CN101569023A - 用于光电子器件的壳体和光电子器件在壳体中的布置 - Google Patents

用于光电子器件的壳体和光电子器件在壳体中的布置 Download PDF

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Publication number
CN101569023A
CN101569023A CNA2008800011668A CN200880001166A CN101569023A CN 101569023 A CN101569023 A CN 101569023A CN A2008800011668 A CNA2008800011668 A CN A2008800011668A CN 200880001166 A CN200880001166 A CN 200880001166A CN 101569023 A CN101569023 A CN 101569023A
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CN
China
Prior art keywords
electronic device
housing
recess
opto
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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CNA2008800011668A
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English (en)
Chinese (zh)
Inventor
乔治·伯格纳
斯特凡·格鲁贝尔
托马斯·蔡勒
马库斯·基尔施
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Ams Osram International GmbH
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Osram Opto Semiconductors GmbH
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Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of CN101569023A publication Critical patent/CN101569023A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Led Device Packages (AREA)
CNA2008800011668A 2007-01-11 2008-01-09 用于光电子器件的壳体和光电子器件在壳体中的布置 Pending CN101569023A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007001706A DE102007001706A1 (de) 2007-01-11 2007-01-11 Gehäuse für optoelektronisches Bauelement und Anordnung eines optoelektronischen Bauelementes in einem Gehäuse
DE102007001706.7 2007-01-11
PCT/DE2008/000029 WO2008083672A2 (de) 2007-01-11 2008-01-09 Gehäuse für optoelektronisches bauelement und anordnung eines optoelektronischen bauelementes in einem gehäuse

Publications (1)

Publication Number Publication Date
CN101569023A true CN101569023A (zh) 2009-10-28

Family

ID=39351542

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2008800011668A Pending CN101569023A (zh) 2007-01-11 2008-01-09 用于光电子器件的壳体和光电子器件在壳体中的布置

Country Status (8)

Country Link
US (1) US9054279B2 (https=)
EP (1) EP2062301B1 (https=)
JP (1) JP2010516050A (https=)
KR (1) KR101410569B1 (https=)
CN (1) CN101569023A (https=)
DE (1) DE102007001706A1 (https=)
TW (1) TWI475715B (https=)
WO (1) WO2008083672A2 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102339940A (zh) * 2010-07-27 2012-02-01 展晶科技(深圳)有限公司 发光二极管封装结构及其制造方法
CN103918077A (zh) * 2011-07-18 2014-07-09 贺利氏特种光源有限责任公司 具有透镜系统的光电子模块
CN105103315A (zh) * 2013-04-17 2015-11-25 奥斯兰姆奥普托半导体有限责任公司 光电子器件及其制造方法

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DE102007060206A1 (de) 2007-12-14 2009-06-18 Osram Opto Semiconductors Gmbh Anordnung mit mindestens einem optoelektronischen Halbleiterbauelement
US8482191B2 (en) 2008-08-11 2013-07-09 Osram Gesellschaft Mit Beschraenkter Haftung Conversion LED
JP5440010B2 (ja) 2008-09-09 2014-03-12 日亜化学工業株式会社 光半導体装置及びその製造方法
TWI380433B (en) 2009-02-25 2012-12-21 Everlight Electronics Co Ltd Light emitting diode package
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DE102009023854B4 (de) 2009-06-04 2023-11-09 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauelement
JP5493549B2 (ja) * 2009-07-30 2014-05-14 日亜化学工業株式会社 発光装置及びその製造方法
TW201128812A (en) 2009-12-01 2011-08-16 Lg Innotek Co Ltd Light emitting device
US8525213B2 (en) 2010-03-30 2013-09-03 Lg Innotek Co., Ltd. Light emitting device having multiple cavities and light unit having the same
DE102010047303A1 (de) * 2010-10-01 2012-04-05 Osram Opto Semiconductors Gmbh Reflektorelement, optoelektronisches Bauelement und Verfahren zur Herstellung eines Reflektorelements und eines optoelektronischen Bauelements
DE102010053809A1 (de) 2010-12-08 2012-06-14 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement, Verfahren zu dessen Herstellung und Verwendung eines derartigen Bauelements
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JP2014523140A (ja) * 2012-04-23 2014-09-08 レイトロン カンパニー リミテッド 一体型光センサーパッケージ
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KR102408616B1 (ko) * 2015-07-15 2022-06-14 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지
US10170658B2 (en) * 2015-11-13 2019-01-01 Advanced Semiconductor Engineering, Inc. Semiconductor package structures and method of manufacturing the same
DE102016114483A1 (de) * 2016-08-04 2018-02-08 Ic-Haus Gmbh Optoelektronisches Bauelement
DE102016116439A1 (de) 2016-09-02 2018-03-08 Osram Opto Semiconductors Gmbh Anordnung mit einem Gehäuse mit einem strahlungsemittierenden optoelektronischen Bauelement
DE102017124455A1 (de) * 2017-10-19 2019-04-25 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil mit einem Wirkungselement

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Publication number Priority date Publication date Assignee Title
CN102339940A (zh) * 2010-07-27 2012-02-01 展晶科技(深圳)有限公司 发光二极管封装结构及其制造方法
CN103918077A (zh) * 2011-07-18 2014-07-09 贺利氏特种光源有限责任公司 具有透镜系统的光电子模块
CN105103315A (zh) * 2013-04-17 2015-11-25 奥斯兰姆奥普托半导体有限责任公司 光电子器件及其制造方法

Also Published As

Publication number Publication date
KR20090104020A (ko) 2009-10-05
WO2008083672A2 (de) 2008-07-17
EP2062301B1 (de) 2019-04-03
US9054279B2 (en) 2015-06-09
TWI475715B (zh) 2015-03-01
DE102007001706A1 (de) 2008-07-17
JP2010516050A (ja) 2010-05-13
TW200841496A (en) 2008-10-16
EP2062301A2 (de) 2009-05-27
KR101410569B1 (ko) 2014-06-23
US20110002587A1 (en) 2011-01-06
WO2008083672A3 (de) 2008-12-18

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Application publication date: 20091028