JP2010186846A - 圧縮機用電子回路装置 - Google Patents
圧縮機用電子回路装置 Download PDFInfo
- Publication number
- JP2010186846A JP2010186846A JP2009029441A JP2009029441A JP2010186846A JP 2010186846 A JP2010186846 A JP 2010186846A JP 2009029441 A JP2009029441 A JP 2009029441A JP 2009029441 A JP2009029441 A JP 2009029441A JP 2010186846 A JP2010186846 A JP 2010186846A
- Authority
- JP
- Japan
- Prior art keywords
- storage box
- aluminum plate
- insulating sheet
- printed circuit
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 64
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 64
- 241001247986 Calotropis procera Species 0.000 claims abstract description 26
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 238000009792 diffusion process Methods 0.000 claims description 6
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 abstract description 28
- 230000020169 heat generation Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 6
- WYFCZWSWFGJODV-MIANJLSGSA-N 4-[[(1s)-2-[(e)-3-[3-chloro-2-fluoro-6-(tetrazol-1-yl)phenyl]prop-2-enoyl]-5-(4-methyl-2-oxopiperazin-1-yl)-3,4-dihydro-1h-isoquinoline-1-carbonyl]amino]benzoic acid Chemical compound O=C1CN(C)CCN1C1=CC=CC2=C1CCN(C(=O)\C=C\C=1C(=CC=C(Cl)C=1F)N1N=NN=C1)[C@@H]2C(=O)NC1=CC=C(C(O)=O)C=C1 WYFCZWSWFGJODV-MIANJLSGSA-N 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- LVDRREOUMKACNJ-BKMJKUGQSA-N N-[(2R,3S)-2-(4-chlorophenyl)-1-(1,4-dimethyl-2-oxoquinolin-7-yl)-6-oxopiperidin-3-yl]-2-methylpropane-1-sulfonamide Chemical compound CC(C)CS(=O)(=O)N[C@H]1CCC(=O)N([C@@H]1c1ccc(Cl)cc1)c1ccc2c(C)cc(=O)n(C)c2c1 LVDRREOUMKACNJ-BKMJKUGQSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
- H05K7/142—Spacers not being card guides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Compressor (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
【解決手段】半導体素子29の放熱を行うヒートシンク25と収納ボックス1の外郭であるアルミ板37とを絶縁シート49を介して熱接触させるとともに、収納ボックス1に設けた突出部にゴムブッシュ24を取り付け、圧縮されたゴムブッシュ24によってヒートシンク25がアルミ板37に圧接触するようにしたもので、半導体素子29の発熱を収納ボックス1の外部へ放熱することができ、信頼性を向上させ、組み立て作業性も向上することができる。
【選択図】図1
Description
図1は、本発明の実施の形態1における圧縮機用電子回路装置の分解斜視図、図2は、同実施の形態における圧縮機用電子回路装置の斜視断面図、図3は同実施の形態におけるゴムブッシュの斜視図、図4は図3におけるA−A線での断面図、図5は同実施の形態におけるアルミ板の正面図、図6は図5におけるB−B線での断面図、図7はプリント基板の収納ボックス挿入時の組み立て図である。
1a 突出部
5 プリント基板
5c 基板取り付け穴
24 ゴムブッシュ
25 ヒートシンク
29 半導体素子(電子部品)
37 アルミ板
37a 突起部
49 絶縁シート
55 熱拡散コンパウンド
60 接着剤
Claims (5)
- プリント基板と、前記プリント基板に実装された電子部品と、前記プリント基板に実装され、前記電子部品の発熱が伝導するヒートシンクと、前記プリント基板を収納し、少なくとも一方の面に開口部を備える収納ボックスと、前記収納ボックスの底部に配設され前記プリント基板を反開口部側から支持するゴムブッシュと、前記収納ボックスの開口部を閉口するように取り付けられたアルミ板と、前記ヒートシンクと前記アルミ板の間に挟まれて密着固定された絶縁シートとを備え、前記ヒートシンクの熱は前記絶縁シートを介して前記アルミ板に伝導するように形成された圧縮機用電子回路装置。
- ゴムブッシュは空洞部を備えた筒状の形状とし、プリント基板に基板取付け穴を設け、収納ボックスの底部に開口部に向かって突出した突出部を設け、前記ゴムブッシュの前記空洞部と前記プリント基板の前記基板取り付け穴に前記収納ボックスの突出部を同時に挿入することで、前記ゴムブッシュと前記プリント基板を前記収納ボックス内の所定の位置に配置するように形成した請求項1に記載の圧縮機用電子回路装置。
