MY154310A - Onium-containing cmp compositions and methods for use thereof - Google Patents

Onium-containing cmp compositions and methods for use thereof

Info

Publication number
MY154310A
MY154310A MYPI20090940A MYPI20090940A MY154310A MY 154310 A MY154310 A MY 154310A MY PI20090940 A MYPI20090940 A MY PI20090940A MY PI20090940 A MYPI20090940 A MY PI20090940A MY 154310 A MY154310 A MY 154310A
Authority
MY
Malaysia
Prior art keywords
onium
methods
composition
polishing
cmp compositions
Prior art date
Application number
MYPI20090940A
Other languages
English (en)
Inventor
Chen Zhan
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=39157555&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MY154310(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of MY154310A publication Critical patent/MY154310A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
MYPI20090940A 2006-09-08 2007-09-07 Onium-containing cmp compositions and methods for use thereof MY154310A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/517,909 US9129907B2 (en) 2006-09-08 2006-09-08 Onium-containing CMP compositions and methods of use thereof

Publications (1)

Publication Number Publication Date
MY154310A true MY154310A (en) 2015-05-29

Family

ID=39157555

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20090940A MY154310A (en) 2006-09-08 2007-09-07 Onium-containing cmp compositions and methods for use thereof

Country Status (9)

Country Link
US (1) US9129907B2 (enExample)
EP (1) EP2069452B1 (enExample)
JP (1) JP5385142B2 (enExample)
KR (1) KR101397856B1 (enExample)
CN (1) CN101511966B (enExample)
MY (1) MY154310A (enExample)
SG (1) SG174778A1 (enExample)
TW (1) TWI361831B (enExample)
WO (1) WO2008030576A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5452859B2 (ja) * 2007-11-05 2014-03-26 富士フイルム株式会社 金属研磨用組成物、及び金属研磨方法
WO2010033156A2 (en) * 2008-09-19 2010-03-25 Cabot Microelectronics Corporation Barrier slurry for low-k dielectrics
JP5493526B2 (ja) * 2009-07-14 2014-05-14 日立化成株式会社 Ｃｍｐ用研磨液及び研磨方法
US8999193B2 (en) 2012-05-10 2015-04-07 Air Products And Chemicals, Inc. Chemical mechanical polishing composition having chemical additives and methods for using same
WO2014007063A1 (ja) * 2012-07-06 2014-01-09 日立化成株式会社 Ｃｍｐ用研磨液、貯蔵液及び研磨方法
JP6631520B2 (ja) * 2014-07-09 2020-01-15 日立化成株式会社 Ｃｍｐ用研磨液及び研磨方法
CN107922786B (zh) 2015-08-19 2023-02-03 费罗公司 浆料组合物和使用方法
KR102649775B1 (ko) * 2016-09-28 2024-03-20 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 4차 포스포늄 화합물을 포함하는 조성물 및 방법을 사용하는 텅스텐의 화학 기계적 연마
US12291655B2 (en) 2021-04-27 2025-05-06 DuPont Electronic Materials Holding, Inc. Polishing composition and method of polishing a substrate having enhanced defect reduction
US11274230B1 (en) * 2021-04-27 2022-03-15 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing composition and method of polishing a substrate having enhanced defect inhibition
CN121620574A (zh) * 2023-07-14 2026-03-06 富士胶片电子材料美国有限公司 抛光组成物及其使用方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4528384A (en) * 1980-06-30 1985-07-09 The Dow Chemical Company Addition polymerizable aromatic sulfonium salts and polymers thereof
GB8504862D0 (en) * 1985-02-26 1985-03-27 Unilever Plc Liquid detergent composition
US5234493A (en) * 1988-11-08 1993-08-10 Rhone-Poulenc Chimie Stable, pumpable aqueous suspensions of precipitated silica particulates
US5393469A (en) * 1992-03-20 1995-02-28 Lumigen, Inc. Polymeric phosphonium salts providing enhanced chemiluminescence from 1,2-dioxetanes
US5858813A (en) * 1996-05-10 1999-01-12 Cabot Corporation Chemical mechanical polishing slurry for metal layers and films
US5958288A (en) * 1996-11-26 1999-09-28 Cabot Corporation Composition and slurry useful for metal CMP
EP0853335A3 (en) * 1997-01-10 1999-01-07 Texas Instruments Incorporated Slurry and process for the mechano-chemical polishing of semiconductor devices
US6083419A (en) * 1997-07-28 2000-07-04 Cabot Corporation Polishing composition including an inhibitor of tungsten etching
JP2000144109A (ja) * 1998-11-10 2000-05-26 Okamoto Machine Tool Works Ltd 化学機械研磨用研磨剤スラリ−
US6046112A (en) * 1998-12-14 2000-04-04 Taiwan Semiconductor Manufacturing Company Chemical mechanical polishing slurry
JP3841995B2 (ja) * 1999-12-28 2006-11-08 Ｎｅｃエレクトロニクス株式会社 化学的機械的研磨用スラリー
DE10022649B4 (de) * 2000-04-28 2008-06-19 Qimonda Ag Polierflüssigkeit und Verfahren zur Strukturierung von Metalloxiden
JP4507141B2 (ja) * 2000-05-22 2010-07-21 隆章 徳永 研磨用組成物、その製造方法およびそれを用いた研磨方法
JP3768401B2 (ja) * 2000-11-24 2006-04-19 Ｎｅｃエレクトロニクス株式会社 化学的機械的研磨用スラリー
US6974777B2 (en) * 2002-06-07 2005-12-13 Cabot Microelectronics Corporation CMP compositions for low-k dielectric materials
JP2004247605A (ja) * 2003-02-14 2004-09-02 Toshiba Corp Ｃｍｐ用スラリーおよび半導体装置の製造方法
US7018560B2 (en) * 2003-08-05 2006-03-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Composition for polishing semiconductor layers
US7968465B2 (en) * 2003-08-14 2011-06-28 Dupont Air Products Nanomaterials Llc Periodic acid compositions for polishing ruthenium/low K substrates
US20050076580A1 (en) * 2003-10-10 2005-04-14 Air Products And Chemicals, Inc. Polishing composition and use thereof
US7504044B2 (en) * 2004-11-05 2009-03-17 Cabot Microelectronics Corporation Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios

