつ前記導電性被覆(24)と前記コンタクトパッド(22)の間に電気接続が形成されるように前記コンタクトパッド(22)上に層状に重ねられた導電性被覆(24)と
を備え、
前記誘電体被覆(18)および前記導電性被覆(24)が、所望の回路部品(16)または回路部品(16)群を覆う前記形状適応構造のそれぞれの遮蔽領域(26)を分離するように貫通して形成された複数の重なり合う経路開口(27)を有する
形状適応構造(10)。 - 前記回路部品のそれぞれを覆う前記それぞれの遮蔽領域(26)が、前記回路部品を覆う前記誘電体被覆(18)および前記導電性被覆(24)からなる分離型パッチを備える、請求項1記載の形状適応構造(10)。
- 前記複数の重なり合う経路開口(27)のそれぞれが、そのそれぞれに対応する遮蔽領域(26)を取り囲む閉ループ経路を備える、請求項1記載の形状適応構造(10)。
- 前記導電性被覆(24)が、微粒子金属スプレー被覆、スパッタリングした金属被覆、およびめっきした金属被覆のうち1つを備える、請求項1記載の形状適応構造(10)。
- 前記複数の重なり合う経路開口(27)のそれぞれが、約25〜500マイクロメートルの幅を有する、請求項1記載の形状適応構造(10)。
- 前記複数の重なり合う経路開口(27)がレーザ切断経路開口を備える、請求項1記載の形状適応構造(10)。
- 前記誘電体被覆(18)と前記電気システム(12)の前記表面との間に配置されたはんだ層(17)をさらに備え、前記はんだ層(17)が、貫通して形成された、前記誘電体被覆および導電性被覆(18、24)内の前記複数の重なり合う経路開口(27)に重なり合う複数の経路開口(27)を含む、請求項1記載の形状適応構造(10)。
- 前記電気システム(12)が、プリント回路基板(PCB)、フレックスPCB、リジッドフレックスPCB、およびモジュールのうち1つを備える、請求項1記載の形状適応構造(10)。
- 前記電気システム(12)から前記分離型遮蔽領域(26)のそれぞれまで延び、それにより前記分離型遮蔽領域(26)を前記電気システム(12)に電気的に接地するパッケージフィードスルー(25)をさらに備える、請求項1記載の形状適応構造(10)。
- 前記導電性被覆(24)が、
第1の金属被覆であって、前記誘電体被覆(18)上に層状に重ねられ、かつ前記第1の金属被覆と前記コンタクトパッド(22)の間に電気接続が形成されるように前記複数の開口(20)内に層状に重ねられた第1の金属被覆と、
前記第1の金属被覆上に層状に重ねられた第2の金属被覆と
を備える、請求項1記載の形状適応構造(10)。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/488,639 US8115117B2 (en) | 2009-06-22 | 2009-06-22 | System and method of forming isolated conformal shielding areas |
US12/488,639 | 2009-06-22 |
Publications (3)
Publication Number | Publication Date |
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JP2011003906A true JP2011003906A (ja) | 2011-01-06 |
JP2011003906A5 JP2011003906A5 (ja) | 2013-08-01 |
JP5864838B2 JP5864838B2 (ja) | 2016-02-17 |
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JP2010140053A Active JP5864838B2 (ja) | 2009-06-22 | 2010-06-21 | パターン化形状適応構造を形成する方法及び、分離型形状適応遮蔽領域が形成された形状適応構造 |
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US (1) | US8115117B2 (ja) |
EP (1) | EP2268117B1 (ja) |
JP (1) | JP5864838B2 (ja) |
CN (1) | CN101932223B (ja) |
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KR102567412B1 (ko) * | 2018-10-31 | 2023-08-16 | 삼성전자주식회사 | 복수의 레이어를 포함하는 차폐 필름 및 그것을 사용하는 전자 장치 |
Also Published As
Publication number | Publication date |
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EP2268117B1 (en) | 2018-03-14 |
JP5864838B2 (ja) | 2016-02-17 |
CN101932223B (zh) | 2013-08-28 |
US20100319981A1 (en) | 2010-12-23 |
CN101932223A (zh) | 2010-12-29 |
EP2268117A3 (en) | 2012-01-18 |
US8115117B2 (en) | 2012-02-14 |
EP2268117A2 (en) | 2010-12-29 |
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