CN101511966B - 含有鎓的cmp组合物及其使用方法 - Google Patents

含有鎓的cmp组合物及其使用方法 Download PDF

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Publication number
CN101511966B
CN101511966B CN2007800334284A CN200780033428A CN101511966B CN 101511966 B CN101511966 B CN 101511966B CN 2007800334284 A CN2007800334284 A CN 2007800334284A CN 200780033428 A CN200780033428 A CN 200780033428A CN 101511966 B CN101511966 B CN 101511966B
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CN
China
Prior art keywords
composition
cmp
alkyl
polishing
substrate
Prior art date
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Ceased
Application number
CN2007800334284A
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English (en)
Chinese (zh)
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CN101511966A (zh
Inventor
迈克尔·怀特
陈湛
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CMC Materials LLC
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Cabot Microelectronics Corp
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Publication date
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Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of CN101511966A publication Critical patent/CN101511966A/zh
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Publication of CN101511966B publication Critical patent/CN101511966B/zh
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CN2007800334284A 2006-09-08 2007-09-07 含有鎓的cmp组合物及其使用方法 Ceased CN101511966B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/517,909 2006-09-08
US11/517,909 US9129907B2 (en) 2006-09-08 2006-09-08 Onium-containing CMP compositions and methods of use thereof
PCT/US2007/019570 WO2008030576A1 (en) 2006-09-08 2007-09-07 Onium-containing cmp compositions and methods of use thereof

Publications (2)

Publication Number Publication Date
CN101511966A CN101511966A (zh) 2009-08-19
CN101511966B true CN101511966B (zh) 2013-01-16

Family

ID=39157555

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007800334284A Ceased CN101511966B (zh) 2006-09-08 2007-09-07 含有鎓的cmp组合物及其使用方法

Country Status (9)

Country Link
US (1) US9129907B2 (enExample)
EP (1) EP2069452B1 (enExample)
JP (1) JP5385142B2 (enExample)
KR (1) KR101397856B1 (enExample)
CN (1) CN101511966B (enExample)
MY (1) MY154310A (enExample)
SG (1) SG174778A1 (enExample)
TW (1) TWI361831B (enExample)
WO (1) WO2008030576A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5452859B2 (ja) * 2007-11-05 2014-03-26 富士フイルム株式会社 金属研磨用組成物、及び金属研磨方法
KR101247890B1 (ko) * 2008-09-19 2013-03-26 캐보트 마이크로일렉트로닉스 코포레이션 저-ｋ 유전체를 위한 장벽 슬러리
JP5493526B2 (ja) * 2009-07-14 2014-05-14 日立化成株式会社 Ｃｍｐ用研磨液及び研磨方法
US8999193B2 (en) 2012-05-10 2015-04-07 Air Products And Chemicals, Inc. Chemical mechanical polishing composition having chemical additives and methods for using same
WO2014007063A1 (ja) * 2012-07-06 2014-01-09 日立化成株式会社 Ｃｍｐ用研磨液、貯蔵液及び研磨方法
KR102458648B1 (ko) * 2014-07-09 2022-10-26 쇼와덴코머티리얼즈가부시끼가이샤 Cmp용 연마액 및 연마 방법
US10544332B2 (en) 2015-08-19 2020-01-28 Ferro Corporation Slurry composition and method of use
WO2018058347A1 (en) * 2016-09-28 2018-04-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing of tungsten using method and composition containing quaternary phosphonium compounds
US12291655B2 (en) 2021-04-27 2025-05-06 DuPont Electronic Materials Holding, Inc. Polishing composition and method of polishing a substrate having enhanced defect reduction
US11274230B1 (en) * 2021-04-27 2022-03-15 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing composition and method of polishing a substrate having enhanced defect inhibition
WO2025019194A2 (en) * 2023-07-14 2025-01-23 Fujifilm Electronic Materials U.S.A., Inc. Polishing compositions and methods of use thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4528384A (en) * 1980-06-30 1985-07-09 The Dow Chemical Company Addition polymerizable aromatic sulfonium salts and polymers thereof
US5439617A (en) * 1992-03-20 1995-08-08 Lumigen, Inc. Polymeric phosphonium salts providing enhanced chemiluminescence from 1,2-dioxetanes

