JP2010103543A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2010103543A5 JP2010103543A5 JP2009256294A JP2009256294A JP2010103543A5 JP 2010103543 A5 JP2010103543 A5 JP 2010103543A5 JP 2009256294 A JP2009256294 A JP 2009256294A JP 2009256294 A JP2009256294 A JP 2009256294A JP 2010103543 A5 JP2010103543 A5 JP 2010103543A5
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- manufacturing process
- integration
- ray
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 claims 16
- 230000010354 integration Effects 0.000 claims 14
- 238000000034 method Methods 0.000 claims 14
- 229910000679 solder Inorganic materials 0.000 claims 8
- 238000007689 inspection Methods 0.000 claims 6
- 238000012795 verification Methods 0.000 claims 6
- 238000012216 screening Methods 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 3
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/016,288 US6563905B1 (en) | 2001-10-30 | 2001-10-30 | Ball grid array X-ray orientation mark |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003541052A Division JP2006502557A (ja) | 2001-10-30 | 2002-10-29 | ボール状のグリッドアレイｘ線方位マーク |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010103543A JP2010103543A (ja) | 2010-05-06 |
| JP2010103543A5 true JP2010103543A5 (enExample) | 2010-07-22 |
Family
ID=21776350
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003541052A Pending JP2006502557A (ja) | 2001-10-30 | 2002-10-29 | ボール状のグリッドアレイｘ線方位マーク |
| JP2009256294A Pending JP2010103543A (ja) | 2001-10-30 | 2009-11-09 | ボールグリッドアレイｘ線方位マーク |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003541052A Pending JP2006502557A (ja) | 2001-10-30 | 2002-10-29 | ボール状のグリッドアレイｘ線方位マーク |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US6563905B1 (enExample) |
| EP (1) | EP1440471A2 (enExample) |
| JP (2) | JP2006502557A (enExample) |
| CN (1) | CN100375281C (enExample) |
| AU (1) | AU2002342218A1 (enExample) |
| BR (1) | BR0206243A (enExample) |
| CA (1) | CA2433488A1 (enExample) |
| IL (2) | IL156724A0 (enExample) |
| WO (1) | WO2003038896A2 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7027070B2 (en) * | 2001-11-29 | 2006-04-11 | Agilent Technologies, Inc. | Systems and methods for manipulating a graphical display of a printed circuit board model for an automated x-ray inspection system |
| US7386376B2 (en) | 2002-01-25 | 2008-06-10 | Intelligent Mechatronic Systems, Inc. | Vehicle visual and non-visual data recording system |
| US7529336B2 (en) | 2007-05-31 | 2009-05-05 | Test Research, Inc. | System and method for laminography inspection |
| US7989229B2 (en) * | 2007-09-10 | 2011-08-02 | International Business Machines Corporation | Tactile surface inspection during device fabrication or assembly |
| JP5493360B2 (ja) * | 2009-01-08 | 2014-05-14 | オムロン株式会社 | Ｘ線検査方法、ｘ線検査装置およびｘ線検査プログラム |
| JP2014192176A (ja) * | 2013-03-26 | 2014-10-06 | Ngk Spark Plug Co Ltd | 配線基板 |
| CN109196339B (zh) * | 2016-04-04 | 2021-06-29 | 索雷克核研究中心 | 电子系统、验证电子系统的部件的兼容性的方法 |
| US11029267B2 (en) * | 2016-04-04 | 2021-06-08 | Security Matters Ltd. | Method and a system for XRF marking and reading XRF marks of electronic systems |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4926452A (en) * | 1987-10-30 | 1990-05-15 | Four Pi Systems Corporation | Automated laminography system for inspection of electronics |
| GB8806232D0 (en) * | 1988-03-16 | 1988-04-13 | Plessey Co Plc | Vernier structure for flip chip bonded devices |
| JP3457348B2 (ja) * | 1993-01-15 | 2003-10-14 | 株式会社東芝 | 半導体装置の製造方法 |
| US5465152A (en) * | 1994-06-03 | 1995-11-07 | Robotic Vision Systems, Inc. | Method for coplanarity inspection of package or substrate warpage for ball grid arrays, column arrays, and similar structures |
