KR101494912B1 - 래핑 캐리어 및 방법 - Google Patents

래핑 캐리어 및 방법 Download PDF

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Publication number
KR101494912B1
KR101494912B1 KR20097010304A KR20097010304A KR101494912B1 KR 101494912 B1 KR101494912 B1 KR 101494912B1 KR 20097010304 A KR20097010304 A KR 20097010304A KR 20097010304 A KR20097010304 A KR 20097010304A KR 101494912 B1 KR101494912 B1 KR 101494912B1
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South Korea
Prior art keywords
carrier
polymer
major surface
base carrier
lapping
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Korean (ko)
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KR20090082414A (ko
Inventor
티모씨 디. 플레처
토드 제이. 크리스천슨
빈센트 디. 로메로
브루스 에이. 스벤텍
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쓰리엠 이노베이티브 프로퍼티즈 컴파니
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Publication of KR20090082414A publication Critical patent/KR20090082414A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR20097010304A 2006-11-21 2007-11-19 래핑 캐리어 및 방법 Active KR101494912B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US86676806P 2006-11-21 2006-11-21
US60/866,768 2006-11-21
PCT/US2007/085103 WO2008064158A2 (en) 2006-11-21 2007-11-19 Lapping carrier and method

Publications (2)

Publication Number Publication Date
KR20090082414A KR20090082414A (ko) 2009-07-30
KR101494912B1 true KR101494912B1 (ko) 2015-02-23

Family

ID=39430535

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20097010304A Active KR101494912B1 (ko) 2006-11-21 2007-11-19 래핑 캐리어 및 방법

Country Status (7)

Country Link
US (2) US8137157B2 (enExample)
EP (1) EP2097221A4 (enExample)
JP (1) JP2010510083A (enExample)
KR (1) KR101494912B1 (enExample)
CN (1) CN101541477B (enExample)
TW (1) TWI428205B (enExample)
WO (1) WO2008064158A2 (enExample)

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KR101271444B1 (ko) * 2009-06-04 2013-06-05 가부시키가이샤 사무코 고정 연마 입자 가공 장치 및 고정 연마 입자 가공 방법, 그리고 반도체 웨이퍼 제조 방법
KR101209271B1 (ko) * 2009-08-21 2012-12-06 주식회사 엘지실트론 양면 연마 장치와 양면 연마 장치용 캐리어
CN102267108A (zh) * 2010-06-03 2011-12-07 中国砂轮企业股份有限公司 具有改质钻石磨料的研磨工具及其制造方法
DE102010032501B4 (de) 2010-07-28 2019-03-28 Siltronic Ag Verfahren und Vorrichtung zum Abrichten der Arbeitsschichten einer Doppelseiten-Schleifvorrichtung
DE102010042040A1 (de) 2010-10-06 2012-04-12 Siltronic Ag Verfahren zum Schleifen einer Halbleiterscheibe
DE102011003008B4 (de) 2011-01-21 2018-07-12 Siltronic Ag Führungskäfig und Verfahren zur gleichzeitig beidseitigen Material abtragenden Bearbeitung von Halbleiterscheiben
US20130017765A1 (en) * 2011-07-11 2013-01-17 3M Innovative Properties Company Lapping carrier and method of using the same
DE102011089570A1 (de) 2011-12-22 2013-06-27 Siltronic Ag Führungskäfig zum beidseitigen Schleifen von mindestens einem scheibenförmigen Werkstück zwischen zwei rotierenden Arbeitsscheiben einer Schleifvorrichtung, Verfahren zur Herstellung des Führungskäfigs und Verfahren zum gleichzeitigen beidseitigen Schleifen von scheibenförmigen Werkstücken unter Verwendung des Führungskäfigs
US9017139B2 (en) 2013-03-12 2015-04-28 Seagate Technology Llc Lapping carrier having hard and soft properties, and methods
CN104924196A (zh) * 2014-03-20 2015-09-23 六晶金属科技（苏州）有限公司 一种led芯片级封装用金属基板的研磨方法
US20150292090A1 (en) * 2014-04-10 2015-10-15 Shell Oil Company Method of making a supported gas separation membrane
KR20160147917A (ko) 2014-05-02 2016-12-23 쓰리엠 이노베이티브 프로퍼티즈 컴파니 불연속된 구조화된 연마 용품 및 작업편의 연마 방법
CN104385121A (zh) * 2014-09-30 2015-03-04 无锡康柏斯机械科技有限公司 一种硬盘基片研磨机的研磨承载装置
JP6707831B2 (ja) * 2015-10-09 2020-06-10 株式会社Sumco 研削装置および研削方法
US20170252893A1 (en) * 2016-03-03 2017-09-07 P.R. Hoffman Machine Products Inc. Polishing machine work piece holder
US10556317B2 (en) * 2016-03-03 2020-02-11 P.R. Hoffman Machine Products Inc. Polishing machine wafer holder
CN108020774B (zh) * 2017-11-30 2020-03-20 上海华力微电子有限公司 小样品的去层方法
US10792786B2 (en) 2018-02-12 2020-10-06 Seagate Technology Llc Lapping carrier system with optimized carrier insert
CN113496870B (zh) * 2020-04-03 2022-07-26 重庆超硅半导体有限公司 一种集成电路用硅片边缘形貌控制方法
CN112435954B (zh) * 2020-11-25 2024-01-26 西安奕斯伟材料科技股份有限公司 一种晶圆载体的处理方法和晶圆载体
CN113146465B (zh) * 2021-04-06 2023-03-21 安徽禾臣新材料有限公司 一种薄型晶片双面研磨用吸附垫及生产方法

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JPH1133895A (ja) * 1997-07-17 1999-02-09 Shin Kobe Electric Mach Co Ltd 被研磨物保持のためのキャリア材
JPH11254305A (ja) * 1998-03-12 1999-09-21 Shin Etsu Handotai Co Ltd ウエーハの両面研磨方法と該研磨方法に用いるウエーハキャリア

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JPH1133895A (ja) * 1997-07-17 1999-02-09 Shin Kobe Electric Mach Co Ltd 被研磨物保持のためのキャリア材
JPH11254305A (ja) * 1998-03-12 1999-09-21 Shin Etsu Handotai Co Ltd ウエーハの両面研磨方法と該研磨方法に用いるウエーハキャリア

Also Published As

Publication number Publication date
WO2008064158A3 (en) 2008-07-10
KR20090082414A (ko) 2009-07-30
US20100048105A1 (en) 2010-02-25
TWI428205B (zh) 2014-03-01
EP2097221A4 (en) 2013-01-02
TW200848207A (en) 2008-12-16
US8795033B2 (en) 2014-08-05
US20120135669A1 (en) 2012-05-31
CN101541477A (zh) 2009-09-23
JP2010510083A (ja) 2010-04-02
CN101541477B (zh) 2011-03-09
WO2008064158A2 (en) 2008-05-29
EP2097221A2 (en) 2009-09-09
US8137157B2 (en) 2012-03-20

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