JP2010171221A5 - - Google Patents

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Publication number
JP2010171221A5
JP2010171221A5 JP2009012610A JP2009012610A JP2010171221A5 JP 2010171221 A5 JP2010171221 A5 JP 2010171221A5 JP 2009012610 A JP2009012610 A JP 2009012610A JP 2009012610 A JP2009012610 A JP 2009012610A JP 2010171221 A5 JP2010171221 A5 JP 2010171221A5
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JP
Japan
Prior art keywords
semiconductor
semiconductor substrate
semiconductor region
region
substrate
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Application number
JP2009012610A
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English (en)
Japanese (ja)
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JP2010171221A (ja
JP5484741B2 (ja
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Priority to JP2009012610A priority Critical patent/JP5484741B2/ja
Priority claimed from JP2009012610A external-priority patent/JP5484741B2/ja
Priority to CN2010100040231A priority patent/CN101794816B/zh
Priority to US12/692,527 priority patent/US8159023B2/en
Publication of JP2010171221A publication Critical patent/JP2010171221A/ja
Publication of JP2010171221A5 publication Critical patent/JP2010171221A5/ja
Application granted granted Critical
Publication of JP5484741B2 publication Critical patent/JP5484741B2/ja
Active legal-status Critical Current
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JP2009012610A 2009-01-23 2009-01-23 半導体装置 Active JP5484741B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009012610A JP5484741B2 (ja) 2009-01-23 2009-01-23 半導体装置
CN2010100040231A CN101794816B (zh) 2009-01-23 2010-01-14 半导体器件
US12/692,527 US8159023B2 (en) 2009-01-23 2010-01-22 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009012610A JP5484741B2 (ja) 2009-01-23 2009-01-23 半導体装置

Publications (3)

Publication Number Publication Date
JP2010171221A JP2010171221A (ja) 2010-08-05
JP2010171221A5 true JP2010171221A5 (https=) 2013-03-28
JP5484741B2 JP5484741B2 (ja) 2014-05-07

Family

ID=42353476

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009012610A Active JP5484741B2 (ja) 2009-01-23 2009-01-23 半導体装置

Country Status (3)

Country Link
US (1) US8159023B2 (https=)
JP (1) JP5484741B2 (https=)
CN (1) CN101794816B (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5739813B2 (ja) * 2009-09-15 2015-06-24 株式会社東芝 半導体装置
JP2011204796A (ja) * 2010-03-24 2011-10-13 Toshiba Corp 半導体装置およびその製造方法
KR101216897B1 (ko) 2011-08-09 2012-12-28 주식회사 케이이씨 고전압 반도체 소자
KR101279222B1 (ko) 2011-08-26 2013-06-26 주식회사 케이이씨 고전압 반도체 소자
US9287371B2 (en) 2012-10-05 2016-03-15 Semiconductor Components Industries, Llc Semiconductor device having localized charge balance structure and method
US9219138B2 (en) 2012-10-05 2015-12-22 Semiconductor Components Industries, Llc Semiconductor device having localized charge balance structure and method
US10256325B2 (en) * 2012-11-08 2019-04-09 Infineon Technologies Austria Ag Radiation-hardened power semiconductor devices and methods of forming them
CN103199104B (zh) * 2013-03-05 2016-04-27 矽力杰半导体技术(杭州)有限公司 一种晶圆结构以及应用其的功率器件
SE1550821A1 (sv) * 2015-06-16 2016-11-22 Ascatron Ab SiC SUPER-JUNCTIONS
US9768247B1 (en) 2016-05-06 2017-09-19 Semiconductor Components Industries, Llc Semiconductor device having improved superjunction trench structure and method of manufacture
JP6254301B1 (ja) * 2016-09-02 2017-12-27 新電元工業株式会社 Ｍｏｓｆｅｔ及び電力変換回路
US10700191B2 (en) 2016-09-16 2020-06-30 Shindengen Electric Manufacturing Co., Ltd. MOSFET and power conversion circuit
WO2018087896A1 (ja) * 2016-11-11 2018-05-17 新電元工業株式会社 Ｍｏｓｆｅｔ及び電力変換回路
WO2018216222A1 (ja) * 2017-05-26 2018-11-29 新電元工業株式会社 Ｍｏｓｆｅｔ及び電力変換回路
JP2019054169A (ja) * 2017-09-15 2019-04-04 株式会社東芝 半導体装置
US11005354B2 (en) * 2017-11-17 2021-05-11 Shindengen Electric Manufacturing Co., Ltd. Power conversion circuit
CN110416285B (zh) * 2019-07-31 2024-06-07 电子科技大学 一种超结功率dmos器件
JP7807731B2 (ja) * 2022-03-22 2026-01-28 国立研究開発法人産業技術総合研究所 炭化珪素半導体装置および炭化珪素半導体装置の製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69838453D1 (de) * 1998-12-09 2007-10-31 St Microelectronics Srl Leistungsbauelement mit MOS-Gate für hohe Spannungen und diesbezügliches Herstellungsverfahren
EP1011146B1 (en) * 1998-12-09 2006-03-08 STMicroelectronics S.r.l. Method of manufacturing an integrated edge structure for high voltage semiconductor devices
JP3743395B2 (ja) 2002-06-03 2006-02-08 株式会社デンソー 半導体装置の製造方法及び半導体装置
JP4304433B2 (ja) * 2002-06-14 2009-07-29 富士電機デバイステクノロジー株式会社 半導体素子
JP3634830B2 (ja) * 2002-09-25 2005-03-30 株式会社東芝 電力用半導体素子
JP4904673B2 (ja) * 2004-02-09 2012-03-28 富士電機株式会社 半導体装置および半導体装置の製造方法
JP4851738B2 (ja) 2005-06-29 2012-01-11 新電元工業株式会社 半導体装置
WO2007122646A1 (en) 2006-04-21 2007-11-01 Stmicroelectronics S.R.L. Process for manufacturing a power semiconductor device and corresponding power semiconductor device
EP1873837B1 (en) * 2006-06-28 2013-03-27 STMicroelectronics Srl Semiconductor power device having an edge-termination structure and manufacturing method thereof
JP2008153620A (ja) * 2006-11-21 2008-07-03 Toshiba Corp 半導体装置
JP2008210899A (ja) * 2007-02-23 2008-09-11 Toshiba Corp 半導体装置及びその製造方法
JP4564509B2 (ja) * 2007-04-05 2010-10-20 株式会社東芝 電力用半導体素子
JP2008294028A (ja) * 2007-05-22 2008-12-04 Toshiba Corp 半導体装置

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