JP2010541241A5 - - Google Patents

Download PDF

Info

Publication number
JP2010541241A5
JP2010541241A5 JP2010526932A JP2010526932A JP2010541241A5 JP 2010541241 A5 JP2010541241 A5 JP 2010541241A5 JP 2010526932 A JP2010526932 A JP 2010526932A JP 2010526932 A JP2010526932 A JP 2010526932A JP 2010541241 A5 JP2010541241 A5 JP 2010541241A5
Authority
JP
Japan
Prior art keywords
output
gas
elongated
substrate
gas material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010526932A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010541241A (ja
JP5539882B2 (ja
Filing date
Publication date
Priority claimed from US11/861,402 external-priority patent/US8211231B2/en
Application filed filed Critical
Publication of JP2010541241A publication Critical patent/JP2010541241A/ja
Publication of JP2010541241A5 publication Critical patent/JP2010541241A5/ja
Application granted granted Critical
Publication of JP5539882B2 publication Critical patent/JP5539882B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2010526932A 2007-09-26 2008-09-24 蒸着のための供給装置 Active JP5539882B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/861,402 US8211231B2 (en) 2007-09-26 2007-09-26 Delivery device for deposition
US11/861,402 2007-09-26
PCT/US2008/011063 WO2009042145A2 (en) 2007-09-26 2008-09-24 Delivery device for deposition

Publications (3)

Publication Number Publication Date
JP2010541241A JP2010541241A (ja) 2010-12-24
JP2010541241A5 true JP2010541241A5 (enExample) 2011-11-10
JP5539882B2 JP5539882B2 (ja) 2014-07-02

Family

ID=40377417

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010526932A Active JP5539882B2 (ja) 2007-09-26 2008-09-24 蒸着のための供給装置

Country Status (6)

Country Link
US (3) US8211231B2 (enExample)
EP (1) EP2191036B1 (enExample)
JP (1) JP5539882B2 (enExample)
CN (1) CN101809192B (enExample)
TW (1) TWI473901B (enExample)
WO (1) WO2009042145A2 (enExample)

