JP6700019B2 - 半導体発光素子 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims description 151
- 230000003287 optical effect Effects 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 6
- 238000000926 separation method Methods 0.000 claims 2
- 238000003776 cleavage reaction Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 9
- 230000007017 scission Effects 0.000 description 9
- 238000005253 cladding Methods 0.000 description 8
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 229910002704 AlGaN Inorganic materials 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- -1 Ta 2 O 5 Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
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- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2203—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure with a transverse junction stripe [TJS] structure
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- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0201—Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
- H01S5/0202—Cleaving
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- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2004—Confining in the direction perpendicular to the layer structure
- H01S5/2018—Optical confinement, e.g. absorbing-, reflecting- or waveguide-layers
- H01S5/2031—Optical confinement, e.g. absorbing-, reflecting- or waveguide-layers characterized by special waveguide layers, e.g. asymmetric waveguide layers or defined bandgap discontinuities
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- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
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- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/24—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a grooved structure, e.g. V-grooved, crescent active layer in groove, VSIS laser
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- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
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- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04252—Electrodes, e.g. characterised by the structure characterised by the material
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- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04252—Electrodes, e.g. characterised by the structure characterised by the material
- H01S5/04253—Electrodes, e.g. characterised by the structure characterised by the material having specific optical properties, e.g. transparent electrodes
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- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04256—Electrodes, e.g. characterised by the structure characterised by the configuration
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- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/16—Window-type lasers, i.e. with a region of non-absorbing material between the active region and the reflecting surface
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- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
- H01S5/32341—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Optics & Photonics (AREA)
- Geometry (AREA)
- Semiconductor Lasers (AREA)
Description
)に示すように、一対の凹部18の底部が第1端面S1に達していても良い。