| JPH10226A (ja) * | 1996-04-15 | 1998-01-06 | Mitsugi Sugiyama | Ｘ線により識別可能なプレス・スルー・パッケージ包装 |
| JPH1074802A (ja) * | 1996-08-30 | 1998-03-17 | Shimu:Kk | ボールグリッドアレイパッケージの接続構造及びその接続検査方法 |
| JP3535683B2 (ja) * | 1997-01-09 | 2004-06-07 | 株式会社ルネサステクノロジ | 位置認識用マーク付半導体装置 |
| JPH10284812A (ja) * | 1997-04-08 | 1998-10-23 | Mitsubishi Electric Corp | 半導体デバイス |
| DE59809216D1 (de) * | 1997-05-05 | 2003-09-11 | Macrotron Process Technologies | Verfahren und schaltungsanordnung zur prüfung von lötstellen |
| JPH11191575A (ja) * | 1997-12-25 | 1999-07-13 | Shinkawa Ltd | フリップチップボンディング用部品、フリップチップボンディング確認用部品及びフリップチップボンディング方法 |
| JP3929178B2 (ja) * | 1998-07-30 | 2007-06-13 | シチズン時計株式会社 | Ｉｃ実装構造 |
| GB2344550A (en) * | 1998-12-09 | 2000-06-14 | Ibm | Pad design for electronic package |
| US6272204B1 (en) * | 1999-02-23 | 2001-08-07 | Cr Technology, Inc. | Integrated X-ray and visual inspection systems |
| US6577019B1 (en) * | 2000-01-21 | 2003-06-10 | Micron Technology, Inc. | Alignment and orientation features for a semiconductor package |
| US6617702B2 (en) * | 2001-01-25 | 2003-09-09 | Ibm Corporation | Semiconductor device utilizing alignment marks for globally aligning the front and back sides of a semiconductor substrate |
-
2001
- 2001-10-30 US US10/016,288 patent/US6563905B1/en not_active Expired - Lifetime
-
2002
- 2002-10-29 WO PCT/US2002/034809 patent/WO2003038896A2/en not_active Ceased
- 2002-10-29 BR BR0206243-7A patent/BR0206243A/pt not_active IP Right Cessation
- 2002-10-29 JP JP2003541052A patent/JP2006502557A/ja active Pending
- 2002-10-29 EP EP02776377A patent/EP1440471A2/en not_active Withdrawn
- 2002-10-29 IL IL15672402A patent/IL156724A0/xx active IP Right Grant
- 2002-10-29 AU AU2002342218A patent/AU2002342218A1/en not_active Abandoned
- 2002-10-29 CA CA002433488A patent/CA2433488A1/en not_active Abandoned
- 2002-10-29 CN CNB028045300A patent/CN100375281C/zh not_active Expired - Fee Related
- 2002-12-06 US US10/313,401 patent/US6777821B2/en not_active Expired - Fee Related
-
2003
- 2003-06-30 IL IL156724A patent/IL156724A/en not_active IP Right Cessation
-
2009
- 2009-11-09 JP JP2009256294A patent/JP2010103543A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2010103543A5 (enExample) | ||
| EP2743708A3 (en) | Testing device and testing method thereof | |
| EP1887518A3 (en) | Method of setting reference data for inspection of solder fillets and inspection device using same | |
| SG166741A1 (en) | Vision inspectiion apparatus and vision inspection method therefor | |
| EP1826575A3 (en) | Electronic device test set and contact used therein | |
| CN102365001A (zh) | 一种在同一块板上多种表面处理的制造方法 | |
| CN101893545A (zh) | Pcb嵌入式金属基结合力的测试方法及测试设备 | |
| EP2728991A3 (en) | Board inspection apparatus system and board inspection method | |
| CN103954241A (zh) | 一种基于结构光的ic引脚共面度测量系统及其测量方法 | |
| ATE505768T1 (de) | Verfahren und messvorrichtung für die bewegungsleistung | |
| US10650510B2 (en) | Substrate inspection apparatus and method | |
| JP2010103543A (ja) | ボールグリッドアレイｘ線方位マーク | |
| CN106664826B (zh) | 检查装置及方法和包括其的部件贴装系统及方法 | |
| US8851358B2 (en) | Method for aligning plate-like members and method for manufacturing electrical connecting apparatus | |
| CN105575836A (zh) | 测试装置 | |
| WO2008149445A1 (ja) | 半田接合部を有する電子装置の診断装置、診断方法、及び診断プログラム | |
| KR100962638B1 (ko) | 다이 본딩 방법 및 장치 | |
| JP2012050704A5 (enExample) | ||
| JP2010008149A (ja) | 検査領域設定方法 | |
| CN103855041A (zh) | 一种芯片植球装置及方法 | |
| EP2722875A3 (en) | Apparatus and method of electrical testing for flip chip | |
| TW201840077A (zh) | 檢查治具之製造方法 | |
| EP2031655A3 (en) | Semiconductor device and method of manufacturing the same | |
| JP2006202791A5 (enExample) | ||
| JP2013092508A5 (enExample) |