WO2009078482A1 - 半導体発光素子 - Google Patents

半導体発光素子 Download PDF

Info

Publication number
WO2009078482A1
WO2009078482A1 PCT/JP2008/073189 JP2008073189W WO2009078482A1 WO 2009078482 A1 WO2009078482 A1 WO 2009078482A1 JP 2008073189 W JP2008073189 W JP 2008073189W WO 2009078482 A1 WO2009078482 A1 WO 2009078482A1
Authority
WO
WIPO (PCT)
Prior art keywords
type gan
gan layer
layer
transparent electrode
type
Prior art date
Application number
PCT/JP2008/073189
Other languages
English (en)
French (fr)
Inventor
Yukio Shakuda
Original Assignee
Rohm Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co., Ltd. filed Critical Rohm Co., Ltd.
Priority to JP2009546301A priority Critical patent/JPWO2009078482A1/ja
Priority to EP08861844A priority patent/EP2237382A4/en
Priority to CN2008801218853A priority patent/CN101904064A/zh
Priority to US12/809,233 priority patent/US8411718B2/en
Publication of WO2009078482A1 publication Critical patent/WO2009078482A1/ja

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/32Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/323Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
    • H01S5/32308Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
    • H01S5/32341Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/04Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042Electrical excitation ; Circuits therefor
    • H01S5/0425Electrodes, e.g. characterised by the structure
    • H01S5/04252Electrodes, e.g. characterised by the structure characterised by the material
    • H01S5/04253Electrodes, e.g. characterised by the structure characterised by the material having specific optical properties, e.g. transparent electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/04Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042Electrical excitation ; Circuits therefor
    • H01S5/0425Electrodes, e.g. characterised by the structure
    • H01S5/04254Electrodes, e.g. characterised by the structure characterised by the shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/10Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/16Window-type lasers, i.e. with a region of non-absorbing material between the active region and the reflecting surface
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/20Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/20Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/2205Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
    • H01S5/2214Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers based on oxides or nitrides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/32Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/3211Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures characterised by special cladding layers, e.g. details on band-discontinuities
    • H01S5/3213Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures characterised by special cladding layers, e.g. details on band-discontinuities asymmetric clading layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/32Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/3211Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures characterised by special cladding layers, e.g. details on band-discontinuities
    • H01S5/3214Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures characterised by special cladding layers, e.g. details on band-discontinuities comprising materials from other groups of the periodic system than the materials of the active layer, e.g. ZnSe claddings and GaAs active layer

Abstract

リッジストライプ構造を備えていても、素子の駆動電圧の上昇や内部発熱による寿命低下を防止し、レーザ特性を均一にすることができる窒化物半導体発光素子を提供する。  GaN基板1上にn型GaN層2、n型AlGaN層3、活性層4、p型AlGaN層5、p型GaN層6が順に積層されている。p型GaN層6上には絶縁膜7と透明電極8が形成されている。透明電極8の一部は、p型GaN層6と接するように形成されている。導波路形成のためのリッジストライプ部Dは、透明膜9で構成されている。透明電極8とp型GaN層6と接触している領域が、ストライプ形状の電流注入領域となる。
PCT/JP2008/073189 2007-12-19 2008-12-19 半導体発光素子 WO2009078482A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009546301A JPWO2009078482A1 (ja) 2007-12-19 2008-12-19 半導体発光素子
EP08861844A EP2237382A4 (en) 2007-12-19 2008-12-19 SEMICONDUCTOR LIGHT EMITTING DEVICE
CN2008801218853A CN101904064A (zh) 2007-12-19 2008-12-19 半导体发光元件
US12/809,233 US8411718B2 (en) 2007-12-19 2008-12-19 Semiconductor light-emitting device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007327927 2007-12-19
JP2007-327927 2007-12-19

Publications (1)

Publication Number Publication Date
WO2009078482A1 true WO2009078482A1 (ja) 2009-06-25

Family

ID=40795593

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/073189 WO2009078482A1 (ja) 2007-12-19 2008-12-19 半導体発光素子

Country Status (6)

