JP2012526830A5 - - Google Patents
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- Publication number
- JP2012526830A5 JP2012526830A5 JP2012510961A JP2012510961A JP2012526830A5 JP 2012526830 A5 JP2012526830 A5 JP 2012526830A5 JP 2012510961 A JP2012510961 A JP 2012510961A JP 2012510961 A JP2012510961 A JP 2012510961A JP 2012526830 A5 JP2012526830 A5 JP 2012526830A5
- Authority
- JP
- Japan
- Prior art keywords
- substituted
- alkyl
- unsubstituted aryl
- hydrogen
- hso
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 125000000217 alkyl group Chemical group 0.000 claims description 12
- 229910052739 hydrogen Inorganic materials 0.000 claims description 10
- 239000001257 hydrogen Substances 0.000 claims description 10
- 125000003118 aryl group Chemical group 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- CLRSZXHOSMKUIB-UHFFFAOYSA-M benzenediazonium chloride Chemical class [Cl-].N#[N+]C1=CC=CC=C1 CLRSZXHOSMKUIB-UHFFFAOYSA-M 0.000 claims description 6
- 150000002431 hydrogen Chemical class 0.000 claims description 6
- CIUQDSCDWFSTQR-UHFFFAOYSA-N [C]1=CC=CC=C1 Chemical group [C]1=CC=CC=C1 CIUQDSCDWFSTQR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052582 BN Inorganic materials 0.000 claims description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- 125000003545 alkoxy group Chemical group 0.000 claims description 4
- 239000007795 chemical reaction product Substances 0.000 claims description 4
- 229910052736 halogen Inorganic materials 0.000 claims description 4
- 150000002367 halogens Chemical class 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 0 Cc1ccc(*)cc1 Chemical compound Cc1ccc(*)cc1 0.000 description 2
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/465,042 US8258346B2 (en) | 2009-05-13 | 2009-05-13 | Surface modified hexagonal boron nitride particles |
| US12/465,042 | 2009-05-13 | ||
| PCT/US2010/034462 WO2010132512A2 (en) | 2009-05-13 | 2010-05-12 | Surface modified hexagonal boron nitride particles |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012526830A JP2012526830A (ja) | 2012-11-01 |
| JP2012526830A5 true JP2012526830A5 (enExample) | 2013-06-20 |
| JP5619149B2 JP5619149B2 (ja) | 2014-11-05 |
Family
ID=43069051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012510961A Expired - Fee Related JP5619149B2 (ja) | 2009-05-13 | 2010-05-12 | 表面改質六方晶窒化ホウ素粒子 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8258346B2 (enExample) |
| EP (1) | EP2429943A4 (enExample) |
| JP (1) | JP5619149B2 (enExample) |
| KR (1) | KR20120024756A (enExample) |
| CN (1) | CN102421701B (enExample) |
| WO (1) | WO2010132512A2 (enExample) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8288466B2 (en) * | 2009-05-13 | 2012-10-16 | E I Du Pont De Nemours And Company | Composite of a polymer and surface modified hexagonal boron nitride particles |
| US8440292B2 (en) * | 2009-05-13 | 2013-05-14 | E I Du Pont De Nemours And Company | Multi-layer article for flexible printed circuits |
| US8258346B2 (en) | 2009-05-13 | 2012-09-04 | E I Du Pont De Nemours And Company | Surface modified hexagonal boron nitride particles |