Families Citing this family (79)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11136667B2 (en) * 2007-01-08 2021-10-05 Eastman Kodak Company Deposition system and method using a delivery head separated from a substrate by gas pressure
US20080166880A1 (en) * 2007-01-08 2008-07-10 Levy David H Delivery device for deposition
US7789961B2 (en) * 2007-01-08 2010-09-07 Eastman Kodak Company Delivery device comprising gas diffuser for thin film deposition
US8092599B2 (en) * 2007-07-10 2012-01-10 Veeco Instruments Inc. Movable injectors in rotating disc gas reactors
US8211231B2 (en) * 2007-09-26 2012-07-03 Eastman Kodak Company Delivery device for deposition
US8398770B2 (en) * 2007-09-26 2013-03-19 Eastman Kodak Company Deposition system for thin film formation
US8182608B2 (en) * 2007-09-26 2012-05-22 Eastman Kodak Company Deposition system for thin film formation
US7976631B2 (en) * 2007-10-16 2011-07-12 Applied Materials, Inc. Multi-gas straight channel showerhead
JP5179389B2 (ja) * 2008-03-19 2013-04-10 東京エレクトロン株式会社 シャワーヘッド及び基板処理装置
EP2159304A1 (en) * 2008-08-27 2010-03-03 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Apparatus and method for atomic layer deposition
CN102308368B (zh) 2008-12-04 2014-02-12 威科仪器有限公司 用于化学气相沉积的进气口元件及其制造方法
US8293013B2 (en) * 2008-12-30 2012-10-23 Intermolecular, Inc. Dual path gas distribution device
US20110023775A1 (en) * 2009-07-31 2011-02-03 E.I. Du Pont De Nemours And Company Apparatus for atomic layer deposition
US8657959B2 (en) * 2009-07-31 2014-02-25 E I Du Pont De Nemours And Company Apparatus for atomic layer deposition on a moving substrate
US20110097491A1 (en) * 2009-10-27 2011-04-28 Levy David H Conveyance system including opposed fluid distribution manifolds
US20110097488A1 (en) * 2009-10-27 2011-04-28 Kerr Roger S Fluid distribution manifold including mirrored finish plate
US20110097487A1 (en) * 2009-10-27 2011-04-28 Kerr Roger S Fluid distribution manifold including bonded plates
US20110097493A1 (en) * 2009-10-27 2011-04-28 Kerr Roger S Fluid distribution manifold including non-parallel non-perpendicular slots
US20110097492A1 (en) * 2009-10-27 2011-04-28 Kerr Roger S Fluid distribution manifold operating state management system
US20110097494A1 (en) * 2009-10-27 2011-04-28 Kerr Roger S Fluid conveyance system including flexible retaining mechanism
US20110097489A1 (en) * 2009-10-27 2011-04-28 Kerr Roger S Distribution manifold including multiple fluid communication ports
US20110097490A1 (en) * 2009-10-27 2011-04-28 Kerr Roger S Fluid distribution manifold including compliant plates
US8168546B2 (en) * 2009-11-20 2012-05-01 Eastman Kodak Company Method for selective deposition and devices
WO2011062779A1 (en) 2009-11-20 2011-05-26 Eastman Kodak Company Method for selective deposition and devices
US7998878B2 (en) * 2009-11-20 2011-08-16 Eastman Kodak Company Method for selective deposition and devices
EP2360293A1 (en) 2010-02-11 2011-08-24 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Method and apparatus for depositing atomic layers on a substrate
EP2362001A1 (en) * 2010-02-25 2011-08-31 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Method and device for layer deposition
EP2362411A1 (en) 2010-02-26 2011-08-31 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Apparatus and method for reactive ion etching
US8869742B2 (en) * 2010-08-04 2014-10-28 Lam Research Corporation Plasma processing chamber with dual axial gas injection and exhaust
US9184028B2 (en) 2010-08-04 2015-11-10 Lam Research Corporation Dual plasma volume processing apparatus for neutral/ion flux control
FI20105904A0 (fi) * 2010-08-30 2010-08-30 Beneq Oy Suutinpää
CN102443781A (zh) * 2010-09-30 2012-05-09 财团法人工业技术研究院 气体喷洒模块及其气体喷洒扫描装置
US8133806B1 (en) 2010-09-30 2012-03-13 S.O.I.Tec Silicon On Insulator Technologies Systems and methods for forming semiconductor materials by atomic layer deposition
JP5369304B2 (ja) * 2010-09-30 2013-12-18 ソイテック 原子層堆積によって半導体材料を形成するためのシステム及び方法
US8486192B2 (en) 2010-09-30 2013-07-16 Soitec Thermalizing gas injectors for generating increased precursor gas, material deposition systems including such injectors, and related methods
US20120222620A1 (en) 2011-03-01 2012-09-06 Applied Materials, Inc. Atomic Layer Deposition Carousel with Continuous Rotation and Methods of Use
