JP2010153799A - 冷却機構を含む接合型半導体構造体とその形成方法 - Google Patents
冷却機構を含む接合型半導体構造体とその形成方法 Download PDFInfo
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Abstract
【解決手段】 2つの半導体基板を備える接合型基板が提供される。各々の半導体基板は、半導体デバイスを含む。少なくとも1つの基板貫通ビアが2つの半導体基板の間に設けられ、それらの間に単一の経路を提供する。2つの半導体基板の底側は、冷却機構を含む少なくとも1つの接合材料層によって接合される。1つの実施形態において、冷却機構は冷却チャネルであり、その中を通って冷却流体が流動し、接合型基板内の半導体デバイスの動作中に接合型半導体基板を冷却する。別の実施形態において、冷却機構は、2つの端部とそれらの間の連続した経路を備えた導電性冷却フィンである。冷却フィンはヒートシンクに接続され、接合型基板内の半導体デバイスの動作中に接合型半導体基板を冷却する。
【選択図】 図1
Description
少なくとも1つの第1の半導体デバイスを含む第1の半導体基板と、
少なくとも1つの第2の半導体デバイスを含み、第1の半導体基板の下にある第2の半導体基板と、
第1の半導体基板と第2の半導体基板との間に配置され、第1の横方向開口部及び第2の横方向開口部を有する連続キャビティを含む誘電体材料層であって、この誘電体材料層を通じて第1の半導体基板及び第2の半導体基板が接合される、誘電体材料層と
を備える。
少なくとも1つの第1の半導体デバイスを含む第1の半導体基板と、
少なくとも1つの第2の半導体デバイスを含み、第1の半導体基板の下にある第2の半導体基板と、
第1の半導体基板と第2の半導体基板との間に配置される誘電体材料層であって、この誘電体材料層を通して第1の半導体基板及び第2の半導体基板が接合される誘電体材料層と、
第1の端部及び第2の端部とそれらの間の埋め込み部とを有し、埋め込み部が誘電体材料層内に埋め込まれる導電性フィンと
を備える。
少なくとも1つの第1の半導体デバイスを含む第1の半導体基板を表す第1のデータと、
少なくとも1つの第2の半導体デバイスを含み、第1の半導体基板の下にある第2の半導体基板を表す第2のデータと、
第1の半導体基板と第2の半導体基板との間に配置される誘電体材料層であって、この誘電体材料層を通して第1の半導体基板及び第2の半導体基板が接合される誘電体材料層を表す第3のデータと、
誘電体材料層内に埋め込まれ、第1の横方向開口部及び第2の横方向開口部を有する連続キャビティを表す第4のデータと、
少なくとも1つの第1の半導体デバイスの上から少なくとも1つの第2の半導体デバイスのうちの1つまで延びる基板貫通ビアを表す第5のデータと、
キャビティを満たす冷却流体を表す任意の第6のデータと、
第1の横方向開口部に取り付けられる注入チューブを表す任意の第7のデータと、
第2の横方向開口部に取り付けられた排出チューブを表す任意の第8データと
を含む。
少なくとも1つの第1の半導体デバイスを含む第1の半導体基板を表す第1のデータと、
少なくとも1つの第2の半導体デバイスを含み、第1の半導体基板の下にある第2の半導体基板を表す第2のデータと、
第1の半導体基板と第2の半導体基板との間に配置される誘電体層であって、この誘電体層を通して第1の半導体基板及び第2の半導体基板が接合される誘電体材料層を表す第3のデータと、
第1の端部及び第2の端部とそれらの間の埋め込み部とを有し、埋め込み部が誘電体材料層内に埋め込まれる導電性フィンを表す第4のデータと、
少なくとも1つの第1の半導体デバイスの上から少なくとも1つの第2の半導体デバイスのうちの1つまで延びる基板貫通ビアを表す第5のデータと
を含む。
少なくとも1つの第1の半導体デバイスをその上に有する第1の半導体基板を含む第1の構造体を準備するステップと、
少なくとも1つの第2の半導体デバイスをその上に有する第2の半導体基板を含む第2の構造体を準備するステップと、
第1の構造体上に直接、第1の誘電体材料層を形成するステップと、
第2の構造体上に直接、第2の誘電体材料層を形成するステップと、
第2の誘電体材料層をパターン化して、第1の横方向開口部及び第2の横方向開口部を有する連続チャネルを形成するステップと、
第1の誘電体材料層と第2の誘電体材料層とを接合するステップと
を含む。
少なくとも1つの第1の半導体デバイスをその上に有する第1の半導体基板を含む第1の構造体を準備するステップと、
少なくとも1つの第2の半導体デバイスをその上に有する第2の半導体基板を含む第2の構造体を準備するステップと、
第2の構造体上に直接、導電性フィンを形成するステップと、
第2の構造体上に直接、第2の誘電体材料層を形成するステップであって、導電性フィンは、第1の端部及び第2の端部とそれらの間の埋め込み部とを有し、埋め込み部は、第2の誘電体材料層内に埋め込まれるステップと、