| US8784980B2 (en) * | 2009-05-13 | 2014-07-22 | E I Du Pont De Nemours And Company | Film prepared from a casting composition comprising a polymer and surface modified hexagonal boron nitride particles |
| KR20140102217A (ko) | 2011-12-16 | 2014-08-21 | 티코나 엘엘씨 | 폴리아릴렌 설파이드 조성물용 핵 형성 시스템 |
| US8852487B2 (en) | 2011-12-16 | 2014-10-07 | Ticona Llc | Injection molding of polyarylene sulfide compositions |
| EP2791228B1 (en) | 2011-12-16 | 2018-04-25 | Ticona LLC | Boron-containing nucleating agent for polyphenylene sulfide |
| WO2013090172A1 (en) | 2011-12-16 | 2013-06-20 | Ticona Llc | Method for low temperature injection molding of polyarylene sulfide compositions and injection molded part obtained thereby |
| AU2014287532A1 (en) * | 2013-07-10 | 2016-02-04 | Boron Nitride Power, Llc | Functionalized boron nitride materials as electroactive species in electrochemical energy storage devices |
| US9745499B2 (en) * | 2013-09-06 | 2017-08-29 | Korea Advanced Institute Of Science And Technology | Hexagonal boron nitride nanosheet/ceramic nanocomposite powder and producing method of the same, and hexagonal boron nitride nanosheet/ceramic nanocomposite materials and producing method of the same |
| US9583358B2 (en) | 2014-05-30 | 2017-02-28 | Samsung Electronics Co., Ltd. | Hardmask composition and method of forming pattern by using the hardmask composition |
| KR102287343B1 (ko) | 2014-07-04 | 2021-08-06 | 삼성전자주식회사 | 하드마스크 조성물 및 이를 이용한 패턴의 형성방법 |
| KR102287344B1 (ko) | 2014-07-25 | 2021-08-06 | 삼성전자주식회사 | 하드마스크 조성물 및 이를 이용한 패턴의 형성방법 |
| KR102235501B1 (ko) * | 2014-09-12 | 2021-04-05 | 엘지이노텍 주식회사 | 무기충전재 및 이를 포함하는 에폭시 수지 조성물 |
| KR102384226B1 (ko) | 2015-03-24 | 2022-04-07 | 삼성전자주식회사 | 하드마스크 조성물 및 이를 이용한 패턴 형성방법 |
| KR102463893B1 (ko) | 2015-04-03 | 2022-11-04 | 삼성전자주식회사 | 하드마스크 조성물 및 이를 이용한 패턴의 형성방법 |
| TWI708805B (zh) * | 2015-12-30 | 2020-11-01 | 美商聖高拜陶器塑膠公司 | 改質氮化物顆粒、寡聚物官能化氮化物顆粒、基於聚合物之複合材料及其形成方法 |
| JP6632636B2 (ja) * | 2016-01-26 | 2020-01-22 | 富士フイルム株式会社 | 表面修飾無機物およびその製造方法、樹脂組成物、熱伝導材料、ならびにデバイス |
| WO2017158919A1 (ja) * | 2016-03-14 | 2017-09-21 | ナミックス株式会社 | 窒化ホウ素フィラ―、樹脂組成物、フィルム、窒化ホウ素フィラ―の製造方法 |
| CN109135267B (zh) * | 2017-06-15 | 2021-04-27 | 中国科学院化学研究所 | 一种表面胺基化的氮化硼/尼龙复合材料及其制备方法和用途 |
| US11034847B2 (en) | 2017-07-14 | 2021-06-15 | Samsung Electronics Co., Ltd. | Hardmask composition, method of forming pattern using hardmask composition, and hardmask formed from hardmask composition |
| KR102293461B1 (ko) * | 2017-07-14 | 2021-08-25 | 후지필름 가부시키가이샤 | 표면 수식 무기 질화물, 조성물, 열전도 재료, 열전도층 부착 디바이스 |
| KR102433666B1 (ko) | 2017-07-27 | 2022-08-18 | 삼성전자주식회사 | 하드마스크 조성물, 이를 이용한 패턴의 형성방법 및 상기 하드마스크 조성물을 이용하여 형성된 하드마스크 |
| KR102486388B1 (ko) | 2017-07-28 | 2023-01-09 | 삼성전자주식회사 | 그래핀 양자점의 제조방법, 상기 제조방법에 따라 얻어진 그래핀 양자점을 포함한 하드마스크 조성물, 이를 이용한 패턴의 형성방법 및 상기 하드마스크 조성물을 이용하여 형성된 하드마스크 |
| CN109401360B (zh) * | 2017-08-18 | 2020-08-21 | 中国科学院化学研究所 | 一种对高温结构陶瓷材料进行表面改性的方法 |
| CN107827770A (zh) * | 2017-11-14 | 2018-03-23 | 西北工业大学 | 一种脂肪链接枝的六方氮化硼纳米复合材料及其制备方法 |
| EP3916773A4 (en) | 2019-01-23 | 2022-03-23 | FUJIFILM Corporation | COMPOSITION, THERMOCONDUCTIVE SHEET AND DEVICE EQUIPPED WITH A THERMOCONDUCTIVE LAYER |
| WO2020158259A1 (ja) | 2019-02-01 | 2020-08-06 | 富士フイルム株式会社 | 熱伝導材料形成用組成物、熱伝導材料 |
