JP2010516044A - 溶媒および系の使用による基材洗浄方法 - Google Patents

溶媒および系の使用による基材洗浄方法 Download PDF

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Publication number
JP2010516044A
JP2010516044A JP2009544842A JP2009544842A JP2010516044A JP 2010516044 A JP2010516044 A JP 2010516044A JP 2009544842 A JP2009544842 A JP 2009544842A JP 2009544842 A JP2009544842 A JP 2009544842A JP 2010516044 A JP2010516044 A JP 2010516044A
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JP
Japan
Prior art keywords
solvent
wafer
cleaning
alkyl groups
ester
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009544842A
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English (en)
Japanese (ja)
Other versions
JP2010516044A5 (https=
Inventor
ウェイン クイレン，マイケル
パルマー，ジュニア ホルブルック，ローディー
クリオン ムーア，ジョン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eastman Chemical Co
Original Assignee
Eastman Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eastman Chemical Co filed Critical Eastman Chemical Co
Publication of JP2010516044A publication Critical patent/JP2010516044A/ja
Publication of JP2010516044A5 publication Critical patent/JP2010516044A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/20—Organic compounds containing oxygen
    • C11D3/2003—Alcohols; Phenols
    • C11D3/2006—Monohydric alcohols
    • C11D3/2017—Monohydric alcohols branched
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/20—Organic compounds containing oxygen
    • C11D3/2093—Esters; Carbonates
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/43—Solvents
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/261—Alcohols; Phenols
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C11D7/5022—Organic solvents containing oxygen
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/266—Esters or carbonates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
JP2009544842A 2007-01-04 2007-12-20 溶媒および系の使用による基材洗浄方法 Pending JP2010516044A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/649,600 US8021490B2 (en) 2007-01-04 2007-01-04 Substrate cleaning processes through the use of solvents and systems
PCT/US2007/026088 WO2008085390A2 (en) 2007-01-04 2007-12-20 Substrate cleaning processes through the use of solvents and systems

Publications (2)

Publication Number Publication Date
JP2010516044A true JP2010516044A (ja) 2010-05-13
JP2010516044A5 JP2010516044A5 (https=) 2011-02-10

Family

ID=39262665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009544842A Pending JP2010516044A (ja) 2007-01-04 2007-12-20 溶媒および系の使用による基材洗浄方法

Country Status (7)

Country Link
US (1) US8021490B2 (https=)
EP (1) EP2106616A2 (https=)
JP (1) JP2010516044A (https=)
KR (1) KR20090106499A (https=)
CN (1) CN101573777A (https=)
TW (1) TWI494426B (https=)
WO (1) WO2008085390A2 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8021490B2 (en) * 2007-01-04 2011-09-20 Eastman Chemical Company Substrate cleaning processes through the use of solvents and systems
JP4922329B2 (ja) * 2009-03-25 2012-04-25 株式会社東芝 半導体基板の洗浄装置および半導体基板の洗浄方法
US8324093B2 (en) * 2009-07-23 2012-12-04 GlobalFoundries, Inc. Methods for fabricating semiconductor devices including azeotropic drying processes
US9335367B2 (en) * 2013-08-27 2016-05-10 International Business Machines Corporation Implementing low temperature wafer test
JP6426927B2 (ja) 2013-09-30 2018-11-21 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
US9580672B2 (en) * 2014-09-26 2017-02-28 Taiwan Semiconductor Manufacturing Company, Ltd. Cleaning composition and method for semiconductor device fabrication
US20180074115A1 (en) * 2016-09-09 2018-03-15 General Electric Company Residual ionic cleanliness evaluation component
EP3635421A1 (en) * 2017-06-05 2020-04-15 Cutsforth Inc. Monitoring system for grounding apparatus
US10767941B2 (en) * 2018-09-14 2020-09-08 Ford Global Technologies, Llc Method of forming a superhydrophobic layer on a motor vehicle heat exchanger housing and a heat exchanger incorporating such a housing

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JP2006083308A (ja) * 2004-09-16 2006-03-30 Nippon Zeon Co Ltd 洗浄剤組成物
JP2006203027A (ja) * 2005-01-21 2006-08-03 National Institute Of Advanced Industrial & Technology Ｃｍｐ研磨方法、ｃｍｐ研磨装置、及び半導体デバイスの製造方法

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Also Published As

Publication number Publication date
KR20090106499A (ko) 2009-10-09
TW200840866A (en) 2008-10-16
CN101573777A (zh) 2009-11-04
US8021490B2 (en) 2011-09-20
US20080163893A1 (en) 2008-07-10
WO2008085390A2 (en) 2008-07-17
TWI494426B (zh) 2015-08-01
WO2008085390A3 (en) 2008-10-16
EP2106616A2 (en) 2009-10-07

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