JP2010510083A - ラッピングキャリア及びラッピング方法 - Google Patents

ラッピングキャリア及びラッピング方法 Download PDF

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Publication number
JP2010510083A
JP2010510083A JP2009538474A JP2009538474A JP2010510083A JP 2010510083 A JP2010510083 A JP 2010510083A JP 2009538474 A JP2009538474 A JP 2009538474A JP 2009538474 A JP2009538474 A JP 2009538474A JP 2010510083 A JP2010510083 A JP 2010510083A
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JP
Japan
Prior art keywords
carrier
polymer
main surface
workpiece
lapping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009538474A
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English (en)
Japanese (ja)
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JP2010510083A5 (enExample
Inventor
ディー． フレッチャー，ティモシー
ジェイ． クリスティアンソン，トッド
ディー． ロメロ，ビンセント
エー． スベンテック，ブルース
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
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3M Innovative Properties Co
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Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2010510083A publication Critical patent/JP2010510083A/ja
Publication of JP2010510083A5 publication Critical patent/JP2010510083A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • H10P52/00—

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2009538474A 2006-11-21 2007-11-19 ラッピングキャリア及びラッピング方法 Pending JP2010510083A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US86676806P 2006-11-21 2006-11-21
PCT/US2007/085103 WO2008064158A2 (en) 2006-11-21 2007-11-19 Lapping carrier and method

Publications (2)

Publication Number Publication Date
JP2010510083A true JP2010510083A (ja) 2010-04-02
JP2010510083A5 JP2010510083A5 (enExample) 2011-01-06

Family

ID=39430535

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009538474A Pending JP2010510083A (ja) 2006-11-21 2007-11-19 ラッピングキャリア及びラッピング方法

Country Status (7)

Country Link
US (2) US8137157B2 (enExample)
EP (1) EP2097221A4 (enExample)
JP (1) JP2010510083A (enExample)
KR (1) KR101494912B1 (enExample)
CN (1) CN101541477B (enExample)
TW (1) TWI428205B (enExample)
WO (1) WO2008064158A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009099980A (ja) * 2007-10-17 2009-05-07 Siltronic Ag キャリア、キャリアを被覆する方法並びに半導体ウェハの両面を同時に材料除去する加工方法