| KR102122019B1 (ko) | 2019-04-26 | 2020-06-11 | 서울대학교산학협력단 | 질화붕소를 포함하는 폴리올레핀 나노복합재료 및 그 제조방법 |
| KR102291752B1 (ko) * | 2020-12-18 | 2021-08-24 | 한국기초과학지원연구원 | 산기 치환 표면 개질 질화붕소, 이의 제조방법 및 이를 함유한 방열성 조성물 |
| CN116694106A (zh) * | 2023-06-07 | 2023-09-05 | 安徽建筑大学 | 一种功能化氮化硼及基于其的阻燃导热硅橡胶 |
Family Cites Families (40)
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| DE2555515C2 (de) | 1975-12-10 | 1990-04-19 | Hoechst Ag, 6230 Frankfurt | Verfahren zur Herstellung von einheitlichen 4-Aminobenzoldiazoniumsalzen |
| US4670325A (en) | 1983-04-29 | 1987-06-02 | Ibm Corporation | Structure containing a layer consisting of a polyimide and an organic filled and method for producing such a structure |
| DE69115171T2 (de) | 1990-08-27 | 1996-05-15 | Du Pont | Flexible Polyimid-Mehrschichtlaminate und ihre Herstellung. |
| JPH07215705A (ja) | 1994-02-07 | 1995-08-15 | Shin Etsu Chem Co Ltd | シリコーンゴム添加用窒化ほう素粉末およびシリコーンゴム製品 |
| US5554739A (en) * | 1994-12-15 | 1996-09-10 | Cabot Corporation | Process for preparing carbon materials with diazonium salts and resultant carbon products |
| JP3794507B2 (ja) * | 1995-06-28 | 2006-07-05 | 信越化学工業株式会社 | 高撥水・撥油性bn粉末 |
| JP2732822B2 (ja) | 1995-12-28 | 1998-03-30 | デュポン帝人アドバンスドペーパー株式会社 | 複合体シートおよびその製造方法 |
| US5681883A (en) | 1996-03-05 | 1997-10-28 | Advanced Ceramics Corporation | Enhanced boron nitride composition and polymer based high thermal conductivity molding compound |
| CA2292369A1 (en) * | 1998-10-01 | 2001-06-16 | Edison Polymer Innovation Corporation | Surface treated boron nitride for forming a low viscosity high thermal conductivity polymer based boron nitride composition and method |
| US6160042A (en) | 1997-05-01 | 2000-12-12 | Edison Polymer Innovation Corporation | Surface treated boron nitride for forming a low viscosity high thermal conductivity polymer based boron nitride composition and method |
| JP3948642B2 (ja) | 1998-08-21 | 2007-07-25 | 信越化学工業株式会社 | 熱伝導性グリース組成物及びそれを使用した半導体装置 |
| US20030148024A1 (en) | 2001-10-05 | 2003-08-07 | Kodas Toivo T. | Low viscosity precursor compositons and methods for the depositon of conductive electronic features |
| US6162849A (en) | 1999-01-11 | 2000-12-19 | Ferro Corporation | Thermally conductive thermoplastic |
| JP4070345B2 (ja) * | 1999-02-15 | 2008-04-02 | 信越化学工業株式会社 | 熱伝導性窒化ほう素微粉末、該微粉末を含有する熱伝導性シリコーン組成物、及び絶縁放熱シート |
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| US7445797B2 (en) | 2005-03-14 | 2008-11-04 | Momentive Performance Materials Inc. | Enhanced boron nitride composition and polymer-based compositions made therewith |
| US20070241303A1 (en) | 1999-08-31 | 2007-10-18 | General Electric Company | Thermally conductive composition and method for preparing the same |
| US7976941B2 (en) | 1999-08-31 | 2011-07-12 | Momentive Performance Materials Inc. | Boron nitride particles of spherical geometry and process for making thereof |
| JP2001192500A (ja) * | 2000-01-12 | 2001-07-17 | Edison Polymer Innovation Corp | 低粘度高熱伝導性ポリマー系窒化ホウ素組成物形成用表面処理窒化ホウ素及び該組成物の形成方法 |
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| US7470990B2 (en) | 2004-03-31 | 2008-12-30 | Endicott Interconnect Technologies, Inc. | Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same |