- アルミ板の収納ボックス側の内側面に複数の突起部を設け、前記突起部で囲われた範囲内に絶縁シートを配設することで、前記絶縁シートを前記アルミ板内の所定の位置に配置するように形成した請求項1または2に記載の圧縮機用電子回路装置。
- 絶縁シートとヒートシンクの間に熱伝導性の高い接着剤を塗布した請求項1から3のいずれか一項に記載の圧縮機用電子回路装置。
- 絶縁シートとアルミ板の間に熱拡散コンパウンドを塗布した請求項1から4の圧縮機用電子回路装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009029441A JP5223712B2 (ja) | 2009-02-12 | 2009-02-12 | 圧縮機用電子回路装置 |
EP10000989A EP2219428A3 (en) | 2009-02-12 | 2010-02-01 | Electronic circuit device for compressor |
US12/699,443 US8207456B2 (en) | 2009-02-12 | 2010-02-03 | Electronic circuit device for compressor |
CN201010117412A CN101808492A (zh) | 2009-02-12 | 2010-02-12 | 压缩机用电子电路装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009029441A JP5223712B2 (ja) | 2009-02-12 | 2009-02-12 | 圧縮機用電子回路装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013051326A Division JP5476614B2 (ja) | 2013-03-14 | 2013-03-14 | 圧縮機用電子回路装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010186846A true JP2010186846A (ja) | 2010-08-26 |
JP5223712B2 JP5223712B2 (ja) | 2013-06-26 |
Family
ID=42231424
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009029441A Active JP5223712B2 (ja) | 2009-02-12 | 2009-02-12 | 圧縮機用電子回路装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8207456B2 (ja) |
EP (1) | EP2219428A3 (ja) |
JP (1) | JP5223712B2 (ja) |
CN (1) | CN101808492A (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012104527A (ja) * | 2010-11-08 | 2012-05-31 | Panasonic Corp | 電子回路装置 |
JP2015124740A (ja) * | 2013-12-27 | 2015-07-06 | パナソニックIpマネジメント株式会社 | 圧縮機用電子回路装置 |
KR20180071319A (ko) * | 2015-11-17 | 2018-06-27 | 노스롭 그루먼 시스템즈 코포레이션 | 회로 카드 랙 시스템 및 방법 |
US10438867B2 (en) | 2018-03-08 | 2019-10-08 | Northrop Grumman Systems Corporation | Immersion cooling temperature control method, system, and apparatus |
US10575437B1 (en) | 2019-03-20 | 2020-02-25 | Northrop Grumman Systems Corporation | Temperature control method, system, and apparatus |
US10595441B1 (en) | 2019-04-03 | 2020-03-17 | Northrop Grumman Systems Corporation | Method and apparatus for separating a thermal load path from a structural load path in a circuit board environment |
US10645845B2 (en) | 2018-04-12 | 2020-05-05 | Northrop Grumman Systems Corporation | Forced flow cooling temperature control method, system, and apparatus |
US10782258B2 (en) | 2018-09-04 | 2020-09-22 | Northrop Grumman Systems Corporation | Superconductor critical temperature measurement |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5546889B2 (ja) * | 2010-02-09 | 2014-07-09 | 日本電産エレシス株式会社 | 電子部品ユニット及びその製造方法 |
JP6035952B2 (ja) * | 2012-07-27 | 2016-11-30 | Tdk株式会社 | 電源装置 |
JP6084523B2 (ja) * | 2013-06-25 | 2017-02-22 | 株式会社マキタ | 充電器 |
JP6086407B2 (ja) * | 2013-10-02 | 2017-03-01 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