Country Link
US (1) US8411718B2 (ja)
EP (1) EP2237382A4 (ja)
JP (1) JPWO2009078482A1 (ja)
KR (1) KR20100098565A (ja)
CN (1) CN101904064A (ja)
WO (1) WO2009078482A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010004974A1 (ja) * 2008-07-09 2010-01-14 シャープ株式会社 窒化物半導体レーザ素子
WO2012101686A1 (ja) * 2011-01-26 2012-08-02 パナソニック株式会社 半導体発光素子及び発光装置
JP2016048776A (ja) * 2014-08-25 2016-04-07 株式会社東芝 半導体発光素子及びその製造方法
JP6910580B1 (ja) * 2020-11-06 2021-07-28 三菱電機株式会社 光半導体装置およびその製造方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103380551A (zh) * 2011-03-17 2013-10-30 松下电器产业株式会社 半导体发光元件以及使用它的发光装置
DE102012106687B4 (de) * 2012-07-24 2019-01-24 Osram Opto Semiconductors Gmbh Steglaser
JP2014170825A (ja) * 2013-03-04 2014-09-18 Sumitomo Electric Ind Ltd 量子カスケード半導体レーザ
JP6700019B2 (ja) * 2015-10-20 2020-05-27 スタンレー電気株式会社 半導体発光素子
JP6700027B2 (ja) 2015-11-20 2020-05-27 スタンレー電気株式会社 垂直共振器型発光素子
JP6990499B2 (ja) * 2016-04-18 2022-01-12 スタンレー電気株式会社 垂直共振器型発光素子及び垂直共振型発光素子の製造方法
CN109346578B (zh) * 2018-12-04 2023-07-07 西安赛富乐斯半导体科技有限公司 形成半极性氮化镓单量子阱蓝光发光器件的方法
JP2020126995A (ja) * 2019-02-06 2020-08-20 シャープ株式会社 半導体レーザ素子及びその製造方法
US20210313760A1 (en) * 2020-04-06 2021-10-07 Asahi Kasei Kabushiki Kaisha Method for manufacturing semiconductor laser diode and semiconductor laser diode

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04103187A (ja) * 1990-08-22 1992-04-06 Mitsubishi Electric Corp 半導体レーザ及びその製造方法
JPH0730194A (ja) * 1993-07-14 1995-01-31 Rohm Co Ltd 半導体レーザ
JPH10256657A (ja) 1997-03-07 1998-09-25 Sharp Corp 窒化ガリウム系半導体発光素子、及び半導体レーザ光源装置
JPH11214788A (ja) 1998-01-26 1999-08-06 Sharp Corp 窒化ガリウム系半導体レーザ素子
JP2002204031A (ja) 2000-12-20 2002-07-19 Samsung Electro Mech Co Ltd 半導体レーザーダイオード及びその製造方法
JP2004048080A (ja) * 2000-05-17 2004-02-12 Sony Corp 半導体レーザの製造方法
JP2006041491A (ja) * 2004-06-21 2006-02-09 Matsushita Electric Ind Co Ltd 半導体レーザ素子及びその製造方法
WO2006134717A1 (ja) * 2005-06-16 2006-12-21 Sharp Kabushiki Kaisha 窒化物半導体レーザ装置およびその製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US245540A (en) * 1881-08-09 Table
US26307A (en) * 1859-11-29 Alfred f
US4930132A (en) * 1987-12-28 1990-05-29 Canon Kabushiki Kaisha Second harmonic wave generating device having active layer and second harmonic wave generating layer on same substrate
US5394421A (en) 1993-01-11 1995-02-28 Rohm Co., Ltd. Semiconductor laser device including a step electrode in a form of eaves
JP3464853B2 (ja) * 1995-09-06 2003-11-10 株式会社東芝 半導体レーザ
JP3688843B2 (ja) * 1996-09-06 2005-08-31 株式会社東芝 窒化物系半導体素子の製造方法
JP3533995B2 (ja) * 1999-07-01 2004-06-07 住友電気工業株式会社 発光ダイオードおよびその製造方法
JP2001223384A (ja) 2000-02-08 2001-08-17 Toshiba Corp 半導体発光素子
JP2001339121A (ja) * 2000-05-29 2001-12-07 Sharp Corp 窒化物半導体発光素子とそれを含む光学装置
JP2003046197A (ja) 2001-08-01 2003-02-14 Matsushita Electric Ind Co Ltd 半導体レーザおよびその製造方法
US7372077B2 (en) 2003-02-07 2008-05-13 Sanyo Electric Co., Ltd. Semiconductor device
US6990132B2 (en) * 2003-03-20 2006-01-24 Xerox Corporation Laser diode with metal-oxide upper cladding layer
US7279751B2 (en) * 2004-06-21 2007-10-09 Matsushita Electric Industrial Co., Ltd. Semiconductor laser device and manufacturing method thereof
KR101124290B1 (ko) * 2005-11-03 2012-03-27 삼성엘이디 주식회사 질화물 반도체 레이저 소자 및 그 제조 방법
JP5521478B2 (ja) * 2008-10-22 2014-06-11 日亜化学工業株式会社 窒化物半導体発光素子の製造方法及び窒化物半導体発光素子

