JP2010503233A5 - - Google Patents
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- Publication number
- JP2010503233A5 JP2010503233A5 JP2009527432A JP2009527432A JP2010503233A5 JP 2010503233 A5 JP2010503233 A5 JP 2010503233A5 JP 2009527432 A JP2009527432 A JP 2009527432A JP 2009527432 A JP2009527432 A JP 2009527432A JP 2010503233 A5 JP2010503233 A5 JP 2010503233A5
- Authority
- JP
- Japan
- Prior art keywords
- composition
- cmp
- substituted
- alkyl
- aryl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 125000003118 aryl group Chemical group 0.000 claims 19
- 125000000217 alkyl group Chemical group 0.000 claims 14
- 238000000034 method Methods 0.000 claims 12
- 125000001424 substituent group Chemical group 0.000 claims 11
- 238000005498 polishing Methods 0.000 claims 10
- 150000004714 phosphonium salts Chemical class 0.000 claims 9
- 239000000758 substrate Substances 0.000 claims 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 8
- 239000008119 colloidal silica Substances 0.000 claims 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims 6
- 150000004010 onium ions Chemical class 0.000 claims 6
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 claims 5
- 150000007524 organic acids Chemical class 0.000 claims 5
- 239000000126 substance Substances 0.000 claims 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 4
- 125000004185 ester group Chemical group 0.000 claims 4
- 125000001033 ether group Chemical group 0.000 claims 4
- 125000000623 heterocyclic group Chemical group 0.000 claims 4
- 150000002430 hydrocarbons Chemical group 0.000 claims 4
- 229920006395 saturated elastomer Polymers 0.000 claims 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 3
- 239000004215 Carbon black (E152) Substances 0.000 claims 3
- 239000008365 aqueous carrier Substances 0.000 claims 3
- 229910052799 carbon Inorganic materials 0.000 claims 3
- 229930195733 hydrocarbon Natural products 0.000 claims 3
- 150000007522 mineralic acids Chemical class 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims 2
- 229910052739 hydrogen Inorganic materials 0.000 claims 2
- 239000001257 hydrogen Substances 0.000 claims 2
- 229910052698 phosphorus Inorganic materials 0.000 claims 2
- 239000011574 phosphorus Substances 0.000 claims 2
- 229910052717 sulfur Inorganic materials 0.000 claims 2
- 239000011593 sulfur Substances 0.000 claims 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- 235000005985 organic acids Nutrition 0.000 claims 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 235000012239 silicon dioxide Nutrition 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/517,909 | 2006-09-08 | ||
| US11/517,909 US9129907B2 (en) | 2006-09-08 | 2006-09-08 | Onium-containing CMP compositions and methods of use thereof |
| PCT/US2007/019570 WO2008030576A1 (en) | 2006-09-08 | 2007-09-07 | Onium-containing cmp compositions and methods of use thereof |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010503233A JP2010503233A (ja) | 2010-01-28 |
| JP2010503233A5 true JP2010503233A5 (enExample) | 2010-09-24 |
| JP5385142B2 JP5385142B2 (ja) | 2014-01-08 |
Family
ID=39157555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009527432A Active JP5385142B2 (ja) | 2006-09-08 | 2007-09-07 | オニウム含有ｃｍｐ組成物、およびそれらの使用方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US9129907B2 (enExample) |
| EP (1) | EP2069452B1 (enExample) |
| JP (1) | JP5385142B2 (enExample) |
| KR (1) | KR101397856B1 (enExample) |
| CN (1) | CN101511966B (enExample) |
| MY (1) | MY154310A (enExample) |
| SG (1) | SG174778A1 (enExample) |
| TW (1) | TWI361831B (enExample) |
| WO (1) | WO2008030576A1 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5452859B2 (ja) * | 2007-11-05 | 2014-03-26 | 富士フイルム株式会社 | 金属研磨用組成物、及び金属研磨方法 |
| KR101247890B1 (ko) * | 2008-09-19 | 2013-03-26 | 캐보트 마이크로일렉트로닉스 코포레이션 | 저-ｋ 유전체를 위한 장벽 슬러리 |
| JP5493526B2 (ja) * | 2009-07-14 | 2014-05-14 | 日立化成株式会社 | Ｃｍｐ用研磨液及び研磨方法 |
| US8999193B2 (en) | 2012-05-10 | 2015-04-07 | Air Products And Chemicals, Inc. | Chemical mechanical polishing composition having chemical additives and methods for using same |
| WO2014007063A1 (ja) * | 2012-07-06 | 2014-01-09 | 日立化成株式会社 | Ｃｍｐ用研磨液、貯蔵液及び研磨方法 |
