JP2010515822A5 - - Google Patents
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- Publication number
- JP2010515822A5 JP2010515822A5 JP2009544852A JP2009544852A JP2010515822A5 JP 2010515822 A5 JP2010515822 A5 JP 2010515822A5 JP 2009544852 A JP2009544852 A JP 2009544852A JP 2009544852 A JP2009544852 A JP 2009544852A JP 2010515822 A5 JP2010515822 A5 JP 2010515822A5
- Authority
- JP
- Japan
- Prior art keywords
- elongate
- channels
- gaseous material
- channel
- gaseous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims 35
- 239000000758 substrate Substances 0.000 claims 11
- 238000000151 deposition Methods 0.000 claims 5
- 239000010409 thin film Substances 0.000 claims 5
- 239000012530 fluid Substances 0.000 claims 4
- 238000000034 method Methods 0.000 claims 2
- 238000010926 purge Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/620,738 US20080166880A1 (en) | 2007-01-08 | 2007-01-08 | Delivery device for deposition |
| PCT/US2007/026314 WO2008085468A1 (en) | 2007-01-08 | 2007-12-26 | Delivery device for deposition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010515822A JP2010515822A (ja) | 2010-05-13 |
| JP2010515822A5 true JP2010515822A5 (enExample) | 2010-12-09 |
Family
ID=39284739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009544852A Pending JP2010515822A (ja) | 2007-01-08 | 2007-12-26 | 堆積用供給装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20080166880A1 (enExample) |
| EP (1) | EP2102382A1 (enExample) |
| JP (1) | JP2010515822A (enExample) |
| TW (1) | TW200902750A (enExample) |
| WO (1) | WO2008085468A1 (enExample) |
Families Citing this family (66)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7789961B2 (en) * | 2007-01-08 | 2010-09-07 | Eastman Kodak Company | Delivery device comprising gas diffuser for thin film deposition |
| US11136667B2 (en) * | 2007-01-08 | 2021-10-05 | Eastman Kodak Company | Deposition system and method using a delivery head separated from a substrate by gas pressure |
| US7572686B2 (en) * | 2007-09-26 | 2009-08-11 | Eastman Kodak Company | System for thin film deposition utilizing compensating forces |
| US8398770B2 (en) * | 2007-09-26 | 2013-03-19 | Eastman Kodak Company | Deposition system for thin film formation |
| US8211231B2 (en) * | 2007-09-26 | 2012-07-03 | Eastman Kodak Company | Delivery device for deposition |
| US8182608B2 (en) * | 2007-09-26 | 2012-05-22 | Eastman Kodak Company | Deposition system for thin film formation |
| US7972898B2 (en) * | 2007-09-26 | 2011-07-05 | Eastman Kodak Company | Process for making doped zinc oxide |
| JP5179389B2 (ja) * | 2008-03-19 | 2013-04-10 | 東京エレクトロン株式会社 | シャワーヘッド及び基板処理装置 |
| EP2159304A1 (en) * | 2008-08-27 | 2010-03-03 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Apparatus and method for atomic layer deposition |
| CN102308368B (zh) | 2008-12-04 | 2014-02-12 | 威科仪器有限公司 | 用于化学气相沉积的进气口元件及其制造方法 |
| US8293013B2 (en) * | 2008-12-30 | 2012-10-23 | Intermolecular, Inc. | Dual path gas distribution device |
| FR2956869B1 (fr) * | 2010-03-01 | 2014-05-16 | Alex Hr Roustaei | Systeme de production de film flexible a haute capacite destine a des cellules photovoltaiques et oled par deposition cyclique des couches |