DE102016107289A1 (de) * | 2016-04-20 | 2017-10-26 | Systematec Gmbh | Ansteueranordnung, Befestigungsanordnung und Kompressorvorrichtung |
PL3803119T3 (pl) * | 2018-06-08 | 2023-09-04 | Arçelik Anonim Sirketi | Sposób montowania karty sterującej |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS60171751A (ja) * | 1984-02-16 | 1985-09-05 | Fujitsu Ltd | Icの放熱構造 |
JP2000059041A (ja) * | 1998-08-06 | 2000-02-25 | Meiji Natl Ind Co Ltd | 電気部品収納ケース |
JP2000349233A (ja) * | 1999-06-03 | 2000-12-15 | Tokyo R & D Co Ltd | パワー半導体素子の給電及び放熱装置 |
JP2007234649A (ja) * | 2006-02-27 | 2007-09-13 | Toshiba Corp | プリント配線板構造体および電子機器 |
WO2008032811A1 (en) * | 2006-09-13 | 2008-03-20 | Panasonic Corporation | Electronic circuit apparatus for compressor |
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DE2920578A1 (de) * | 1979-05-21 | 1980-12-04 | Siemens Ag | Leiterplattenanordnung |
JP2794965B2 (ja) | 1991-02-28 | 1998-09-10 | 三菱電機株式会社 | 制御装置のベースユニット |
JPH11317570A (ja) | 1998-05-06 | 1999-11-16 | Seiko Epson Corp | 電子機器 |
US6374912B1 (en) * | 1998-12-30 | 2002-04-23 | Lucent Technologies | Deep drawn enclosure with integrated heatsink and fastening details |
US6903270B1 (en) * | 2000-08-11 | 2005-06-07 | Skyworks Solutions, Inc. | Method and structure for securing a mold compound to a printed circuit board |
US6549409B1 (en) * | 2000-08-21 | 2003-04-15 | Vlt Corporation | Power converter assembly |
DE10129788B4 (de) * | 2001-06-20 | 2005-11-10 | Siemens Ag | Kunststoffrahmen zur Montage eines elektronischen Starkstrom-Steuergeräts |
US6778388B1 (en) * | 2001-07-23 | 2004-08-17 | Garmin Ltd. | Water-resistant electronic enclosure having a heat sink |
US6680849B2 (en) * | 2002-03-29 | 2004-01-20 | Nortel Networks Corporation | Extruded heatsink and EMC enclosure |
JP4440016B2 (ja) | 2004-07-08 | 2010-03-24 | パナソニック株式会社 | 電子回路装置 |
JP4196904B2 (ja) | 2004-08-26 | 2008-12-17 | 株式会社デンソー | 電子制御装置 |
JP2006140192A (ja) | 2004-11-10 | 2006-06-01 | Matsushita Electric Ind Co Ltd | 電子回路装置 |
DE102005001148B3 (de) * | 2005-01-10 | 2006-05-18 | Siemens Ag | Elektronikeinheit mit EMV-Schirmung |
TWI253154B (en) * | 2005-05-06 | 2006-04-11 | Neobulb Technologies Inc | Integrated circuit packaging and method of making the same |
US20070041160A1 (en) * | 2005-08-19 | 2007-02-22 | Kehret William E | Thermal management for a ruggedized electronics enclosure |
DE102006013017B4 (de) * | 2006-03-20 | 2014-11-06 | R. Stahl Schaltgeräte GmbH | Gehäuse mit Wärmebrücke |
US7750252B2 (en) * | 2006-03-29 | 2010-07-06 | American Power Conversion Corporation | Apparatus and method for limiting noise and smoke emissions due to failure of electronic devices or assemblies |
CN2925020Y (zh) * | 2006-06-26 | 2007-07-18 | 杜建军 | 多接口密封装置与感压平衡装置的水冷散热器 |
JP2008085112A (ja) | 2006-09-28 | 2008-04-10 | Matsushita Electric Ind Co Ltd | 電子回路装置 |