| US20060127686A1 (en) | 2004-12-15 | 2006-06-15 | Meloni Paul A | Thermally conductive polyimide film composites having high thermal conductivity useful in an electronic device |
| US7524560B2 (en) | 2005-08-19 | 2009-04-28 | Momentive Performance Materials Inc. | Enhanced boron nitride composition and compositions made therewith |
| US20070205706A1 (en) | 2006-03-01 | 2007-09-06 | General Electric Company | Optical Substrate Comprising Boron Nitride Particles |
| US7829188B2 (en) | 2006-04-03 | 2010-11-09 | E.I. Du Pont De Nemours And Company | Filled epoxy compositions |
| US7658988B2 (en) | 2006-04-03 | 2010-02-09 | E. I. Du Pont De Nemours And Company | Printed circuits prepared from filled epoxy compositions |
| US20070259211A1 (en) | 2006-05-06 | 2007-11-08 | Ning Wang | Heat spread sheet with anisotropic thermal conductivity |
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| ATE503802T1 (de) | 2006-10-11 | 2011-04-15 | Sumitomo Electric Industries | Polyimidrohr, herstellungsverfahren dafür, verfahren zur herstellung eines polyimidlacks und fixierband |
| US20100051879A1 (en) | 2006-11-22 | 2010-03-04 | The Regents od the Univesity of California | Functionalized Boron Nitride Nanotubes |
| JP4858470B2 (ja) * | 2008-03-14 | 2012-01-18 | 新神戸電機株式会社 | 無機窒化物粒子およびこれを混合した樹脂組成物 |
| US20090305043A1 (en) | 2008-06-06 | 2009-12-10 | E. I. Du Point De Nemours And Company | Boron nitride encapsulated in turbostratic carbon and process for making same |
| WO2009149445A1 (en) | 2008-06-06 | 2009-12-10 | E. I. Du Pont De Nemours And Company | Polymers containing hexagonal boron nitride particles coated with turbostratic carbon and process for preparing same |
| US8277936B2 (en) | 2008-12-22 | 2012-10-02 | E I Du Pont De Nemours And Company | Hexagonal boron nitride compositions characterized by interstitial ferromagnetic layers, process for preparing, and composites thereof with organic polymers |
| US8258346B2 (en) | 2009-05-13 | 2012-09-04 | E I Du Pont De Nemours And Company | Surface modified hexagonal boron nitride particles |
| US8288466B2 (en) * | 2009-05-13 | 2012-10-16 | E I Du Pont De Nemours And Company | Composite of a polymer and surface modified hexagonal boron nitride particles |
| US8440292B2 (en) * | 2009-05-13 | 2013-05-14 | E I Du Pont De Nemours And Company | Multi-layer article for flexible printed circuits |
| US8784980B2 (en) * | 2009-05-13 | 2014-07-22 | E I Du Pont De Nemours And Company | Film prepared from a casting composition comprising a polymer and surface modified hexagonal boron nitride particles |
-
2009
- 2009-05-13 US US12/465,042 patent/US8258346B2/en not_active Expired - Fee Related
-
2010
- 2010-05-12 KR KR1020117029685A patent/KR20120024756A/ko not_active Withdrawn
- 2010-05-12 WO PCT/US2010/034462 patent/WO2010132512A2/en not_active Ceased
- 2010-05-12 JP JP2012510961A patent/JP5619149B2/ja not_active Expired - Fee Related
- 2010-05-12 EP EP10775444.2A patent/EP2429943A4/en not_active Withdrawn
- 2010-05-12 CN CN201080020672.9A patent/CN102421701B/zh not_active Expired - Fee Related
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