US8618003B2 (en) 2011-12-05 2013-12-31 Eastman Kodak Company Method of making electronic devices using selective deposition
WO2013108751A1 (ja) * 2012-01-16 2013-07-25 株式会社アルバック 成膜装置
US9748125B2 (en) 2012-01-31 2017-08-29 Applied Materials, Inc. Continuous substrate processing system
US8846545B2 (en) 2012-08-31 2014-09-30 Eastman Kodak Company Method of forming patterned thin film dielectric stack
US8927434B2 (en) 2012-08-31 2015-01-06 Eastman Kodak Company Patterned thin film dielectric stack formation
US8791023B2 (en) 2012-08-31 2014-07-29 Eastman Kodak Company Patterned thin film dielectric layer formation
US8653516B1 (en) 2012-08-31 2014-02-18 Eastman Kodak Company High performance thin film transistor
KR101347046B1 (ko) * 2013-02-04 2014-01-06 주식회사 테스 박막증착장치
JP6333941B2 (ja) 2013-03-11 2018-05-30 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 高温処理チャンバリッド及びそれを備えた処理チャンバ
US8937016B2 (en) 2013-06-21 2015-01-20 Eastman Kodak Company Substrate preparation for selective area deposition
US8921236B1 (en) 2013-06-21 2014-12-30 Eastman Kodak Company Patterning for selective area deposition
CN106030761B (zh) 2014-01-27 2019-09-13 威科仪器有限公司 用于化学气相沉积系统的晶片载体及其制造方法
US9331205B2 (en) 2014-03-06 2016-05-03 Eastman Kodak Company VTFT with post, cap, and aligned gate
US9147770B1 (en) 2014-03-06 2015-09-29 Eastman Kodak Company VTFT with extended electrode
US9236486B2 (en) 2014-03-06 2016-01-12 Eastman Kodak Company Offset independently operable VTFT electrodes
US9198283B2 (en) 2014-03-06 2015-11-24 Eastman Kodak Company Vertically spaced electrode structure
US9123815B1 (en) 2014-03-06 2015-09-01 Eastman Kodak Company VTFTs including offset electrodes
US9142647B1 (en) 2014-03-06 2015-09-22 Eastman Kodak Company VTFT formation using selective area deposition
US9153445B2 (en) 2014-03-06 2015-10-06 Eastman Kodak Company Forming a VTFT with aligned gate
US9202898B2 (en) 2014-03-06 2015-12-01 Eastman Kodak Company Fabricating VTFT with polymer core
US9178029B2 (en) 2014-03-06 2015-11-03 Eastman Kodak Company Forming a VTFT gate using printing
US9214560B2 (en) 2014-03-06 2015-12-15 Eastman Kodak Company VTFT including overlapping electrodes
WO2015134082A1 (en) 2014-03-06 2015-09-11 Eastman Kodak Company Vtft with polymer core
US9117914B1 (en) 2014-03-06 2015-08-25 Eastman Kodak Company VTFT with polymer core
US9153698B2 (en) 2014-03-06 2015-10-06 Eastman Kodak Company VTFT with gate aligned to vertical structure
US9129993B1 (en) 2014-03-06 2015-09-08 Eastman Kodak Company Forming a VTFT using printing
US9093470B1 (en) 2014-03-06 2015-07-28 Eastman Kodak Company VTFT formation using capillary action
KR101670382B1 (ko) * 2015-03-10 2016-10-28 우범제 퍼지가스 분사 플레이트 및 그 제조 방법
US10584413B2 (en) 2017-03-14 2020-03-10 Eastman Kodak Company Vertical system with vacuum pre-loaded deposition head
US10435788B2 (en) 2017-03-14 2019-10-08 Eastman Kodak Deposition system with repeating motion profile
US10501848B2 (en) 2017-03-14 2019-12-10 Eastman Kodak Company Deposition system with modular deposition heads
US11248292B2 (en) 2017-03-14 2022-02-15 Eastman Kodak Company Deposition system with moveable-position web guides
US10550476B2 (en) 2017-03-14 2020-02-04 Eastman Kodak Company Heated gas-bearing backer
US20180265977A1 (en) 2017-03-14 2018-09-20 Eastman Kodak Company Deposition system with vacuum pre-loaded deposition head
US10400332B2 (en) * 2017-03-14 2019-09-03 Eastman Kodak Company Deposition system with interlocking deposition heads
US10422038B2 (en) 2017-03-14 2019-09-24 Eastman Kodak Company Dual gas bearing substrate positioning system
US10895011B2 (en) 2017-03-14 2021-01-19 Eastman Kodak Company Modular thin film deposition system
US10943768B2 (en) * 2018-04-20 2021-03-09 Applied Materials, Inc. Modular high-frequency source with integrated gas distribution
US11306396B2 (en) * 2018-11-30 2022-04-19 Meidensha Corporation Oxide film forming device
TWI725444B (zh) * 2019-06-04 2021-04-21 金碳洁股份有限公司 循環式磊晶沉積系統及其氣體分流模組
JP7098677B2 (ja) 2020-03-25 2022-07-11 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法及びプログラム
JP2024507151A (ja) * 2021-02-12 2024-02-16 ユージェヌス インコーポレイテッド 高速周期的堆積のための前駆体送達システム及び方法
NL2035766B1 (en) * 2023-09-08 2025-03-14 Sparknano B V Plasma source for patterned deposition