| US8758512B2 (en) * | 2009-06-08 | 2014-06-24 | Veeco Ald Inc. | Vapor deposition reactor and method for forming thin film |
| US8657959B2 (en) * | 2009-07-31 | 2014-02-25 | E I Du Pont De Nemours And Company | Apparatus for atomic layer deposition on a moving substrate |
| US20110023775A1 (en) * | 2009-07-31 | 2011-02-03 | E.I. Du Pont De Nemours And Company | Apparatus for atomic layer deposition |
| US20110097488A1 (en) * | 2009-10-27 | 2011-04-28 | Kerr Roger S | Fluid distribution manifold including mirrored finish plate |
| US20110097491A1 (en) * | 2009-10-27 | 2011-04-28 | Levy David H | Conveyance system including opposed fluid distribution manifolds |
| US20110097487A1 (en) | 2009-10-27 | 2011-04-28 | Kerr Roger S | Fluid distribution manifold including bonded plates |
| US20110097490A1 (en) * | 2009-10-27 | 2011-04-28 | Kerr Roger S | Fluid distribution manifold including compliant plates |
| US20110097493A1 (en) | 2009-10-27 | 2011-04-28 | Kerr Roger S | Fluid distribution manifold including non-parallel non-perpendicular slots |
| US20110097489A1 (en) * | 2009-10-27 | 2011-04-28 | Kerr Roger S | Distribution manifold including multiple fluid communication ports |
| US20110097492A1 (en) * | 2009-10-27 | 2011-04-28 | Kerr Roger S | Fluid distribution manifold operating state management system |
| US20110097494A1 (en) * | 2009-10-27 | 2011-04-28 | Kerr Roger S | Fluid conveyance system including flexible retaining mechanism |
| WO2011062779A1 (en) | 2009-11-20 | 2011-05-26 | Eastman Kodak Company | Method for selective deposition and devices |
| US7998878B2 (en) * | 2009-11-20 | 2011-08-16 | Eastman Kodak Company | Method for selective deposition and devices |
| JP5052638B2 (ja) * | 2010-03-17 | 2012-10-17 | Sppテクノロジーズ株式会社 | 成膜方法 |
| US8869742B2 (en) * | 2010-08-04 | 2014-10-28 | Lam Research Corporation | Plasma processing chamber with dual axial gas injection and exhaust |
| US8486192B2 (en) | 2010-09-30 | 2013-07-16 | Soitec | Thermalizing gas injectors for generating increased precursor gas, material deposition systems including such injectors, and related methods |
| US8133806B1 (en) | 2010-09-30 | 2012-03-13 | S.O.I.Tec Silicon On Insulator Technologies | Systems and methods for forming semiconductor materials by atomic layer deposition |
| US20120222620A1 (en) | 2011-03-01 | 2012-09-06 | Applied Materials, Inc. | Atomic Layer Deposition Carousel with Continuous Rotation and Methods of Use |
| US20120225191A1 (en) * | 2011-03-01 | 2012-09-06 | Applied Materials, Inc. | Apparatus and Process for Atomic Layer Deposition |
| US9051637B2 (en) * | 2011-11-10 | 2015-06-09 | Veeco Ald Inc. | Securing of shadow mask and substrate on susceptor of deposition apparatus |
| US8618003B2 (en) | 2011-12-05 | 2013-12-31 | Eastman Kodak Company | Method of making electronic devices using selective deposition |
| US9748125B2 (en) | 2012-01-31 | 2017-08-29 | Applied Materials, Inc. | Continuous substrate processing system |
| KR101435100B1 (ko) * | 2012-06-20 | 2014-08-29 | 주식회사 엠티에스나노테크 | 원자층 증착 장치 |