第1の構造体上に直接、又は第2の誘電体材料層の上に直接、第1の誘電体材料を形成するステップと、
第1の誘電体材料層と第2の誘電体材料層とを接合するステップと
を含む。
100:連続キャビティ
110、210、310:誘電体層
120、220:絶縁体層
130、230:浅いトレンチ分離構造体
140、240:半導体基板
146:導電性基板貫通ビア
160:基板コンタクトレベル金属相互接続構造体
168、248:金属配線構造体
180、260:金属相互接続構造体
181:上部ハンドル基板
190、290:パッシベーション層
202:導電性構造体
203:導電性配線構造体
296:底部ハンドル基板
Claims (20)
- 少なくとも1つの第1の半導体デバイスを含む第1の半導体基板と、
少なくとも1つの第2の半導体デバイスを含み、前記第1の半導体基板の下にある第2の半導体基板と、
前記第1の半導体基板と前記第2の半導体基板との間に配置され、第1の横方向開口部及び第2の横方向開口部を有する連続キャビティを含む誘電体材料層であって、前記誘電体材料層を通して前記第1の半導体基板と前記第2の半導体基板が接合される誘電体材料層と
を備える、半導体構造体。 - 前記少なくとも1つの第1の半導体デバイスの上から前記少なくとも1つの第2の半導体デバイスのうちの1つまで延びる基板貫通ビアをさらに備える、請求項1に記載の半導体構造体。
- 前記誘電体材料層によって横方向を囲まれ、前記少なくとも1つの第2の半導体デバイスのうちの1つまで延びる導電性構造体と、
前記少なくとも1つの第1の半導体デバイスの上から前記導電性構造体まで延びる基板貫通ビアと
をさらに備える、請求項1に記載の半導体構造体。 - 前記誘電体材料層によって横方向を囲まれ、前記少なくとも1つの第2の半導体デバイスのうちの1つと前記少なくとも1つの第2の半導体デバイスのうちのもう1つとの間に抵抗性電気的接続を提供する少なくとも1つの導電性配線構造体をさらに備える、請求項3に記載の半導体構造体。
- 前記連続キャビティは、前記誘電体材料層の水平面と同一平面にある第1の平面及び前記誘電体材料層の水平面と同一平面にある第2の平面によって垂直方向に境界付けられ、前記第1の平面は、前記第1の半導体基板の底面に対して平行であり、前記第2の平面は、前記第2の半導体基板の底面に対して平行である、請求項1に記載の半導体構造体。
- 前記第1の横方向開口部及び前記第2の横方向開口部は、前記誘電体材料層の周縁部に位置し、前記第1及び前記第2の半導体基板の側壁と実質的に垂直方向に一致する、請求項1に記載の半導体構造体。
- 前記第1の半導体基板及び前記第2の半導体基板は、前記誘電体材料層を通して背中合わせに接合され、前記第1の半導体基板は、前記少なくとも1つの第1の半導体デバイスと同じレベル内に第1のトレンチ分離構造体を含み、前記第2の半導体基板は、前記少なくとも1つの第2の半導体デバイスと同じレベル内に第2の浅いトレンチ分離構造体を含み、前記少なくとも1つの第1の半導体デバイスは前記第1の半導体基板の上面の上及び上方に位置し、前記少なくとも1つの第2の半導体デバイスは前記第2の半導体デバイスの上面の上及び下方に位置する、請求項1に記載の半導体構造体。
- 前記連続キャビティ内に位置する冷却流体をさらに備える、請求項1に記載の半導体構造体。
- 前記第1の半導体基板の底面に垂直方向に接する第1の絶縁体層と、
前記第1の絶縁体層の底部に垂直方向に接し、前記誘電体材料層に接合される別の誘電体材料層と、
前記第2の半導体基板の底面に垂直方向に接する第2の絶縁体層であって、前記誘電体材料層が前記第2の絶縁体層の底面に垂直方向に接する、第2の絶縁体層と
をさらに備える、請求項1に記載の半導体構造体。 - 少なくとも1つの半導体デバイスを含む第1の半導体基板と、
少なくとも1つの第2の半導体デバイスを含み、及び前記第1の半導体基板の下にある第2の半導体基板と、
前記第1の半導体基板と前記第2の半導体基板との間に配置される誘電体材料層であって、前記誘電体材料層を通して前記第1の半導体基板と前記第2の半導体基板が接合される誘電体材料層と、
第1の端部及び第2の端部と、それらの間の埋め込み部とを有し、前記埋め込み部が前記誘電体材料層内に埋め込まれる導電性フィンと
を備える、半導体構造体。 - 前記少なくとも1つの第1の半導体デバイスの上から前記少なくとも1つの第2の半導体デバイスのうちの1つまで延びる基板貫通ビアをさらに備える、請求項10に記載の半導体構造体。
- 前記誘電体材料層によって横方向を囲まれ、前記少なくとも1つの第2の半導体デバイスのうちの1つまで延びる導電性構造体と、
前記少なくとも1つの第1の半導体デバイスの上から前記導電性構造体まで延びる基板貫通ビアと