11 第1電極
12 基板
13 第1半導体層
15 発光層
17 第2半導体層
18 一対の凹部
18A、18B、 凹部
20 リッジ部
21 帯状電極
23 光ガイド層
27 絶縁層
28、29 反射膜
99 延長リッジ部
58A、58B 溝
S1 第1端面
S2 第2端面
RD 共振方向
RW リッジ部20の幅
DG 延長リッジ部99の幅
Claims (16)
- 基板上に、第1半導体層、発光層、前記第1半導体層と反対導電型の第2半導体層がこの順に積層され、互いに対向する第1端面及び第2端面を有する積層体と、
前記第2半導体層上に形成され、前記第2端面から離間し、かつ、前記第1端面及び前記第2端面に平行な方向に互いに離間して設けられた一対の凹部と、
前記一対の凹部の間の凸部であって、前記第1端面及び前記第2端面に垂直な方向に沿って延在するリッジ部と、
前記リッジ部上に設けられた帯状電極と、
前記リッジ部と前記第2端面との間において前記第2半導体層上に形成され、前記発光層からの放射光を導波する光ガイド層と、
前記第2半導体層と前記光ガイド層との間に設けられ、前記帯状電極に電気的に接続された透明電極層と、
を有する半導体レーザ。 - 前記一対の凹部は前記第1端面から離間して形成され、
前記光ガイド層は、前記リッジ部と前記第1端面との間の前記第2半導体層上に形成された副光ガイド層を含む請求項1に記載の半導体レーザ。 - 前記一対の凹部は前記垂直な方向に関して互いにアライメントされて配され、前記リッジ部を形成する前記一対の凹部の側壁は前記垂直な方向に同一の長さを有する請求項1または2に記載の半導体レーザ。
- 前記光ガイド層は、前記リッジ部の延在方向に関して前記帯状電極にアライメントされて設けられている請求項1乃至3のいずれか1に記載の半導体レーザ。
- 前記光ガイド層は、前記リッジ部の延在方向に垂直な方向において、前記リッジ部の幅以下の幅を有する請求項1乃至4のいずれか1に記載の半導体レーザ。
- 前記第2端面は前記第1端面よりも前記放射光に対して高い反射率を有する請求項1乃至5のいずれか1に記載の半導体レーザ。
- 前記一対の凹部は前記第1端面から離間して形成され、
前記帯状電極は、前記リッジ部と前記第1端面との間の前記第2半導体層上に延在して形成されている請求項1乃至6のいずれか1に記載の半導体レーザ。 - 前記帯状電極は透明電極層からなり、前記リッジ部と前記第2端面との間の前記第2半導体層上に延在して形成されている請求項1乃至7のいずれか1に記載の半導体レーザ。
- 前記光ガイド層は、誘電体により形成されている請求項1乃至8のいずれか1に記載の半導体レーザ。
- 前記第2半導体層は少なくとも1の半導体層からなり、前記光ガイド層は前記少なくとも1の半導体層のいずれか1よりも大きな屈折率を有する請求項1乃至9のいずれか1に記載の半導体レーザ。
- 前記光ガイド層はNb2O5からなる層を含む請求項10に記載の半導体レーザ。
- 基板上に、第1半導体層、発光層、前記第1半導体層と反対導電型の第2半導体層がこの順に積層され、互いに対向する第1端面及び第2端面を有する積層体と、
前記第2半導体層上に形成され、前記第2端面から離間し、かつ、前記第1端面及び前記第2端面に平行な方向に互いに離間して設けられた一対の凹部と、
前記一対の凹部の間の凸部であって、前記第1端面及び前記第2端面に垂直な方向に沿って延在するリッジ部と、
前記リッジ部上に設けられた帯状電極と、
前記リッジ部と前記第2端面との間において前記第2半導体層上に形成され、前記発光層からの放射光を導波する光ガイド層と、を有し、
前記リッジ部と前記第2端面との間における前記第2半導体層は、前記リッジ部におけ
る前記第2半導体層の層厚よりも小なる層厚を有する半導体レーザ。 - 前記リッジ部と前記第2端面との間における前記第2半導体層は、前記一対の凹部における前記第2半導体層の層厚よりも大なる層厚を有する請求項12に記載の半導体レーザ。
- 前記一対の凹部に連通して前記第2端面に至り、前記一対の凹部よりも大きな離間距離で互いに離間して形成された一対の溝と、
前記一対の溝の間の凸部であって、前記リッジ部に連なり、前記リッジ部よりも大なる幅の延長リッジ部と、を有する請求項1乃至13のいずれか1に記載の半導体レーザ。 - 前記一対の凹部は前記第1端面から離間して形成され、
前記一対の凹部に連通して前記第1端面に至り、前記一対の凹部よりも大きな離間距離で互いに離間して形成された一対の溝と、
前記一対の溝の間の凸部であって、前記リッジ部に連続し、前記リッジ部よりも大なる幅の延長リッジ部と、を有し、
前記光ガイド層は、前記リッジ部と前記第1端面との間の前記第2半導体層上に形成された前記副光ガイド層を含む請求項1乃至14のいずれか1に記載の半導体レーザ。 - 前記一対の溝の底面は、前記一対の凹部の底面から延在して形成されている請求項14または15に記載の半導体レーザ。
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JP2015206550A JP6700019B2 (ja) | 2015-10-20 | 2015-10-20 | 半導体発光素子 |
US15/294,409 US9787059B2 (en) | 2015-10-20 | 2016-10-14 | Semiconductor light emitting element |
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CN111755949B (zh) * | 2019-03-29 | 2021-12-07 | 潍坊华光光电子有限公司 | 一种具有非对称注入窗口的脊型GaAs基激光器的制备方法 |
CN110957633A (zh) * | 2019-12-16 | 2020-04-03 | 中国科学院半导体研究所 | 具有模场扩散结构的窄脊分布式反馈激光器及其应用 |
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JP2000133877A (ja) | 1998-10-27 | 2000-05-12 | Furukawa Electric Co Ltd:The | 半導体レーザ素子 |
JP3851471B2 (ja) | 1999-08-18 | 2006-11-29 | 株式会社タイトー | 投下ゲーム装置 |
JP4613395B2 (ja) * | 2000-06-09 | 2011-01-19 | 日亜化学工業株式会社 | 半導体レーザ素子及びその製造方法 |
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JPWO2009078482A1 (ja) * | 2007-12-19 | 2011-05-06 | ローム株式会社 | 半導体発光素子 |
JP2009283512A (ja) * | 2008-05-19 | 2009-12-03 | Panasonic Corp | 窒化物半導体レーザ |
JP2009283605A (ja) * | 2008-05-21 | 2009-12-03 | Mitsubishi Electric Corp | 半導体レーザ |
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