JP2010516050A - オプトエレクトロニクス部品用のハウジング及びハウジングにおけるオプトエレクトロニクス部品の配置 - Google Patents

オプトエレクトロニクス部品用のハウジング及びハウジングにおけるオプトエレクトロニクス部品の配置 Download PDF

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Publication number
JP2010516050A
JP2010516050A JP2009545060A JP2009545060A JP2010516050A JP 2010516050 A JP2010516050 A JP 2010516050A JP 2009545060 A JP2009545060 A JP 2009545060A JP 2009545060 A JP2009545060 A JP 2009545060A JP 2010516050 A JP2010516050 A JP 2010516050A
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Japan
Prior art keywords
housing
recess
carrier element
optoelectronic component
plastic housing
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JP2009545060A
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Japanese (ja)
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JP2010516050A5 (https=
Inventor
ボーグナー ゲオルク
グルーバー シュテファン
ツァイラー トーマス
カーシュ マルクス
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Ams Osram International GmbH
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Osram Opto Semiconductors GmbH
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Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of JP2010516050A publication Critical patent/JP2010516050A/ja
Publication of JP2010516050A5 publication Critical patent/JP2010516050A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
JP2009545060A 2007-01-11 2008-01-09 オプトエレクトロニクス部品用のハウジング及びハウジングにおけるオプトエレクトロニクス部品の配置 Pending JP2010516050A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007001706A DE102007001706A1 (de) 2007-01-11 2007-01-11 Gehäuse für optoelektronisches Bauelement und Anordnung eines optoelektronischen Bauelementes in einem Gehäuse
PCT/DE2008/000029 WO2008083672A2 (de) 2007-01-11 2008-01-09 Gehäuse für optoelektronisches bauelement und anordnung eines optoelektronischen bauelementes in einem gehäuse

Publications (2)

Publication Number Publication Date
JP2010516050A true JP2010516050A (ja) 2010-05-13
JP2010516050A5 JP2010516050A5 (https=) 2011-06-30

Family

ID=39351542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009545060A Pending JP2010516050A (ja) 2007-01-11 2008-01-09 オプトエレクトロニクス部品用のハウジング及びハウジングにおけるオプトエレクトロニクス部品の配置

Country Status (8)

Country Link
US (1) US9054279B2 (https=)
EP (1) EP2062301B1 (https=)
JP (1) JP2010516050A (https=)
KR (1) KR101410569B1 (https=)
CN (1) CN101569023A (https=)
DE (1) DE102007001706A1 (https=)
TW (1) TWI475715B (https=)
WO (1) WO2008083672A2 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101317233B1 (ko) 2012-05-11 2013-10-15 (주)트라디아 엘이디용 방열장치
KR20170009035A (ko) * 2015-07-15 2017-01-25 엘지이노텍 주식회사 발광 소자 패키지
JP2018029183A (ja) * 2013-04-17 2018-02-22 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ オプトエレクトロニクス部品およびその製造方法