| US8653516B1 (en) | 2012-08-31 | 2014-02-18 | Eastman Kodak Company | High performance thin film transistor |
| US8846545B2 (en) | 2012-08-31 | 2014-09-30 | Eastman Kodak Company | Method of forming patterned thin film dielectric stack |
| US8791023B2 (en) | 2012-08-31 | 2014-07-29 | Eastman Kodak Company | Patterned thin film dielectric layer formation |
| US8927434B2 (en) | 2012-08-31 | 2015-01-06 | Eastman Kodak Company | Patterned thin film dielectric stack formation |
| US9175389B2 (en) * | 2012-12-21 | 2015-11-03 | Intermolecular, Inc. | ALD process window combinatorial screening tool |
| TWI624560B (zh) * | 2013-02-18 | 2018-05-21 | 應用材料股份有限公司 | 用於原子層沉積的氣體分配板及原子層沉積系統 |
| JP6333941B2 (ja) | 2013-03-11 | 2018-05-30 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 高温処理チャンバリッド及びそれを備えた処理チャンバ |
| US8937016B2 (en) | 2013-06-21 | 2015-01-20 | Eastman Kodak Company | Substrate preparation for selective area deposition |
| US8921236B1 (en) | 2013-06-21 | 2014-12-30 | Eastman Kodak Company | Patterning for selective area deposition |
| US9957612B2 (en) | 2014-01-17 | 2018-05-01 | Ceres Technologies, Inc. | Delivery device, methods of manufacture thereof and articles comprising the same |
| US9202898B2 (en) | 2014-03-06 | 2015-12-01 | Eastman Kodak Company | Fabricating VTFT with polymer core |
| US9178029B2 (en) | 2014-03-06 | 2015-11-03 | Eastman Kodak Company | Forming a VTFT gate using printing |
| US9214560B2 (en) | 2014-03-06 | 2015-12-15 | Eastman Kodak Company | VTFT including overlapping electrodes |
| US9236486B2 (en) | 2014-03-06 | 2016-01-12 | Eastman Kodak Company | Offset independently operable VTFT electrodes |
| US9129993B1 (en) | 2014-03-06 | 2015-09-08 | Eastman Kodak Company | Forming a VTFT using printing |
| US9198283B2 (en) | 2014-03-06 | 2015-11-24 | Eastman Kodak Company | Vertically spaced electrode structure |
| WO2015134082A1 (en) | 2014-03-06 | 2015-09-11 | Eastman Kodak Company | Vtft with polymer core |
| US9153698B2 (en) | 2014-03-06 | 2015-10-06 | Eastman Kodak Company | VTFT with gate aligned to vertical structure |
| US9153445B2 (en) | 2014-03-06 | 2015-10-06 | Eastman Kodak Company | Forming a VTFT with aligned gate |
| US9142647B1 (en) | 2014-03-06 | 2015-09-22 | Eastman Kodak Company | VTFT formation using selective area deposition |
| US9093470B1 (en) | 2014-03-06 | 2015-07-28 | Eastman Kodak Company | VTFT formation using capillary action |
| US9117914B1 (en) | 2014-03-06 | 2015-08-25 | Eastman Kodak Company | VTFT with polymer core |
| US9123815B1 (en) | 2014-03-06 | 2015-09-01 | Eastman Kodak Company | VTFTs including offset electrodes |
| US9147770B1 (en) | 2014-03-06 | 2015-09-29 | Eastman Kodak Company | VTFT with extended electrode |
| US9331205B2 (en) | 2014-03-06 | 2016-05-03 | Eastman Kodak Company | VTFT with post, cap, and aligned gate |
| CN108291303B (zh) * | 2015-12-17 | 2020-07-21 | 倍耐克有限公司 | 涂覆前体喷嘴和喷嘴头 |
| US10400332B2 (en) * | 2017-03-14 | 2019-09-03 | Eastman Kodak Company | Deposition system with interlocking deposition heads |
| KR102462797B1 (ko) * | 2018-06-18 | 2022-11-04 | 어플라이드 머티어리얼스, 인코포레이티드 | 개선된 펌프-퍼지 및 전구체 전달을 위한 가스 분배 조립체 |