Family Cites Families (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2734224A (en) * 1956-02-14 winstead
US3615054A (en) * 1965-09-24 1971-10-26 Aerojet General Co Injectors
US3899136A (en) * 1974-04-01 1975-08-12 Harmony Emitter Company Inc Emitter for irrigation systems
US4081136A (en) * 1977-01-21 1978-03-28 The United States Of America As Represented By The Secretary Of The Air Force Dual manifold high performance throttleable injector
FI57975C (fi) 1979-02-28 1980-11-10 Lohja Ab Oy Foerfarande och anordning vid uppbyggande av tunna foereningshinnor
US4550681A (en) * 1982-10-07 1985-11-05 Johannes Zimmer Applicator for uniformly distributing a flowable material over a receiving surface
US4475478A (en) * 1983-04-08 1984-10-09 International Business Machines Corporation Coating apparatus
US4590042A (en) * 1984-12-24 1986-05-20 Tegal Corporation Plasma reactor having slotted manifold
US4749125A (en) * 1987-01-16 1988-06-07 Terronics Development Corp. Nozzle method and apparatus
JPH0643631B2 (ja) * 1987-02-10 1994-06-08 旭硝子株式会社 常圧ｃｖｄ用ガス導入ノズル
DE4011933C2 (de) * 1990-04-12 1996-11-21 Balzers Hochvakuum Verfahren zur reaktiven Oberflächenbehandlung eines Werkstückes sowie Behandlungskammer hierfür
CA2016970A1 (en) * 1990-05-16 1991-11-16 Prasad N. Gadgil Inverted diffusion stagnation point flow reactor for vapor deposition of thin films
EP0518524B1 (en) * 1991-05-30 1996-09-04 Hitachi, Ltd. Valve and semiconductor fabricating equipment using the same
US5160403A (en) * 1991-08-09 1992-11-03 Xerox Corporation Precision diced aligning surfaces for devices such as ink jet printheads
US5209410A (en) * 1992-03-05 1993-05-11 United Air Specialists, Inc. Electrostatic dispensing nozzle assembly
IL107120A (en) * 1992-09-29 1997-09-30 Boehringer Ingelheim Int Atomising nozzle and filter and spray generating device
US5441204A (en) * 1993-06-10 1995-08-15 United Air Specialists, Inc. Electrostatic fluid distribution nozzle
US5589002A (en) * 1994-03-24 1996-12-31 Applied Materials, Inc. Gas distribution plate for semiconductor wafer processing apparatus with means for inhibiting arcing
US5503336A (en) * 1994-07-14 1996-04-02 United Air Specialists High volume - low volume electrostatic dispensing nozzle assembly
US6200389B1 (en) * 1994-07-18 2001-03-13 Silicon Valley Group Thermal Systems Llc Single body injector and deposition chamber
US5609305A (en) * 1994-09-19 1997-03-11 Vortec Corporation Apparatus for providing an air curtain
JPH0945624A (ja) * 1995-07-27 1997-02-14 Tokyo Electron Ltd 枚葉式の熱処理装置
JP3360265B2 (ja) * 1996-04-26 2002-12-24 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理装置
KR100505310B1 (ko) * 1998-05-13 2005-08-04 동경 엘렉트론 주식회사 성막 장치 및 방법
US6289842B1 (en) * 1998-06-22 2001-09-18 Structured Materials Industries Inc. Plasma enhanced chemical vapor deposition system
US6245192B1 (en) * 1999-06-30 2001-06-12 Lam Research Corporation Gas distribution apparatus for semiconductor processing
JP4487338B2 (ja) * 1999-08-31 2010-06-23 東京エレクトロン株式会社 成膜処理装置及び成膜処理方法
KR20010062209A (ko) * 1999-12-10 2001-07-07 히가시 데쓰로 고내식성 막이 내부에 형성된 챔버를 구비하는 처리 장치
US6503330B1 (en) * 1999-12-22 2003-01-07 Genus, Inc. Apparatus and method to achieve continuous interface and ultrathin film during atomic layer deposition
JP3578398B2 (ja) * 2000-06-22 2004-10-20 古河スカイ株式会社 成膜用ガス分散プレート及びその製造方法
KR100516844B1 (ko) * 2001-01-22 2005-09-26 동경 엘렉트론 주식회사 처리 장치 및 처리 방법
SG94753A1 (en) * 2001-02-06 2003-03-18 Inst Of High Performance Compu Microvalve devices
JP2002359235A (ja) * 2001-05-30 2002-12-13 C Bui Res:Kk Ｃｖｄ装置用ガス散布機構部構造
SG104976A1 (en) * 2001-07-13 2004-07-30 Asml Us Inc Modular injector and exhaust assembly
WO2003063222A1 (en) * 2002-01-24 2003-07-31 Sumitomo Precision Products Co., Ltd. Ozone-processing device
US6793733B2 (en) * 2002-01-25 2004-09-21 Applied Materials Inc. Gas distribution showerhead
US6932871B2 (en) * 2002-04-16 2005-08-23 Applied Materials, Inc. Multi-station deposition apparatus and method
JP2004014953A (ja) * 2002-06-10 2004-01-15 Tokyo Electron Ltd 処理装置および処理方法
US20050084610A1 (en) * 2002-08-13 2005-04-21 Selitser Simon I. Atmospheric pressure molecular layer CVD
US20040065255A1 (en) * 2002-10-02 2004-04-08 Applied Materials, Inc. Cyclical layer deposition system
US6821563B2 (en) * 2002-10-02 2004-11-23 Applied Materials, Inc. Gas distribution system for cyclical layer deposition
US7601223B2 (en) * 2003-04-29 2009-10-13 Asm International N.V. Showerhead assembly and ALD methods
WO2005024928A1 (ja) * 2003-09-03 2005-03-17 Tokyo Electron Limited ガス処理装置および放熱方法
US20050103265A1 (en) * 2003-11-19 2005-05-19 Applied Materials, Inc., A Delaware Corporation Gas distribution showerhead featuring exhaust apertures
US7456429B2 (en) * 2006-03-29 2008-11-25 Eastman Kodak Company Apparatus for atomic layer deposition
US7789961B2 (en) * 2007-01-08 2010-09-07 Eastman Kodak Company Delivery device comprising gas diffuser for thin film deposition
US20080166880A1 (en) * 2007-01-08 2008-07-10 Levy David H Delivery device for deposition
US11136667B2 (en) * 2007-01-08 2021-10-05 Eastman Kodak Company Deposition system and method using a delivery head separated from a substrate by gas pressure
US8182608B2 (en) * 2007-09-26 2012-05-22 Eastman Kodak Company Deposition system for thin film formation
US7572686B2 (en) * 2007-09-26 2009-08-11 Eastman Kodak Company System for thin film deposition utilizing compensating forces
US7858144B2 (en) * 2007-09-26 2010-12-28 Eastman Kodak Company Process for depositing organic materials
US8398770B2 (en) * 2007-09-26 2013-03-19 Eastman Kodak Company Deposition system for thin film formation
US20090079328A1 (en) * 2007-09-26 2009-03-26 Fedorovskaya Elena A Thin film encapsulation containing zinc oxide
US8211231B2 (en) * 2007-09-26 2012-07-03 Eastman Kodak Company Delivery device for deposition
US7851380B2 (en) * 2007-09-26 2010-12-14 Eastman Kodak Company Process for atomic layer deposition
US20090095222A1 (en) * 2007-10-16 2009-04-16 Alexander Tam Multi-gas spiral channel showerhead