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007001706A1 (de) 2007-01-11 2008-07-17 Osram Opto Semiconductors Gmbh Gehäuse für optoelektronisches Bauelement und Anordnung eines optoelektronischen Bauelementes in einem Gehäuse
DE102007060206A1 (de) 2007-12-14 2009-06-18 Osram Opto Semiconductors Gmbh Anordnung mit mindestens einem optoelektronischen Halbleiterbauelement
US8482191B2 (en) 2008-08-11 2013-07-09 Osram Gesellschaft Mit Beschraenkter Haftung Conversion LED
JP5440010B2 (ja) 2008-09-09 2014-03-12 日亜化学工業株式会社 光半導体装置及びその製造方法
TWI380433B (en) 2009-02-25 2012-12-21 Everlight Electronics Co Ltd Light emitting diode package
EP2224486A3 (en) * 2009-02-25 2012-09-12 Everlight Electronics Co., Ltd. Quad flat non-leaded chip package structure
DE102009023854B4 (de) 2009-06-04 2023-11-09 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauelement
JP5493549B2 (ja) * 2009-07-30 2014-05-14 日亜化学工業株式会社 発光装置及びその製造方法
TW201128812A (en) 2009-12-01 2011-08-16 Lg Innotek Co Ltd Light emitting device
US8525213B2 (en) 2010-03-30 2013-09-03 Lg Innotek Co., Ltd. Light emitting device having multiple cavities and light unit having the same
CN102339940A (zh) * 2010-07-27 2012-02-01 展晶科技(深圳)有限公司 发光二极管封装结构及其制造方法
DE102010047303A1 (de) * 2010-10-01 2012-04-05 Osram Opto Semiconductors Gmbh Reflektorelement, optoelektronisches Bauelement und Verfahren zur Herstellung eines Reflektorelements und eines optoelektronischen Bauelements
DE102010053809A1 (de) 2010-12-08 2012-06-14 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement, Verfahren zu dessen Herstellung und Verwendung eines derartigen Bauelements
EP2472579A1 (de) 2010-12-30 2012-07-04 Baumer Innotec AG Kontaktierung von Bauelementen auf Substraten
DE102011107895B4 (de) * 2011-07-18 2020-11-05 Heraeus Noblelight Gmbh Optoelektronisches Modul mit Linsensystem
JP2014523140A (ja) * 2012-04-23 2014-09-08 レイトロン カンパニー リミテッド 一体型光センサーパッケージ
DE102013204862A1 (de) * 2013-03-20 2014-10-09 Osram Gmbh Optoelektronische Baugruppe und Verfahren zum Herstellen einer optoelektronischen Baugruppe
US10170658B2 (en) * 2015-11-13 2019-01-01 Advanced Semiconductor Engineering, Inc. Semiconductor package structures and method of manufacturing the same
DE102016114483A1 (de) * 2016-08-04 2018-02-08 Ic-Haus Gmbh Optoelektronisches Bauelement
DE102016116439A1 (de) 2016-09-02 2018-03-08 Osram Opto Semiconductors Gmbh Anordnung mit einem Gehäuse mit einem strahlungsemittierenden optoelektronischen Bauelement
DE102017124455A1 (de) * 2017-10-19 2019-04-25 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil mit einem Wirkungselement

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0537021A (ja) * 1991-08-02 1993-02-12 Sanyo Electric Co Ltd 光半導体装置
JP2004111964A (ja) * 2002-09-18 2004-04-08 Agilent Technol Inc 表面実装型電子デバイス
JP2005093896A (ja) * 2003-09-19 2005-04-07 Stanley Electric Co Ltd 半導体発光装置
JP2005322680A (ja) * 2004-05-06 2005-11-17 Rohm Co Ltd 発光装置
JP2006093697A (ja) * 2004-09-20 2006-04-06 Tco Co Ltd 静電放電衝撃に対する保護機能が内蔵された高輝度発光ダイオード
JP2006516816A (ja) * 2003-01-30 2006-07-06 オスラム　オプト　セミコンダクターズ　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング 電磁放射の放出及び受動又はそのいずれか一方を行う半導体コンポーネント及びそのようなコンポーネントのためのハウジング基体
JP2006294982A (ja) * 2005-04-13 2006-10-26 Ichikoh Ind Ltd 発光ダイオード