| US11306396B2 (en) * | 2018-11-30 | 2022-04-19 | Meidensha Corporation | Oxide film forming device |
| NL2027074B1 (en) * | 2020-12-08 | 2022-07-07 | Kalpana Tech B V | Roll-to-roll processing |
| CN119069333B (zh) * | 2024-11-06 | 2025-03-07 | 上海钧乾智造科技有限公司 | 一种电池片先驱体供给装置 |
Family Cites Families (53)
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|---|---|---|---|---|
| FI57975C (fi) * | 1979-02-28 | 1980-11-10 | Lohja Ab Oy | Foerfarande och anordning vid uppbyggande av tunna foereningshinnor |
| US4590042A (en) * | 1984-12-24 | 1986-05-20 | Tegal Corporation | Plasma reactor having slotted manifold |
| JPS62142783A (ja) * | 1985-12-18 | 1987-06-26 | Canon Inc | プラズマcvd法による堆積膜形成装置 |
| US4801352A (en) * | 1986-12-30 | 1989-01-31 | Image Micro Systems, Inc. | Flowing gas seal enclosure for processing workpiece surface with controlled gas environment and intense laser irradiation |
| JP2679073B2 (ja) * | 1987-01-27 | 1997-11-19 | 旭硝子株式会社 | 常圧cvd用ガス導入ノズル |
| DE4011933C2 (de) * | 1990-04-12 | 1996-11-21 | Balzers Hochvakuum | Verfahren zur reaktiven Oberflächenbehandlung eines Werkstückes sowie Behandlungskammer hierfür |
| CA2016970A1 (en) * | 1990-05-16 | 1991-11-16 | Prasad N. Gadgil | Inverted diffusion stagnation point flow reactor for vapor deposition of thin films |
| US5136975A (en) * | 1990-06-21 | 1992-08-11 | Watkins-Johnson Company | Injector and method for delivering gaseous chemicals to a surface |
| EP0518524B1 (en) * | 1991-05-30 | 1996-09-04 | Hitachi, Ltd. | Valve and semiconductor fabricating equipment using the same |
| US5589002A (en) * | 1994-03-24 | 1996-12-31 | Applied Materials, Inc. | Gas distribution plate for semiconductor wafer processing apparatus with means for inhibiting arcing |
| US6022414A (en) * | 1994-07-18 | 2000-02-08 | Semiconductor Equipment Group, Llc | Single body injector and method for delivering gases to a surface |
| US6200389B1 (en) * | 1994-07-18 | 2001-03-13 | Silicon Valley Group Thermal Systems Llc | Single body injector and deposition chamber |
| JP3360098B2 (ja) * | 1995-04-20 | 2002-12-24 | 東京エレクトロン株式会社 | 処理装置のシャワーヘッド構造 |
| JPH0945624A (ja) * | 1995-07-27 | 1997-02-14 | Tokyo Electron Ltd | 枚葉式の熱処理装置 |
| US6005226A (en) * | 1997-11-24 | 1999-12-21 | Steag-Rtp Systems | Rapid thermal processing (RTP) system with gas driven rotating substrate |
| US6302964B1 (en) * | 1998-06-16 | 2001-10-16 | Applied Materials, Inc. | One-piece dual gas faceplate for a showerhead in a semiconductor wafer processing system |
| US6148761A (en) * | 1998-06-16 | 2000-11-21 | Applied Materials, Inc. | Dual channel gas distribution plate |
| US6086677A (en) * | 1998-06-16 | 2000-07-11 | Applied Materials, Inc. | Dual gas faceplate for a showerhead in a semiconductor wafer processing system |
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| SG104976A1 (en) * | 2001-07-13 | 2004-07-30 | Asml Us Inc | Modular injector and exhaust assembly |
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| JP4364494B2 (ja) * | 2002-10-07 | 2009-11-18 | 積水化学工業株式会社 | プラズマ表面処理装置 |
| US20040142558A1 (en) * | 2002-12-05 | 2004-07-22 | Granneman Ernst H. A. | Apparatus and method for atomic layer deposition on substrates |