Similar Documents

Publication Publication Date Title
JP2010541241A5 (enExample)
JP2010515822A5 (enExample)
WO2009042145A3 (en) Delivery device for deposition
JP2010541242A5 (enExample)
JP5863050B2 (ja) ガスシャワーヘッド、その製造方法及び薄膜成長反応装置
JP2010515821A5 (enExample)
JP6615336B2 (ja) 基板処理装置及びチューブ組立体の組立方法
JP4239520B2 (ja) 成膜装置およびその製造方法、並びにインジェクタ
JP2010538277A5 (enExample)
CN104975271B (zh) 进气装置以及半导体加工设备
TW200408718A (en) Thin film-forming apparatus
JP2004214669A (ja) 薄膜蒸着用反応容器
TWI725444B (zh) 循環式磊晶沉積系統及其氣體分流模組
WO2014198134A1 (zh) 一种用于金属有机化学气相沉积反应器的管道冷却式气体分布装置
JP4978554B2 (ja) 薄膜の気相成長方法および気相成長装置
JP2015068637A (ja) 乾燥装置及び乾燥方法
JP2024133720A (ja) 厚肉プレートを備える積層ノズル
WO2024193388A1 (zh) 基片处理设备及处理方法
JP6226419B2 (ja) 浮上搬送装置
JPWO2017068625A1 (ja) 成膜装置
JP2015523309A5 (enExample)
CN116695098B (zh) 一种喷淋板、喷淋方法及处理装置
JP2020529721A5 (enExample)
CA2524487A1 (en) Vacuum deposition apparatus and method and solar cell material
JP2008231574A (ja) プラズマコーティングチャンバ用吸引装置