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GB8504862D0 (en) * 1985-02-26 1985-03-27 Unilever Plc Liquid detergent composition
US5234493A (en) * 1988-11-08 1993-08-10 Rhone-Poulenc Chimie Stable, pumpable aqueous suspensions of precipitated silica particulates
US5858813A (en) * 1996-05-10 1999-01-12 Cabot Corporation Chemical mechanical polishing slurry for metal layers and films
US5958288A (en) * 1996-11-26 1999-09-28 Cabot Corporation Composition and slurry useful for metal CMP
EP0853335A3 (en) * 1997-01-10 1999-01-07 Texas Instruments Incorporated Slurry and process for the mechano-chemical polishing of semiconductor devices
US6083419A (en) * 1997-07-28 2000-07-04 Cabot Corporation Polishing composition including an inhibitor of tungsten etching
JP2000144109A (ja) * 1998-11-10 2000-05-26 Okamoto Machine Tool Works Ltd 化学機械研磨用研磨剤スラリ−
US6046112A (en) * 1998-12-14 2000-04-04 Taiwan Semiconductor Manufacturing Company Chemical mechanical polishing slurry
JP3841995B2 (ja) * 1999-12-28 2006-11-08 Ｎｅｃエレクトロニクス株式会社 化学的機械的研磨用スラリー
DE10022649B4 (de) * 2000-04-28 2008-06-19 Qimonda Ag Polierflüssigkeit und Verfahren zur Strukturierung von Metalloxiden
JP4507141B2 (ja) * 2000-05-22 2010-07-21 隆章 徳永 研磨用組成物、その製造方法およびそれを用いた研磨方法
JP3768401B2 (ja) * 2000-11-24 2006-04-19 Ｎｅｃエレクトロニクス株式会社 化学的機械的研磨用スラリー
US6974777B2 (en) * 2002-06-07 2005-12-13 Cabot Microelectronics Corporation CMP compositions for low-k dielectric materials
JP2004247605A (ja) * 2003-02-14 2004-09-02 Toshiba Corp Ｃｍｐ用スラリーおよび半導体装置の製造方法
US7018560B2 (en) * 2003-08-05 2006-03-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Composition for polishing semiconductor layers
US7968465B2 (en) * 2003-08-14 2011-06-28 Dupont Air Products Nanomaterials Llc Periodic acid compositions for polishing ruthenium/low K substrates
US20050076580A1 (en) * 2003-10-10 2005-04-14 Air Products And Chemicals, Inc. Polishing composition and use thereof
US7504044B2 (en) * 2004-11-05 2009-03-17 Cabot Microelectronics Corporation Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4528384A (en) * 1980-06-30 1985-07-09 The Dow Chemical Company Addition polymerizable aromatic sulfonium salts and polymers thereof
US5439617A (en) * 1992-03-20 1995-08-08 Lumigen, Inc. Polymeric phosphonium salts providing enhanced chemiluminescence from 1,2-dioxetanes

Also Published As

Publication number Publication date
EP2069452A1 (en) 2009-06-17
TWI361831B (en) 2012-04-11
CN101511966A (zh) 2009-08-19
WO2008030576A1 (en) 2008-03-13
US20080060278A1 (en) 2008-03-13
EP2069452B1 (en) 2016-11-09
KR20090051269A (ko) 2009-05-21
KR101397856B1 (ko) 2014-05-20
US9129907B2 (en) 2015-09-08
JP2010503233A (ja) 2010-01-28
EP2069452A4 (en) 2010-11-03
JP5385142B2 (ja) 2014-01-08
MY154310A (en) 2015-05-29
TW200821376A (en) 2008-05-16
SG174778A1 (en) 2011-10-28

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GR01 Patent grant
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CP01 Change in the name or title of a patent holder

Address after: Illinois, USA

Patentee after: CMC Materials Co.,Ltd.

Address before: Illinois, USA

Patentee before: CABOT MICROELECTRONICS Corp.

IW01 Full invalidation of patent right
IW01 Full invalidation of patent right

Decision date of declaring invalidation: 20180409

Decision number of declaring invalidation: 35437

Granted publication date: 20130116