US7764500B2 (en) * | 2007-08-31 | 2010-07-27 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Electronic system with a heat sink assembly |
US7760507B2 (en) * | 2007-12-26 | 2010-07-20 | The Bergquist Company | Thermally and electrically conductive interconnect structures |
US7864534B2 (en) * | 2008-06-11 | 2011-01-04 | Adc Telecommunications, Inc. | Apparatus for mounting a module and enabling heat conduction from the module to the mounting surface |
-
2009
- 2009-02-12 JP JP2009029441A patent/JP5223712B2/ja active Active
-
2010
- 2010-02-01 EP EP10000989A patent/EP2219428A3/en not_active Withdrawn
- 2010-02-03 US US12/699,443 patent/US8207456B2/en active Active
- 2010-02-12 CN CN201010117412A patent/CN101808492A/zh active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS60171751A (ja) * | 1984-02-16 | 1985-09-05 | Fujitsu Ltd | Icの放熱構造 |
JP2000059041A (ja) * | 1998-08-06 | 2000-02-25 | Meiji Natl Ind Co Ltd | 電気部品収納ケース |
JP2000349233A (ja) * | 1999-06-03 | 2000-12-15 | Tokyo R & D Co Ltd | パワー半導体素子の給電及び放熱装置 |
JP2007234649A (ja) * | 2006-02-27 | 2007-09-13 | Toshiba Corp | プリント配線板構造体および電子機器 |
WO2008032811A1 (en) * | 2006-09-13 | 2008-03-20 | Panasonic Corporation | Electronic circuit apparatus for compressor |
JP2009510713A (ja) * | 2006-09-13 | 2009-03-12 | パナソニック株式会社 | 圧縮機用電子回路装置 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012104527A (ja) * | 2010-11-08 | 2012-05-31 | Panasonic Corp | 電子回路装置 |
JP2015124740A (ja) * | 2013-12-27 | 2015-07-06 | パナソニックIpマネジメント株式会社 | 圧縮機用電子回路装置 |
KR20180071319A (ko) * | 2015-11-17 | 2018-06-27 | 노스롭 그루먼 시스템즈 코포레이션 | 회로 카드 랙 시스템 및 방법 |
KR102066867B1 (ko) * | 2015-11-17 | 2020-02-11 | 노스롭 그루먼 시스템즈 코포레이션 | 회로 카드 랙 시스템 및 방법 |
US10438867B2 (en) | 2018-03-08 | 2019-10-08 | Northrop Grumman Systems Corporation | Immersion cooling temperature control method, system, and apparatus |
US10645845B2 (en) | 2018-04-12 | 2020-05-05 | Northrop Grumman Systems Corporation | Forced flow cooling temperature control method, system, and apparatus |
US10782258B2 (en) | 2018-09-04 | 2020-09-22 | Northrop Grumman Systems Corporation | Superconductor critical temperature measurement |
US10575437B1 (en) | 2019-03-20 | 2020-02-25 | Northrop Grumman Systems Corporation | Temperature control method, system, and apparatus |
US10595441B1 (en) | 2019-04-03 | 2020-03-17 | Northrop Grumman Systems Corporation | Method and apparatus for separating a thermal load path from a structural load path in a circuit board environment |
Also Published As
Publication number | Publication date |
---|---|
EP2219428A2 (en) | 2010-08-18 |
JP5223712B2 (ja) | 2013-06-26 |
EP2219428A3 (en) | 2010-11-17 |
CN101808492A (zh) | 2010-08-18 |
US8207456B2 (en) | 2012-06-26 |
US20100200290A1 (en) | 2010-08-12 |
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