KR101410569B1 - 광전자 장치용 하우징 및 하우징 내의 광전자 장치의 배치 - Google Patents

광전자 장치용 하우징 및 하우징 내의 광전자 장치의 배치 Download PDF

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KR101410569B1
KR101410569B1 KR1020097014208A KR20097014208A KR101410569B1 KR 101410569 B1 KR101410569 B1 KR 101410569B1 KR 1020097014208 A KR1020097014208 A KR 1020097014208A KR 20097014208 A KR20097014208 A KR 20097014208A KR 101410569 B1 KR101410569 B1 KR 101410569B1
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housing
recess
plastic housing
optoelectronic device
support element
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KR20090104020A (ko
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조지 보그너
스테판 그루버
토마스 질러
마커스 컬쉬
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오스람 옵토 세미컨덕터스 게엠베하
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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KR1020097014208A 2007-01-11 2008-01-09 광전자 장치용 하우징 및 하우징 내의 광전자 장치의 배치 Active KR101410569B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007001706A DE102007001706A1 (de) 2007-01-11 2007-01-11 Gehäuse für optoelektronisches Bauelement und Anordnung eines optoelektronischen Bauelementes in einem Gehäuse
DE102007001706.7 2007-01-11
PCT/DE2008/000029 WO2008083672A2 (de) 2007-01-11 2008-01-09 Gehäuse für optoelektronisches bauelement und anordnung eines optoelektronischen bauelementes in einem gehäuse

Publications (2)

Publication Number Publication Date
KR20090104020A KR20090104020A (ko) 2009-10-05
KR101410569B1 true KR101410569B1 (ko) 2014-06-23

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KR1020097014208A Active KR101410569B1 (ko) 2007-01-11 2008-01-09 광전자 장치용 하우징 및 하우징 내의 광전자 장치의 배치

Country Status (8)

Country Link
US (1) US9054279B2 (https=)
EP (1) EP2062301B1 (https=)
JP (1) JP2010516050A (https=)
KR (1) KR101410569B1 (https=)
CN (1) CN101569023A (https=)
DE (1) DE102007001706A1 (https=)
TW (1) TWI475715B (https=)
WO (1) WO2008083672A2 (https=)

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DE102007060206A1 (de) 2007-12-14 2009-06-18 Osram Opto Semiconductors Gmbh Anordnung mit mindestens einem optoelektronischen Halbleiterbauelement
US8482191B2 (en) 2008-08-11 2013-07-09 Osram Gesellschaft Mit Beschraenkter Haftung Conversion LED
JP5440010B2 (ja) 2008-09-09 2014-03-12 日亜化学工業株式会社 光半導体装置及びその製造方法
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DE102009023854B4 (de) 2009-06-04 2023-11-09 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauelement
JP5493549B2 (ja) * 2009-07-30 2014-05-14 日亜化学工業株式会社 発光装置及びその製造方法
TW201128812A (en) 2009-12-01 2011-08-16 Lg Innotek Co Ltd Light emitting device
US8525213B2 (en) 2010-03-30 2013-09-03 Lg Innotek Co., Ltd. Light emitting device having multiple cavities and light unit having the same
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DE102010047303A1 (de) * 2010-10-01 2012-04-05 Osram Opto Semiconductors Gmbh Reflektorelement, optoelektronisches Bauelement und Verfahren zur Herstellung eines Reflektorelements und eines optoelektronischen Bauelements
DE102010053809A1 (de) 2010-12-08 2012-06-14 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement, Verfahren zu dessen Herstellung und Verwendung eines derartigen Bauelements
EP2472579A1 (de) 2010-12-30 2012-07-04 Baumer Innotec AG Kontaktierung von Bauelementen auf Substraten
DE102011107895B4 (de) * 2011-07-18 2020-11-05 Heraeus Noblelight Gmbh Optoelektronisches Modul mit Linsensystem
JP2014523140A (ja) * 2012-04-23 2014-09-08 レイトロン カンパニー リミテッド 一体型光センサーパッケージ
KR101317233B1 (ko) 2012-05-11 2013-10-15 (주)트라디아 엘이디용 방열장치
DE102013204862A1 (de) * 2013-03-20 2014-10-09 Osram Gmbh Optoelektronische Baugruppe und Verfahren zum Herstellen einer optoelektronischen Baugruppe
DE102013206963A1 (de) * 2013-04-17 2014-11-06 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
KR102408616B1 (ko) * 2015-07-15 2022-06-14 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지
US10170658B2 (en) * 2015-11-13 2019-01-01 Advanced Semiconductor Engineering, Inc. Semiconductor package structures and method of manufacturing the same
DE102016114483A1 (de) * 2016-08-04 2018-02-08 Ic-Haus Gmbh Optoelektronisches Bauelement
DE102016116439A1 (de) 2016-09-02 2018-03-08 Osram Opto Semiconductors Gmbh Anordnung mit einem Gehäuse mit einem strahlungsemittierenden optoelektronischen Bauelement
DE102017124455A1 (de) * 2017-10-19 2019-04-25 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil mit einem Wirkungselement

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Also Published As

Publication number Publication date
KR20090104020A (ko) 2009-10-05
WO2008083672A2 (de) 2008-07-17
EP2062301B1 (de) 2019-04-03
US9054279B2 (en) 2015-06-09
TWI475715B (zh) 2015-03-01
DE102007001706A1 (de) 2008-07-17
JP2010516050A (ja) 2010-05-13
TW200841496A (en) 2008-10-16
CN101569023A (zh) 2009-10-28
EP2062301A2 (de) 2009-05-27
US20110002587A1 (en) 2011-01-06
WO2008083672A3 (de) 2008-12-18

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