JP2010538491A5 - - Google Patents

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Publication number
JP2010538491A5
JP2010538491A5 JP2010523955A JP2010523955A JP2010538491A5 JP 2010538491 A5 JP2010538491 A5 JP 2010538491A5 JP 2010523955 A JP2010523955 A JP 2010523955A JP 2010523955 A JP2010523955 A JP 2010523955A JP 2010538491 A5 JP2010538491 A5 JP 2010538491A5
Authority
JP
Japan
Prior art keywords
layer
nitride
nitride layer
insulating
type semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010523955A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010538491A (ja
Filing date
Publication date
Priority claimed from KR1020070090685A external-priority patent/KR101459754B1/ko
Application filed filed Critical
Publication of JP2010538491A publication Critical patent/JP2010538491A/ja
Publication of JP2010538491A5 publication Critical patent/JP2010538491A5/ja
Pending legal-status Critical Current

Links

JP2010523955A 2007-09-06 2008-09-05 半導体発光素子及びその製造方法 Pending JP2010538491A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020070090685A KR101459754B1 (ko) 2007-09-06 2007-09-06 반도체 발광소자 및 그 제조방법
PCT/KR2008/005266 WO2009031858A2 (en) 2007-09-06 2008-09-05 Semiconductor light emitting device and method of fabricating the same

Publications (2)

Publication Number Publication Date
JP2010538491A JP2010538491A (ja) 2010-12-09
JP2010538491A5 true JP2010538491A5 (enExample) 2012-09-06

Family

ID=40429560

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010523955A Pending JP2010538491A (ja) 2007-09-06 2008-09-05 半導体発光素子及びその製造方法

Country Status (6)

Country Link
US (1) US8299493B2 (enExample)
EP (1) EP2195862B1 (enExample)
JP (1) JP2010538491A (enExample)
KR (1) KR101459754B1 (enExample)
CN (2) CN101796658B (enExample)
WO (1) WO2009031858A2 (enExample)

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US8994052B2 (en) * 2008-03-04 2015-03-31 Epistar Corporation High-efficiency light-emitting device and manufacturing method thereof
US8481411B2 (en) * 2009-06-10 2013-07-09 Seoul Opto Device Co., Ltd. Method of manufacturing a semiconductor substrate having a cavity
US8860183B2 (en) * 2009-06-10 2014-10-14 Seoul Viosys Co., Ltd. Semiconductor substrate, semiconductor device, and manufacturing methods thereof
WO2010143778A1 (ko) * 2009-06-10 2010-12-16 서울옵토디바이스주식회사 반도체 기판, 그 제조 방법, 반도체 소자 및 그 제조 방법
CN104795313B (zh) 2009-08-26 2017-12-08 首尔伟傲世有限公司 制造半导体基底的方法和制造发光装置的方法
US8597961B2 (en) * 2009-10-20 2013-12-03 Walsin Lihwa Corporation Method for improving internal quantum efficiency of group-III nitride-based light emitting device
KR100999684B1 (ko) * 2009-10-21 2010-12-08 엘지이노텍 주식회사 발광 소자 및 그 제조방법
JP5570838B2 (ja) * 2010-02-10 2014-08-13 ソウル バイオシス カンパニー リミテッド 半導体基板、その製造方法、半導体デバイス及びその製造方法
KR20120092325A (ko) * 2011-02-11 2012-08-21 서울옵토디바이스주식회사 광 결정 구조를 갖는 발광 다이오드 및 그것을 제조하는 방법
WO2013063020A1 (en) * 2011-10-24 2013-05-02 The Regents Of The University Of California SUPPRESSION OF RELAXATION BY LIMITED AREA EPITAXY ON NON-C-PLANE (In,Al,B,Ga)N
WO2013133593A1 (ko) * 2012-03-08 2013-09-12 서울옵토디바이스주식회사 광추출 효율이 개선된 발광다이오드 및 그 제조방법
CN102738334B (zh) * 2012-06-19 2015-07-08 厦门市三安光电科技有限公司 具有电流扩展层的发光二极管及其制作方法
US9450150B2 (en) * 2012-10-22 2016-09-20 Sharp Kabushiki Kaisha Nitride semiconductor light-emitting element
TWI539625B (zh) * 2013-10-22 2016-06-21 璨圓光電股份有限公司 半導體發光元件及其製造方法
CN113363358B (zh) * 2021-05-31 2022-06-03 厦门乾照光电股份有限公司 一种led芯片

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US4888300A (en) * 1985-11-07 1989-12-19 Fairchild Camera And Instrument Corporation Submerged wall isolation of silicon islands
JP3158869B2 (ja) * 1993-06-30 2001-04-23 日立電線株式会社 発光ダイオード及びその製造方法
JPH08335684A (ja) * 1995-06-08 1996-12-17 Toshiba Corp 半導体装置
JP2000101135A (ja) * 1998-09-24 2000-04-07 Toshiba Corp 化合物半導体素子
JP2001267242A (ja) * 2000-03-14 2001-09-28 Toyoda Gosei Co Ltd Ｉｉｉ族窒化物系化合物半導体及びその製造方法
US6627974B2 (en) * 2000-06-19 2003-09-30 Nichia Corporation Nitride semiconductor substrate and method for manufacturing the same, and nitride semiconductor device using nitride semiconductor substrate
JP4556300B2 (ja) * 2000-07-18 2010-10-06 ソニー株式会社 結晶成長方法
TW486829B (en) * 2000-11-16 2002-05-11 United Epitaxy Co Ltd Epitaxial growth of nitride semiconductor
JP4876319B2 (ja) * 2001-03-09 2012-02-15 ソニー株式会社 表示装置およびその製造方法
US7170097B2 (en) * 2003-02-14 2007-01-30 Cree, Inc. Inverted light emitting diode on conductive substrate
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US7768024B2 (en) * 2005-12-02 2010-08-03 The Regents Of The University Of California Horizontal emitting, vertical emitting, beam shaped, distributed feedback (DFB) lasers fabricated by growth over a patterned substrate with multiple overgrowth
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KR100580751B1 (ko) 2004-12-23 2006-05-15 엘지이노텍 주식회사 질화물 반도체 발광소자 및 그 제조방법
JP4645225B2 (ja) 2005-02-24 2011-03-09 豊田合成株式会社 半導体素子の製造方法
KR100638818B1 (ko) * 2005-05-19 2006-10-27 삼성전기주식회사 질화물 반도체 발광소자
KR100658938B1 (ko) * 2005-05-24 2006-12-15 엘지전자 주식회사 나노 로드를 갖는 발광 소자 및 그의 제조 방법
US20100015739A1 (en) * 2005-06-25 2010-01-21 Epiplus Co., Ltd. Semiconductor light emitting device having improved luminance and manufacturing method thereof
TWI253771B (en) 2005-07-25 2006-04-21 Formosa Epitaxy Inc Light emitting diode structure
TWI270222B (en) * 2005-10-07 2007-01-01 Formosa Epitaxy Inc Light emitting diode chip
KR100700529B1 (ko) 2005-10-17 2007-03-28 엘지전자 주식회사 전류 확산층을 구비한 발광 다이오드 및 그 제조 방법
CN101009342A (zh) * 2006-01-26 2007-08-01 璨圆光电股份有限公司 发光二极管结构

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