をさらに備える、請求項10に記載の半導体構造体。 - 前記誘電体材料層によって横方向を囲まれ、前記少なくとも1つの第2の半導体デバイスのうちの1つと前記少なくとも1つの第2の半導体デバイスのうちのもう1つとの間に抵抗性電気的接続を提供する少なくとも1つの導電性配線構造体をさらに備える、請求項12に記載の半導体構造体。
- 前記導電性フィンは、前記誘電体材料層の水平面と同一平面にある第1の平面及び前記誘電体材料層の水平面と同一平面にある第2の平面によって垂直方向に境界付けられ、前記第1の平面は、前記第1の半導体基板の底面に対して平行であり、前記第2の平面は、前記第2の半導体基板の底面に対して平行である、請求項10に記載の半導体構造体。
- 前記第1の半導体基板の底面に垂直方向に接する第1の絶縁体層と、
前記第1の絶縁体層の底面に垂直方向に接し、前記誘電体材料層に接合される別の誘電体材料層と、
前記第2の半導体基板の底面に垂直方向に接する第2の絶縁体層であって、前記誘電体材料層が前記第2の絶縁体層の底面に垂直方向に接する第2の絶縁体層と
をさらに備える、請求項10に記載の半導体構造体。 - 半導体構造体のための設計を、設計し、製造し、又は試験するための機械可読媒体内に記憶される設計構造体であって、
少なくとも1つの第1の半導体デバイスを含む第1の半導体基板を表す第1のデータと、
少なくとも1つの第2の半導体デバイスを含み、前記第1の半導体基板の下にある第2の半導体基板を表す第2のデータと、
前記第1の半導体基板と前記第2の半導体基板との間に配置される誘電体材料層であって、前記誘電体材料層を通して前記第1の半導体基板と前記第2の半導体基板が接合される誘電体材料層を表す第3のデータと、
前記誘電体材料層内に埋め込まれ、第1の横方向開口部及び第2の横方向開口部を有する連続キャビティを表す第4のデータと、
前記少なくとも1つの第1の半導体デバイスの上から前記少なくとも1つの第2の半導体デバイスのうちの1つまで延びる基板貫通ビアを表す第5のデータと
を含む、設計構造体。 - 前記連続キャビティは、前記誘電体材料層の上面と同一平面にある第1の平面及び前記誘電体材料層の底面と同一平面にある第2の平面によって垂直方向に境界付けられ、前記第1の平面は、前記第1の半導体基板の底面に対して平行であり、前記第2の平面は、前記第2の半導体基板の底面に対して平行である、請求項16に記載の設計構造体。
- 前記連続キャビティを満たす冷却流体を表す第6のデータと、
前記第1の横方向開口部に取り付けられる注入チューブを表す第7のデータと、
前記第2の横方向開口部に取り付けられる排出チューブを表す第8のデータと
をさらに含む、請求項17に記載の設計構造体。 - 少なくとも1つの第1の半導体デバイスをその上に有する第1の半導体基板を含む第1の構造体を準備するステップと、
少なくとも1つの第2の半導体デバイスをその上に有する第2の半導体基板を含む第2の構造体を準備するステップと、
前記第1の構造体上に直接、第1の誘電体材料層を形成するステップと、
前記第2の構造体上に直接、第2の誘電体材料層を形成するステップと、
前記第2の誘電体材料層をパターン化して、第1の横方向開口部及び第2の横方向開口部を有する連続チャネルを形成するステップと、
前記第1の誘電体材料層と前記第2の誘電体材料層とを接合するステップと、
を含む、半導体構造体の形成方法。 - 少なくとも1つの第1の半導体デバイスをその上に有する第1の半導体基板を含む第1の構造体を準備するステップと、
少なくとも1つの第2の半導体デバイスをその上に有する第2の半導体基板を含む第2の構造体を準備するステップと、
前記第2の構造体上に直接、導電性フィンを形成するステップと、
前記第2の構造体上に直接、第2の誘電体材料層を形成するステップであって、前記導電性フィンは、第1の端部及び第2の端部とそれらの間の埋め込み部とを有し、前記埋め込み部は、前記第2の誘電体材料層内に埋め込まれる、ステップと、
前記第1の構造体上に直接、又は前記第2の誘電体材料層上に直接、第1の誘電体材料層を形成するステップと、
前記第1の誘電体材料層と前記第2の誘電体材料層とを接合するステップと
を含む、半導体構造体の形成方法。
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US20100155932A1 (en) | 2010-06-24 |
US20120161275A1 (en) | 2012-06-28 |
US7943428B2 (en) | 2011-05-17 |
US20110201151A1 (en) | 2011-08-18 |
KR20100075363A (ko) | 2010-07-02 |
US8299563B2 (en) | 2012-10-30 |
US8298860B2 (en) | 2012-10-30 |
KR101103858B1 (ko) | 2012-01-11 |
JP5587590B2 (ja) | 2014-09-10 |
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