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US9550264B2 (en) * 2009-06-04 2017-01-24 Sumco Corporation Fixed abrasive-grain processing device, method of fixed abrasive-grain processing, and method for producing semiconductor wafer
KR101209271B1 (ko) * 2009-08-21 2012-12-06 주식회사 엘지실트론 양면 연마 장치와 양면 연마 장치용 캐리어
CN102267108A (zh) * 2010-06-03 2011-12-07 中国砂轮企业股份有限公司 具有改质钻石磨料的研磨工具及其制造方法
DE102010032501B4 (de) 2010-07-28 2019-03-28 Siltronic Ag Verfahren und Vorrichtung zum Abrichten der Arbeitsschichten einer Doppelseiten-Schleifvorrichtung
DE102010042040A1 (de) 2010-10-06 2012-04-12 Siltronic Ag Verfahren zum Schleifen einer Halbleiterscheibe
DE102011003008B4 (de) * 2011-01-21 2018-07-12 Siltronic Ag Führungskäfig und Verfahren zur gleichzeitig beidseitigen Material abtragenden Bearbeitung von Halbleiterscheiben
US20130017765A1 (en) * 2011-07-11 2013-01-17 3M Innovative Properties Company Lapping carrier and method of using the same
DE102011089570A1 (de) 2011-12-22 2013-06-27 Siltronic Ag Führungskäfig zum beidseitigen Schleifen von mindestens einem scheibenförmigen Werkstück zwischen zwei rotierenden Arbeitsscheiben einer Schleifvorrichtung, Verfahren zur Herstellung des Führungskäfigs und Verfahren zum gleichzeitigen beidseitigen Schleifen von scheibenförmigen Werkstücken unter Verwendung des Führungskäfigs
US9017139B2 (en) 2013-03-12 2015-04-28 Seagate Technology Llc Lapping carrier having hard and soft properties, and methods
CN104924196A (zh) * 2014-03-20 2015-09-23 六晶金属科技（苏州）有限公司 一种led芯片级封装用金属基板的研磨方法
CN106163648A (zh) * 2014-04-10 2016-11-23 国际壳牌研究有限公司 制造负载型气体分离膜的方法
EP3137259A4 (en) 2014-05-02 2018-01-03 3M Innovative Properties Company Interrupted structured abrasive article and methods of polishing a workpiece
CN104385121A (zh) * 2014-09-30 2015-03-04 无锡康柏斯机械科技有限公司 一种硬盘基片研磨机的研磨承载装置
JP6707831B2 (ja) * 2015-10-09 2020-06-10 株式会社Sumco 研削装置および研削方法
US10556317B2 (en) 2016-03-03 2020-02-11 P.R. Hoffman Machine Products Inc. Polishing machine wafer holder
US20170252893A1 (en) * 2016-03-03 2017-09-07 P.R. Hoffman Machine Products Inc. Polishing machine work piece holder
CN108020774B (zh) * 2017-11-30 2020-03-20 上海华力微电子有限公司 小样品的去层方法
US10792786B2 (en) 2018-02-12 2020-10-06 Seagate Technology Llc Lapping carrier system with optimized carrier insert
CN113496870B (zh) * 2020-04-03 2022-07-26 重庆超硅半导体有限公司 一种集成电路用硅片边缘形貌控制方法
CN112435954B (zh) * 2020-11-25 2024-01-26 西安奕斯伟材料科技股份有限公司 一种晶圆载体的处理方法和晶圆载体
CN113146465B (zh) * 2021-04-06 2023-03-21 安徽禾臣新材料有限公司 一种薄型晶片双面研磨用吸附垫及生产方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1133895A (ja) * 1997-07-17 1999-02-09 Shin Kobe Electric Mach Co Ltd 被研磨物保持のためのキャリア材
JPH11254305A (ja) * 1998-03-12 1999-09-21 Shin Etsu Handotai Co Ltd ウエーハの両面研磨方法と該研磨方法に用いるウエーハキャリア