| KR102458648B1 (ko) * | 2014-07-09 | 2022-10-26 | 쇼와덴코머티리얼즈가부시끼가이샤 | Cmp용 연마액 및 연마 방법 |
| US10544332B2 (en) | 2015-08-19 | 2020-01-28 | Ferro Corporation | Slurry composition and method of use |
| WO2018058347A1 (en) * | 2016-09-28 | 2018-04-05 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing of tungsten using method and composition containing quaternary phosphonium compounds |
| US12291655B2 (en) | 2021-04-27 | 2025-05-06 | DuPont Electronic Materials Holding, Inc. | Polishing composition and method of polishing a substrate having enhanced defect reduction |
| US11274230B1 (en) * | 2021-04-27 | 2022-03-15 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing composition and method of polishing a substrate having enhanced defect inhibition |
| WO2025019194A2 (en) * | 2023-07-14 | 2025-01-23 | Fujifilm Electronic Materials U.S.A., Inc. | Polishing compositions and methods of use thereof |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4528384A (en) * | 1980-06-30 | 1985-07-09 | The Dow Chemical Company | Addition polymerizable aromatic sulfonium salts and polymers thereof |
| GB8504862D0 (en) * | 1985-02-26 | 1985-03-27 | Unilever Plc | Liquid detergent composition |
| US5234493A (en) * | 1988-11-08 | 1993-08-10 | Rhone-Poulenc Chimie | Stable, pumpable aqueous suspensions of precipitated silica particulates |
| US5393469A (en) * | 1992-03-20 | 1995-02-28 | Lumigen, Inc. | Polymeric phosphonium salts providing enhanced chemiluminescence from 1,2-dioxetanes |
| US5858813A (en) * | 1996-05-10 | 1999-01-12 | Cabot Corporation | Chemical mechanical polishing slurry for metal layers and films |
| US5958288A (en) * | 1996-11-26 | 1999-09-28 | Cabot Corporation | Composition and slurry useful for metal CMP |
| EP0853335A3 (en) * | 1997-01-10 | 1999-01-07 | Texas Instruments Incorporated | Slurry and process for the mechano-chemical polishing of semiconductor devices |
| US6083419A (en) * | 1997-07-28 | 2000-07-04 | Cabot Corporation | Polishing composition including an inhibitor of tungsten etching |
| JP2000144109A (ja) * | 1998-11-10 | 2000-05-26 | Okamoto Machine Tool Works Ltd | 化学機械研磨用研磨剤スラリ− |
| US6046112A (en) * | 1998-12-14 | 2000-04-04 | Taiwan Semiconductor Manufacturing Company | Chemical mechanical polishing slurry |
| JP3841995B2 (ja) * | 1999-12-28 | 2006-11-08 | Ｎｅｃエレクトロニクス株式会社 | 化学的機械的研磨用スラリー |
| DE10022649B4 (de) * | 2000-04-28 | 2008-06-19 | Qimonda Ag | Polierflüssigkeit und Verfahren zur Strukturierung von Metalloxiden |
| JP4507141B2 (ja) * | 2000-05-22 | 2010-07-21 | 隆章 徳永 | 研磨用組成物、その製造方法およびそれを用いた研磨方法 |
| JP3768401B2 (ja) * | 2000-11-24 | 2006-04-19 | Ｎｅｃエレクトロニクス株式会社 | 化学的機械的研磨用スラリー |
| US6974777B2 (en) * | 2002-06-07 | 2005-12-13 | Cabot Microelectronics Corporation | CMP compositions for low-k dielectric materials |
| JP2004247605A (ja) * | 2003-02-14 | 2004-09-02 | Toshiba Corp | Ｃｍｐ用スラリーおよび半導体装置の製造方法 |
| US7018560B2 (en) * | 2003-08-05 | 2006-03-28 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Composition for polishing semiconductor layers |
| US7968465B2 (en) * | 2003-08-14 | 2011-06-28 | Dupont Air Products Nanomaterials Llc | Periodic acid compositions for polishing ruthenium/low K substrates |
| US20050076580A1 (en) * | 2003-10-10 | 2005-04-14 | Air Products And Chemicals, Inc. | Polishing composition and use thereof |
| US7504044B2 (en) * | 2004-11-05 | 2009-03-17 | Cabot Microelectronics Corporation | Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios |
-
2006
- 2006-09-08 US US11/517,909 patent/US9129907B2/en active Active
-
2007
- 2007-09-07 SG SG2011064185A patent/SG174778A1/en unknown
- 2007-09-07 JP JP2009527432A patent/JP5385142B2/ja active Active
- 2007-09-07 MY MYPI20090940A patent/MY154310A/en unknown
- 2007-09-07 CN CN2007800334284A patent/CN101511966B/zh not_active Ceased
- 2007-09-07 KR KR1020097007113A patent/KR101397856B1/ko active Active
- 2007-09-07 EP EP07837904.7A patent/EP2069452B1/en active Active
- 2007-09-07 WO PCT/US2007/019570 patent/WO2008030576A1/en not_active Ceased
- 2007-09-07 TW TW96133589A patent/TWI361831B/zh active
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