| JP3946655B2 (ja) * | 2003-03-26 | 2007-07-18 | 株式会社日立ハイテクノロジーズ | 試料載置用可動ステージ、回路パターンの製造装置、及び回路パターンの検査装置 |
| US7601223B2 (en) * | 2003-04-29 | 2009-10-13 | Asm International N.V. | Showerhead assembly and ALD methods |
| US20050103265A1 (en) * | 2003-11-19 | 2005-05-19 | Applied Materials, Inc., A Delaware Corporation | Gas distribution showerhead featuring exhaust apertures |
| JP2005216132A (ja) * | 2004-01-30 | 2005-08-11 | Sumitomo Eaton Noba Kk | 移動装置の制御方法、及び移動装置の連動装置、及び移動装置の連動方法、及び半導体製造装置、及び液晶製造装置、及びメカニカルスキャンイオン注入装置 |
| US7456429B2 (en) * | 2006-03-29 | 2008-11-25 | Eastman Kodak Company | Apparatus for atomic layer deposition |
| US7413982B2 (en) * | 2006-03-29 | 2008-08-19 | Eastman Kodak Company | Process for atomic layer deposition |
| US11136667B2 (en) * | 2007-01-08 | 2021-10-05 | Eastman Kodak Company | Deposition system and method using a delivery head separated from a substrate by gas pressure |
| US7789961B2 (en) * | 2007-01-08 | 2010-09-07 | Eastman Kodak Company | Delivery device comprising gas diffuser for thin film deposition |
| US8207063B2 (en) * | 2007-01-26 | 2012-06-26 | Eastman Kodak Company | Process for atomic layer deposition |
| US7572686B2 (en) * | 2007-09-26 | 2009-08-11 | Eastman Kodak Company | System for thin film deposition utilizing compensating forces |
| US7858144B2 (en) * | 2007-09-26 | 2010-12-28 | Eastman Kodak Company | Process for depositing organic materials |
| US8398770B2 (en) * | 2007-09-26 | 2013-03-19 | Eastman Kodak Company | Deposition system for thin film formation |
| US20090081356A1 (en) * | 2007-09-26 | 2009-03-26 | Fedorovskaya Elena A | Process for forming thin film encapsulation layers |
| US8017183B2 (en) * | 2007-09-26 | 2011-09-13 | Eastman Kodak Company | Organosiloxane materials for selective area deposition of inorganic materials |
| US7972898B2 (en) * | 2007-09-26 | 2011-07-05 | Eastman Kodak Company | Process for making doped zinc oxide |
| US8182608B2 (en) * | 2007-09-26 | 2012-05-22 | Eastman Kodak Company | Deposition system for thin film formation |
| US20090079328A1 (en) * | 2007-09-26 | 2009-03-26 | Fedorovskaya Elena A | Thin film encapsulation containing zinc oxide |
| US8211231B2 (en) * | 2007-09-26 | 2012-07-03 | Eastman Kodak Company | Delivery device for deposition |
| US8030212B2 (en) * | 2007-09-26 | 2011-10-04 | Eastman Kodak Company | Process for selective area deposition of inorganic materials |
| US20090095222A1 (en) * | 2007-10-16 | 2009-04-16 | Alexander Tam | Multi-gas spiral channel showerhead |
| US7846644B2 (en) * | 2007-11-20 | 2010-12-07 | Eastman Kodak Company | Photopatternable deposition inhibitor containing siloxane |
-
2007
- 2007-01-08 US US11/620,738 patent/US20080166880A1/en not_active Abandoned
- 2007-12-26 WO PCT/US2007/026314 patent/WO2008085468A1/en not_active Ceased
- 2007-12-26 JP JP2009544852A patent/JP2010515822A/ja active Pending
- 2007-12-26 EP EP07868027A patent/EP2102382A1/en not_active Withdrawn
-
2008
- 2008-01-07 TW TW097100606A patent/TW200902750A/zh unknown
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