Also Published As

Publication number Publication date
US20080060278A1 (en) 2008-03-13
SG174778A1 (en) 2011-10-28
KR101397856B1 (ko) 2014-05-20
US9129907B2 (en) 2015-09-08
EP2069452B1 (en) 2016-11-09
JP5385142B2 (ja) 2014-01-08
CN101511966A (zh) 2009-08-19
TW200821376A (en) 2008-05-16
WO2008030576A1 (en) 2008-03-13
JP2010503233A (ja) 2010-01-28
KR20090051269A (ko) 2009-05-21
TWI361831B (en) 2012-04-11
EP2069452A1 (en) 2009-06-17
CN101511966B (zh) 2013-01-16
EP2069452A4 (en) 2010-11-03

Similar Documents

Publication Publication Date Title
MY154310A (en) Onium-containing cmp compositions and methods for use thereof
WO2004072199A3 (en) Mixed-abrasive polishing composition and method for using the same
MY150866A (en) Compositions and methods for polishing silicon nitride materials
ATE338100T1 (de) Cmp-zusammensetzung enthaltend silanmodifizierte- schleifteilchen
WO2006099171A3 (en) NOVEL GeSiSn-BASED COMPOUNDS, TEMPLATES, AND SEMICONDUCTOR STRUCTURES
TW200732460A (en) Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios
MY153666A (en) Cmp method for metal-containing substrates
TW200740972A (en) Metal polishing slurry
WO2009158507A3 (en) Chemical mechanical planarization pad conditioner and method of forming
TW200734437A (en) Polishing liquid for barrier layer
TW200736354A (en) Free radical-forming activator attached to solid and used to enhance CMP formulations
TW200738856A (en) Polishing composition and polishing method
WO2000000560A3 (en) Chemical mechanical polishing slurry and method for using same
MY148323A (en) Stable, high rate silicon slurry
TW200613512A (en) Luminescent silicon oxide flakes
SG141356A1 (en) Polishing slurry and polishing method using same
WO2007101957A3 (fr) Meule d'ebarbage fine, utilisation de cette meule, procede et dispositif pour la fabriquer.
WO2002102920A8 (en) A silica and a silica-based slurry
TW200703491A (en) Composition for selectively polishing silicon nitride layer and polishing method employing it
MY138857A (en) High selectivity colloidal silica slurry
UA88774C2 (ru) противозасаливающая композиция, абразивное изделие, содержащее противозасаливающую композицию, и процесс шлифования поверхности
WO2007111813A3 (en) Iodate-containing chemical-mechanical polishing compositions and methods
TW200617151A (en) Polishing composition and polishing method using the same
TW200706619A (en) Polishing composition and method for defect improvement by reduced particle stiction on copper surface
WO2007149113A3 (en) Friction reducing aid for cmp