TWI475715B - 用於光電子元件之殼體及在該殼體內的光電子元件之配置 - Google Patents

用於光電子元件之殼體及在該殼體內的光電子元件之配置 Download PDF

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Publication number
TWI475715B
TWI475715B TW097100601A TW97100601A TWI475715B TW I475715 B TWI475715 B TW I475715B TW 097100601 A TW097100601 A TW 097100601A TW 97100601 A TW97100601 A TW 97100601A TW I475715 B TWI475715 B TW I475715B
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TW
Taiwan
Prior art keywords
housing
component
optoelectronic
optoelectronic component
recess
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Application number
TW097100601A
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English (en)
Chinese (zh)
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TW200841496A (en
Inventor
柏格納 傑歐爾格
格戶博 史蒂芬
科許 馬赫庫斯
差勒 湯瑪士
Original Assignee
歐司朗光電半導體有限公司
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Application filed by 歐司朗光電半導體有限公司 filed Critical 歐司朗光電半導體有限公司
Publication of TW200841496A publication Critical patent/TW200841496A/zh
Application granted granted Critical
Publication of TWI475715B publication Critical patent/TWI475715B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
TW097100601A 2007-01-11 2008-01-07 用於光電子元件之殼體及在該殼體內的光電子元件之配置 TWI475715B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102007001706A DE102007001706A1 (de) 2007-01-11 2007-01-11 Gehäuse für optoelektronisches Bauelement und Anordnung eines optoelektronischen Bauelementes in einem Gehäuse

Publications (2)

Publication Number Publication Date
TW200841496A TW200841496A (en) 2008-10-16
TWI475715B true TWI475715B (zh) 2015-03-01

Family

ID=39351542

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097100601A TWI475715B (zh) 2007-01-11 2008-01-07 用於光電子元件之殼體及在該殼體內的光電子元件之配置

Country Status (8)

Country Link
US (1) US9054279B2 (https=)
EP (1) EP2062301B1 (https=)
JP (1) JP2010516050A (https=)
KR (1) KR101410569B1 (https=)
CN (1) CN101569023A (https=)
DE (1) DE102007001706A1 (https=)
TW (1) TWI475715B (https=)
WO (1) WO2008083672A2 (https=)

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DE102009023854B4 (de) 2009-06-04 2023-11-09 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauelement
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TW201128812A (en) 2009-12-01 2011-08-16 Lg Innotek Co Ltd Light emitting device
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DE102010047303A1 (de) * 2010-10-01 2012-04-05 Osram Opto Semiconductors Gmbh Reflektorelement, optoelektronisches Bauelement und Verfahren zur Herstellung eines Reflektorelements und eines optoelektronischen Bauelements
DE102010053809A1 (de) 2010-12-08 2012-06-14 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement, Verfahren zu dessen Herstellung und Verwendung eines derartigen Bauelements
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DE102011107895B4 (de) * 2011-07-18 2020-11-05 Heraeus Noblelight Gmbh Optoelektronisches Modul mit Linsensystem
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US10170658B2 (en) * 2015-11-13 2019-01-01 Advanced Semiconductor Engineering, Inc. Semiconductor package structures and method of manufacturing the same
DE102016114483A1 (de) * 2016-08-04 2018-02-08 Ic-Haus Gmbh Optoelektronisches Bauelement
DE102016116439A1 (de) 2016-09-02 2018-03-08 Osram Opto Semiconductors Gmbh Anordnung mit einem Gehäuse mit einem strahlungsemittierenden optoelektronischen Bauelement
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Also Published As

Publication number Publication date
KR20090104020A (ko) 2009-10-05
WO2008083672A2 (de) 2008-07-17
EP2062301B1 (de) 2019-04-03
US9054279B2 (en) 2015-06-09
DE102007001706A1 (de) 2008-07-17
JP2010516050A (ja) 2010-05-13
TW200841496A (en) 2008-10-16
CN101569023A (zh) 2009-10-28
EP2062301A2 (de) 2009-05-27
KR101410569B1 (ko) 2014-06-23
US20110002587A1 (en) 2011-01-06
WO2008083672A3 (de) 2008-12-18

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