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04103187A (ja) * 1990-08-22 1992-04-06 Mitsubishi Electric Corp 半導体レーザ及びその製造方法
JPH0730194A (ja) * 1993-07-14 1995-01-31 Rohm Co Ltd 半導体レーザ
JPH10256657A (ja) 1997-03-07 1998-09-25 Sharp Corp 窒化ガリウム系半導体発光素子、及び半導体レーザ光源装置
JPH11214788A (ja) 1998-01-26 1999-08-06 Sharp Corp 窒化ガリウム系半導体レーザ素子
JP2004048080A (ja) * 2000-05-17 2004-02-12 Sony Corp 半導体レーザの製造方法
JP2002204031A (ja) 2000-12-20 2002-07-19 Samsung Electro Mech Co Ltd 半導体レーザーダイオード及びその製造方法
JP2006041491A (ja) * 2004-06-21 2006-02-09 Matsushita Electric Ind Co Ltd 半導体レーザ素子及びその製造方法
WO2006134717A1 (ja) * 2005-06-16 2006-12-21 Sharp Kabushiki Kaisha 窒化物半導体レーザ装置およびその製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2237382A4 *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010004974A1 (ja) * 2008-07-09 2010-01-14 シャープ株式会社 窒化物半導体レーザ素子
JP2010021271A (ja) * 2008-07-09 2010-01-28 Sharp Corp 窒化物半導体レーザ素子
WO2012101686A1 (ja) * 2011-01-26 2012-08-02 パナソニック株式会社 半導体発光素子及び発光装置
JP2016048776A (ja) * 2014-08-25 2016-04-07 株式会社東芝 半導体発光素子及びその製造方法
JP6910580B1 (ja) * 2020-11-06 2021-07-28 三菱電機株式会社 光半導体装置およびその製造方法
WO2022097258A1 (ja) * 2020-11-06 2022-05-12 三菱電機株式会社 光半導体装置およびその製造方法

Also Published As

Publication number Publication date
EP2237382A1 (en) 2010-10-06
CN101904064A (zh) 2010-12-01
US20110121337A1 (en) 2011-05-26
US8411718B2 (en) 2013-04-02
EP2237382A4 (en) 2011-01-26
JPWO2009078482A1 (ja) 2011-05-06
KR20100098565A (ko) 2010-09-07

Similar Documents

Publication Publication Date Title
WO2009078482A1 (ja) 半導体発光素子
US7671377B2 (en) Silicon based light emitting diode
TW200733432A (en) Light emitting diode with ITO layer and method for fabricating the same
KR101761385B1 (ko) 발광 소자
TW200802964A (en) Nitride semiconductor light-emitting element and its manufacturing method
US8212276B2 (en) Arrangement of electrodes for light emitting device
TW200737549A (en) Gallium nitride-based compound semiconductor light-emitting device
TW200802973A (en) Semiconductor light emitting element
WO2006138465A3 (en) Light emitting diodes with reflective electrode and side electrode
WO2010047553A3 (ko) 반도체 발광 소자
WO2011145850A3 (en) High efficiency light emitting diode and method of fabricating the same
TW200711165A (en) Gan semiconductor light emitting element and its manufacturing method
TW200739948A (en) Gallium nitride-based compound semiconductor light-emitting device
US8729525B2 (en) Opto-electronic device
KR20110050357A (ko) GaN LED 및 그 형성 방법
WO2009072787A3 (en) Light emitting device using compound semiconductor
US8754438B2 (en) Light emitting diode
WO2008153068A1 (ja) 窒化物系半導体装置およびその製造方法
JP2010016261A5 (ja)
TW200739954A (en) Oxide semiconductor light-emitting element
JP2007329466A (ja) 半導体発光トランジスタ
TW200727509A (en) Non-substrate light emitting diode and fabrication method thereof
TW200607112A (en) GaN series light emitting diode structure of p-type contacting layer with low-temperature growth low resistivity
KR100832070B1 (ko) 질화갈륨계 발광 다이오드 소자
TW200633275A (en) Semiconductor light emitting diode and method of manufacturing same

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880121885.3

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08861844

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2009546301

Country of ref document: JP

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 12809233

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2008861844

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 4467/CHENP/2010

Country of ref document: IN

ENP Entry into the national phase

Ref document number: 20107015987

Country of ref document: KR

Kind code of ref document: A