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US3453783A (en) 1966-06-30 1969-07-08 Texas Instruments Inc Apparatus for holding silicon slices
US3691694A (en) * 1970-11-02 1972-09-19 Ibm Wafer polishing machine
DE3524978A1 (de) 1985-07-12 1987-01-22 Wacker Chemitronic Verfahren zum beidseitigen abtragenden bearbeiten von scheibenfoermigen werkstuecken, insbesondere halbleiterscheiben
JPH0373265A (ja) * 1989-05-02 1991-03-28 Sekisui Chem Co Ltd 被研磨物保持用キャリヤ及びその製造方法
JP2849533B2 (ja) 1993-08-18 1999-01-20 長野電子工業株式会社 ウェーハの研磨方法
JP3379097B2 (ja) 1995-11-27 2003-02-17 信越半導体株式会社 両面研磨装置及び方法
US6077616A (en) * 1997-02-10 2000-06-20 Aluminum Company Of America Laminated strip for use as reflective vehicle trim
US5882245A (en) 1997-02-28 1999-03-16 Advanced Ceramics Research, Inc. Polymer carrier gears for polishing of flat objects
JPH1110530A (ja) 1997-06-25 1999-01-19 Shin Etsu Handotai Co Ltd 両面研磨用キャリア
US6030280A (en) 1997-07-23 2000-02-29 Speedfam Corporation Apparatus for holding workpieces during lapping, honing, and polishing
JP2974007B1 (ja) * 1997-10-20 1999-11-08 新神戸電機株式会社 被研磨物保持材及び被研磨物の製造法
US6080042A (en) * 1997-10-31 2000-06-27 Virginia Semiconductor, Inc. Flatness and throughput of single side polishing of wafers
CA2251056A1 (en) * 1997-11-20 1999-05-20 General Electric Company Impact modified compositions of compatibilized polyphenylene ether-polyamide resin blends
JPH11267964A (ja) * 1998-03-20 1999-10-05 Speedfam Co Ltd 平面研磨装置及びそれに用いるキャリヤ
US6419555B1 (en) * 1999-06-03 2002-07-16 Brian D. Goers Process and apparatus for polishing a workpiece
TW431434U (en) * 1999-10-22 2001-04-21 Ind Tech Res Inst Carrier for carrying non-circular workpiece
DE10023002B4 (de) 2000-05-11 2006-10-26 Siltronic Ag Satz von Läuferscheiben sowie dessen Verwendung
JP3439726B2 (ja) 2000-07-10 2003-08-25 住友ベークライト株式会社 被研磨物保持材及びその製造方法
US6454635B1 (en) 2000-08-08 2002-09-24 Memc Electronic Materials, Inc. Method and apparatus for a wafer carrier having an insert
US6709981B2 (en) * 2000-08-16 2004-03-23 Memc Electronic Materials, Inc. Method and apparatus for processing a semiconductor wafer using novel final polishing method
JP2002160156A (ja) 2000-11-27 2002-06-04 Fukushichi Fukuzaki 研磨用キャリア
DE10060697B4 (de) * 2000-12-07 2005-10-06 Siltronic Ag Doppelseiten-Polierverfahren mit reduzierter Kratzerrate und Vorrichtung zur Durchführung des Verfahrens
DE10132504C1 (de) 2001-07-05 2002-10-10 Wacker Siltronic Halbleitermat Verfahren zur beidseitigen Material abtragenden Bearbeitung von Halbleiterscheiben und seine Verwendung
US7008310B2 (en) * 2001-08-01 2006-03-07 Entegris, Inc. Wafer carrier wear indicator
US6673870B2 (en) * 2002-05-13 2004-01-06 The Procter & Gamble Company Compositions of polyolefins and hyperbranched polymers with improved tensile properties
US20040261945A1 (en) 2002-10-02 2004-12-30 Ensinger Kunststofftechnoligie Gbr Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus
US20040259485A1 (en) 2002-10-02 2004-12-23 Ensinger Kunstsofftechnoligie Gbr Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus
DE10250823B4 (de) * 2002-10-31 2005-02-03 Siltronic Ag Läuferscheibe und Verfahren zur gleichzeitig beidseitigen Bearbeitung von Werkstücken
US7008308B2 (en) * 2003-05-20 2006-03-07 Memc Electronic Materials, Inc. Wafer carrier
US20080166952A1 (en) * 2005-02-25 2008-07-10 Shin-Etsu Handotai Co., Ltd Carrier For Double-Side Polishing Apparatus, Double-Side Polishing Apparatus And Double-Side Polishing Method Using The Same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1133895A (ja) * 1997-07-17 1999-02-09 Shin Kobe Electric Mach Co Ltd 被研磨物保持のためのキャリア材
JPH11254305A (ja) * 1998-03-12 1999-09-21 Shin Etsu Handotai Co Ltd ウエーハの両面研磨方法と該研磨方法に用いるウエーハキャリア

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009099980A (ja) * 2007-10-17 2009-05-07 Siltronic Ag キャリア、キャリアを被覆する方法並びに半導体ウェハの両面を同時に材料除去する加工方法
US9539695B2 (en) 2007-10-17 2017-01-10 Siltronic Ag Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers

Also Published As

Publication number Publication date
WO2008064158A2 (en) 2008-05-29
KR20090082414A (ko) 2009-07-30
EP2097221A2 (en) 2009-09-09
WO2008064158A3 (en) 2008-07-10
EP2097221A4 (en) 2013-01-02
US8137157B2 (en) 2012-03-20
CN101541477B (zh) 2011-03-09
US20100048105A1 (en) 2010-02-25
KR101494912B1 (ko) 2015-02-23
TW200848207A (en) 2008-12-16
US8795033B2 (en) 2014-08-05
US20120135669A1 (en) 2012-05-31
TWI428205B (zh) 2014-03-01
CN101541477A (zh) 2009-09-23

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