Family Cites Families (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59132147A (ja) 1983-01-19 1984-07-30 Toshiba Corp 半導体装置の気密封止方法
DE8424611U1 (de) * 1984-08-20 1989-07-13 Barlian, Reinhold, Dipl.-Ing. (FH), 6990 Bad Mergentheim Leuchteinsatz
JP2556821Y2 (ja) 1991-12-09 1997-12-08 シャープ株式会社 発光装置
KR0125137B1 (ko) * 1993-10-14 1997-12-01 미타라이 하지메 밀착형 이미지센서
JPH08287719A (ja) 1995-04-10 1996-11-01 Copal Co Ltd 発光装置
JPH0983018A (ja) 1995-09-11 1997-03-28 Nippon Denyo Kk 発光ダイオードユニット
DE19600678A1 (de) * 1996-01-10 1997-07-24 Siemens Ag Optoelektronisches Halbleiter-Bauelement
NL1003315C2 (nl) * 1996-06-11 1997-12-17 Europ Semiconductor Assembly E Werkwijze voor het inkapselen van een geïntegreerde halfgeleiderschake- ling.
JP3468018B2 (ja) 1997-04-10 2003-11-17 日亜化学工業株式会社 発光装置及びそれを用いた表示装置
DE19755734A1 (de) * 1997-12-15 1999-06-24 Siemens Ag Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelementes
JP3763715B2 (ja) 2000-01-24 2006-04-05 シャープ株式会社 受光素子および半導体レーザ装置
JP4066620B2 (ja) * 2000-07-21 2008-03-26 日亜化学工業株式会社 発光素子、および発光素子を配置した表示装置ならびに表示装置の製造方法
JP2002223005A (ja) 2001-01-26 2002-08-09 Toyoda Gosei Co Ltd 発光ダイオード及びディスプレイ装置
JP2002232014A (ja) 2001-02-05 2002-08-16 Seiwa Electric Mfg Co Ltd 発光ダイオードランプ
DE10117889A1 (de) 2001-04-10 2002-10-24 Osram Opto Semiconductors Gmbh Leiterrahmen und Gehäuse für ein strahlungsemittierendes Bauelement, strahlungsemittierendes Bauelement sowie Verfahren zu dessen Herstellung
JP3771144B2 (ja) 2001-06-27 2006-04-26 豊田合成株式会社 Ｌｅｄランプ
US20020163001A1 (en) 2001-05-04 2002-11-07 Shaddock David Mulford Surface mount light emitting device package and fabrication method
US6603183B1 (en) * 2001-09-04 2003-08-05 Amkor Technology, Inc. Quick sealing glass-lidded package
DE10153259A1 (de) * 2001-10-31 2003-05-22 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
DE10241989A1 (de) 2001-11-30 2003-06-18 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
US7021833B2 (en) * 2002-03-22 2006-04-04 Ban-Poh Loh Waveguide based optical coupling of a fiber optic cable and an optoelectronic device
US6907178B2 (en) * 2002-06-13 2005-06-14 Steve Lerner Optoelectronic assembly with embedded optical and electrical components
DE10229067B4 (de) * 2002-06-28 2007-08-16 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu dessen Herstellung
JP4118742B2 (ja) * 2002-07-17 2008-07-16 シャープ株式会社 発光ダイオードランプおよび発光ダイオード表示装置
DE20306928U1 (de) * 2003-01-30 2004-06-03 Osram Opto Semiconductors Gmbh Elektromagnetische Strahlung aussendendes und/oder empfangendes Halbleiter-Bauelement und Gehäuse-Grundkörper für ein derartiges Bauelement
JP4504662B2 (ja) * 2003-04-09 2010-07-14 シチズン電子株式会社 Ｌｅｄランプ
US20070001177A1 (en) * 2003-05-08 2007-01-04 Koninklijke Philips Electronics N.V. Integrated light-emitting diode system
DE10324909B4 (de) 2003-05-30 2017-09-07 Osram Opto Semiconductors Gmbh Gehäuse für ein strahlungsemittierendes Bauelement, Verfahren zu dessen Herstellung und strahlungsemittierendes Bauelement
JP4645071B2 (ja) * 2003-06-20 2011-03-09 日亜化学工業株式会社 パッケージ成型体およびそれを用いた半導体装置
US7518158B2 (en) * 2003-12-09 2009-04-14 Cree, Inc. Semiconductor light emitting devices and submounts
JP4480407B2 (ja) 2004-01-29 2010-06-16 京セラ株式会社 発光素子収納用パッケージおよび発光装置
US7033906B2 (en) * 2004-02-02 2006-04-25 John Shi Sun Wei Airdome enclosure for components
US7165896B2 (en) 2004-02-12 2007-01-23 Hymite A/S Light transmitting modules with optical power monitoring
DE102004014207A1 (de) 2004-03-23 2005-10-13 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil mit mehrteiligem Gehäusekörper
US20070257901A1 (en) * 2004-04-19 2007-11-08 Matsushita Electric Industrial Co., Ltd. Semiconductor chip for driving light emitting element, light emitting device, and lighting device
DE102004064150B4 (de) 2004-06-29 2010-04-29 Osram Opto Semiconductors Gmbh Elektronisches Bauteil mit Gehäuse mit leitfähiger Beschichtung zum ESD-Schutz
US20060006793A1 (en) * 2004-07-12 2006-01-12 Baroky Tajul A Deep ultraviolet used to produce white light
EP1622237A1 (de) 2004-07-28 2006-02-01 Infineon Technologies Fiber Optics GmbH Optisches oder elektronisches Modul und Verfahren zu dessen Herstellung
DE102004045950A1 (de) 2004-09-22 2006-03-30 Osram Opto Semiconductors Gmbh Gehäuse für ein optoelektronisches Bauelement, optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
JP2006216887A (ja) * 2005-02-07 2006-08-17 Citizen Electronics Co Ltd オプトデバイス
US20080191608A1 (en) 2005-04-20 2008-08-14 Koninklijke Philips Electronics N.V. Illumination System Comprising a Ceramic Luminescence Converter
DE102005036520A1 (de) 2005-04-26 2006-11-09 Osram Opto Semiconductors Gmbh Optisches Bauteil, optoelektronisches Bauelement mit dem Bauteil und dessen Herstellung
KR100650191B1 (ko) * 2005-05-31 2006-11-27 삼성전기주식회사 정전기 방전 충격에 대한 보호 기능이 내장된 고휘도 발광다이오드
KR20070000638A (ko) 2005-06-28 2007-01-03 삼성전기주식회사 고휘도 발광 다이오드 소자 및 그 제조방법
DE102005041064B4 (de) 2005-08-30 2023-01-19 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Oberflächenmontierbares optoelektronisches Bauelement und Verfahren zu dessen Herstellung
DE102006004397A1 (de) 2005-09-30 2007-04-05 Osram Opto Semiconductors Gmbh Elektromagnetische Strahlung emittierendes optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
KR100637476B1 (ko) 2005-11-09 2006-10-23 알티전자 주식회사 측면발광 다이오드 및 그 제조방법
TWI284433B (en) * 2006-02-23 2007-07-21 Novalite Optronics Corp Light emitting diode package and fabricating method thereof
CN101030572A (zh) 2006-03-01 2007-09-05 瑞莹光电股份有限公司 发光二极管封装及其制造方法
US7440098B2 (en) * 2006-04-04 2008-10-21 Custom Sensors And Technology Spectroscope and method of performing spectroscopy utilizing a micro mirror array
JP2007324330A (ja) 2006-05-31 2007-12-13 Sanyo Electric Co Ltd 回路基板
DE102006043404A1 (de) * 2006-09-15 2008-03-27 Osram Opto Semiconductors Gmbh Oberflächenmontierbares Gehäuse für einen Halbleiterchip
DE102006059994A1 (de) * 2006-12-19 2008-06-26 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement
DE102007001706A1 (de) 2007-01-11 2008-07-17 Osram Opto Semiconductors Gmbh Gehäuse für optoelektronisches Bauelement und Anordnung eines optoelektronischen Bauelementes in einem Gehäuse
US8716848B2 (en) * 2008-03-24 2014-05-06 SemiLEDs Optoelectronics Co., Ltd. LED device with conductive wings and tabs

