SG174778A1 - Onium-containing cmp compositions and methods of use thereof - Google Patents

Onium-containing cmp compositions and methods of use thereof Download PDF

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Publication number
SG174778A1
SG174778A1 SG2011064185A SG2011064185A SG174778A1 SG 174778 A1 SG174778 A1 SG 174778A1 SG 2011064185 A SG2011064185 A SG 2011064185A SG 2011064185 A SG2011064185 A SG 2011064185A SG 174778 A1 SG174778 A1 SG 174778A1
Authority
SG
Singapore
Prior art keywords
composition
cmp
substituent
substituted
alkyl
Prior art date
Application number
SG2011064185A
Other languages
English (en)
Inventor
Michael White
Zhan Chen
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=39157555&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SG174778(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of SG174778A1 publication Critical patent/SG174778A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H10P95/062—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG2011064185A 2006-09-08 2007-09-07 Onium-containing cmp compositions and methods of use thereof SG174778A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/517,909 US9129907B2 (en) 2006-09-08 2006-09-08 Onium-containing CMP compositions and methods of use thereof

Publications (1)

Publication Number Publication Date
SG174778A1 true SG174778A1 (en) 2011-10-28

Family

ID=39157555

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2011064185A SG174778A1 (en) 2006-09-08 2007-09-07 Onium-containing cmp compositions and methods of use thereof

Country Status (9)

Country Link
US (1) US9129907B2 (enExample)
EP (1) EP2069452B1 (enExample)
JP (1) JP5385142B2 (enExample)
KR (1) KR101397856B1 (enExample)
CN (1) CN101511966B (enExample)
MY (1) MY154310A (enExample)
SG (1) SG174778A1 (enExample)
TW (1) TWI361831B (enExample)
WO (1) WO2008030576A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5452859B2 (ja) * 2007-11-05 2014-03-26 富士フイルム株式会社 金属研磨用組成物、及び金属研磨方法
MY150487A (en) * 2008-09-19 2014-01-30 Cabot Microelectronics Corp Barrier slurry for low-k dielectrics.
JP5493526B2 (ja) * 2009-07-14 2014-05-14 日立化成株式会社 Ｃｍｐ用研磨液及び研磨方法
US8999193B2 (en) 2012-05-10 2015-04-07 Air Products And Chemicals, Inc. Chemical mechanical polishing composition having chemical additives and methods for using same
WO2014007063A1 (ja) * 2012-07-06 2014-01-09 日立化成株式会社 Ｃｍｐ用研磨液、貯蔵液及び研磨方法
WO2016006631A1 (ja) * 2014-07-09 2016-01-14 日立化成株式会社 Ｃｍｐ用研磨液及び研磨方法
CN107922786B (zh) 2015-08-19 2023-02-03 费罗公司 浆料组合物和使用方法
WO2018058347A1 (en) * 2016-09-28 2018-04-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing of tungsten using method and composition containing quaternary phosphonium compounds
US12291655B2 (en) 2021-04-27 2025-05-06 DuPont Electronic Materials Holding, Inc. Polishing composition and method of polishing a substrate having enhanced defect reduction
US11274230B1 (en) * 2021-04-27 2022-03-15 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing composition and method of polishing a substrate having enhanced defect inhibition
US20250019569A1 (en) * 2023-07-14 2025-01-16 Fujifilm Electronic Materials U.S.A., Inc. Polishing compositions and methods of use thereof

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4528384A (en) * 1980-06-30 1985-07-09 The Dow Chemical Company Addition polymerizable aromatic sulfonium salts and polymers thereof
GB8504862D0 (en) * 1985-02-26 1985-03-27 Unilever Plc Liquid detergent composition
US5234493A (en) * 1988-11-08 1993-08-10 Rhone-Poulenc Chimie Stable, pumpable aqueous suspensions of precipitated silica particulates
US5393469A (en) * 1992-03-20 1995-02-28 Lumigen, Inc. Polymeric phosphonium salts providing enhanced chemiluminescence from 1,2-dioxetanes
US5858813A (en) * 1996-05-10 1999-01-12 Cabot Corporation Chemical mechanical polishing slurry for metal layers and films
US5958288A (en) * 1996-11-26 1999-09-28 Cabot Corporation Composition and slurry useful for metal CMP
EP0853335A3 (en) * 1997-01-10 1999-01-07 Texas Instruments Incorporated Slurry and process for the mechano-chemical polishing of semiconductor devices
US6083419A (en) * 1997-07-28 2000-07-04 Cabot Corporation Polishing composition including an inhibitor of tungsten etching
JP2000144109A (ja) * 1998-11-10 2000-05-26 Okamoto Machine Tool Works Ltd 化学機械研磨用研磨剤スラリ−
US6046112A (en) * 1998-12-14 2000-04-04 Taiwan Semiconductor Manufacturing Company Chemical mechanical polishing slurry
JP3841995B2 (ja) * 1999-12-28 2006-11-08 Ｎｅｃエレクトロニクス株式会社 化学的機械的研磨用スラリー
DE10022649B4 (de) * 2000-04-28 2008-06-19 Qimonda Ag Polierflüssigkeit und Verfahren zur Strukturierung von Metalloxiden
JP4507141B2 (ja) * 2000-05-22 2010-07-21 隆章 徳永 研磨用組成物、その製造方法およびそれを用いた研磨方法
JP3768401B2 (ja) * 2000-11-24 2006-04-19 Ｎｅｃエレクトロニクス株式会社 化学的機械的研磨用スラリー
US6974777B2 (en) * 2002-06-07 2005-12-13 Cabot Microelectronics Corporation CMP compositions for low-k dielectric materials
JP2004247605A (ja) * 2003-02-14 2004-09-02 Toshiba Corp Ｃｍｐ用スラリーおよび半導体装置の製造方法
US7018560B2 (en) * 2003-08-05 2006-03-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Composition for polishing semiconductor layers
WO2005019364A1 (en) * 2003-08-14 2005-03-03 Ekc Technology, Inc. Periodic acid compositions for polishing ruthenium/high k substrates
US20050076580A1 (en) * 2003-10-10 2005-04-14 Air Products And Chemicals, Inc. Polishing composition and use thereof
US7504044B2 (en) * 2004-11-05 2009-03-17 Cabot Microelectronics Corporation Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios

Also Published As

Publication number Publication date
WO2008030576A1 (en) 2008-03-13
EP2069452B1 (en) 2016-11-09
JP5385142B2 (ja) 2014-01-08
MY154310A (en) 2015-05-29
CN101511966B (zh) 2013-01-16
CN101511966A (zh) 2009-08-19
JP2010503233A (ja) 2010-01-28
US20080060278A1 (en) 2008-03-13
TWI361831B (en) 2012-04-11
US9129907B2 (en) 2015-09-08
TW200821376A (en) 2008-05-16
EP2069452A1 (en) 2009-06-17
KR101397856B1 (ko) 2014-05-20
KR20090051269A (ko) 2009-05-21
EP2069452A4 (en) 2010-11-03

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