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0537021A (ja) * 1991-08-02 1993-02-12 Sanyo Electric Co Ltd 光半導体装置
JP2004111964A (ja) * 2002-09-18 2004-04-08 Agilent Technol Inc 表面実装型電子デバイス
JP2006516816A (ja) * 2003-01-30 2006-07-06 オスラム　オプト　セミコンダクターズ　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング 電磁放射の放出及び受動又はそのいずれか一方を行う半導体コンポーネント及びそのようなコンポーネントのためのハウジング基体
JP2005093896A (ja) * 2003-09-19 2005-04-07 Stanley Electric Co Ltd 半導体発光装置
JP2005322680A (ja) * 2004-05-06 2005-11-17 Rohm Co Ltd 発光装置
JP2006093697A (ja) * 2004-09-20 2006-04-06 Tco Co Ltd 静電放電衝撃に対する保護機能が内蔵された高輝度発光ダイオード
JP2006294982A (ja) * 2005-04-13 2006-10-26 Ichikoh Ind Ltd 発光ダイオード

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101317233B1 (ko) 2012-05-11 2013-10-15 (주)트라디아 엘이디용 방열장치
JP2018029183A (ja) * 2013-04-17 2018-02-22 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ オプトエレクトロニクス部品およびその製造方法
KR20170009035A (ko) * 2015-07-15 2017-01-25 엘지이노텍 주식회사 발광 소자 패키지
KR102408616B1 (ko) 2015-07-15 2022-06-14 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지

Also Published As

Publication number Publication date
KR20090104020A (ko) 2009-10-05
WO2008083672A2 (de) 2008-07-17
EP2062301B1 (de) 2019-04-03
US9054279B2 (en) 2015-06-09
TWI475715B (zh) 2015-03-01
DE102007001706A1 (de) 2008-07-17
TW200841496A (en) 2008-10-16
CN101569023A (zh) 2009-10-28
EP2062301A2 (de) 2009-05-27
KR101410569B1 (ko) 2014-06-23
US20110002587A1 (en) 2011-01-06
WO2008083672A3 (de) 2008-12-18

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