BR0206243A - Marca de orientação de raios x para matriz de bolas em grade - Google Patents
Marca de orientação de raios x para matriz de bolas em gradeInfo
- Publication number
- BR0206243A BR0206243A BR0206243-7A BR0206243A BR0206243A BR 0206243 A BR0206243 A BR 0206243A BR 0206243 A BR0206243 A BR 0206243A BR 0206243 A BR0206243 A BR 0206243A
- Authority
- BR
- Brazil
- Prior art keywords
- ray
- electronic component
- ball array
- orientation mark
- ray orientation
- Prior art date
Links
- CAWXEEYDBZRFPE-UHFFFAOYSA-N Hexazinone Chemical compound O=C1N(C)C(N(C)C)=NC(=O)N1C1CCCCC1 CAWXEEYDBZRFPE-UHFFFAOYSA-N 0.000 title 1
- 238000007689 inspection Methods 0.000 abstract 2
- 230000010354 integration Effects 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- 238000012795 verification Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/5442—Marks applied to semiconductor devices or parts comprising non digital, non alphanumeric information, e.g. symbols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
- H01L2223/5448—Located on chip prior to dicing and remaining on chip after dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05568—Disposition the whole external layer protruding from the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05573—Single external layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/061—Disposition
- H01L2224/0612—Layout
- H01L2224/0613—Square or rectangular array
- H01L2224/06131—Square or rectangular array being uniform, i.e. having a uniform pitch across the array
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/168—Wrong mounting prevention
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Abstract
"MARCA DE ORIENTAçãO DE RAIOS-X PARA DISPOSIçãO DE BOLAS NA FORMA DE GRADE". São apresentados um equipamento e um método para inspeção da orientação de componentes eletrónicos juntamente com uma verificação por raios-X da integridade de conexões. Um método exemplar compreende prover um componente eletrónico 100 para integração por montagem superficial e prover um indicador de orientação visível por raios-X 300, 402, 500, 600, para o componente eletrónico 100, de tal forma que a orientação apropriada do componente eletrónico 100 possa ser verificada por inspeção por raios-X após efetuar a integração por montagem superficial do componente eletrónico. A inspeção por raios-X também possibilita a verificação de integridade de conexões do componente eletrónico 100.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/016,288 US6563905B1 (en) | 2001-10-30 | 2001-10-30 | Ball grid array X-ray orientation mark |
PCT/US2002/034809 WO2003038896A2 (en) | 2001-10-30 | 2002-10-29 | Ball grid array with x-ray alignment mark |
Publications (1)
Publication Number | Publication Date |
---|---|
BR0206243A true BR0206243A (pt) | 2004-12-28 |
Family
ID=21776350
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR0206243-7A BR0206243A (pt) | 2001-10-30 | 2002-10-29 | Marca de orientação de raios x para matriz de bolas em grade |
Country Status (10)
Country | Link |
---|---|
US (2) | US6563905B1 (pt) |
EP (1) | EP1440471A2 (pt) |
JP (2) | JP2006502557A (pt) |
CN (1) | CN100375281C (pt) |
AU (1) | AU2002342218A1 (pt) |
BR (1) | BR0206243A (pt) |
CA (1) | CA2433488A1 (pt) |
HK (1) | HK1064509A1 (pt) |
IL (2) | IL156724A0 (pt) |
WO (1) | WO2003038896A2 (pt) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7027070B2 (en) * | 2001-11-29 | 2006-04-11 | Agilent Technologies, Inc. | Systems and methods for manipulating a graphical display of a printed circuit board model for an automated x-ray inspection system |
US7386376B2 (en) | 2002-01-25 | 2008-06-10 | Intelligent Mechatronic Systems, Inc. | Vehicle visual and non-visual data recording system |
US7529336B2 (en) | 2007-05-31 | 2009-05-05 | Test Research, Inc. | System and method for laminography inspection |
US7989229B2 (en) * | 2007-09-10 | 2011-08-02 | International Business Machines Corporation | Tactile surface inspection during device fabrication or assembly |
JP5493360B2 (ja) * | 2009-01-08 | 2014-05-14 | オムロン株式会社 | X線検査方法、x線検査装置およびx線検査プログラム |
JP2014192176A (ja) * | 2013-03-26 | 2014-10-06 | Ngk Spark Plug Co Ltd | 配線基板 |
US11029267B2 (en) * | 2016-04-04 | 2021-06-08 | Security Matters Ltd. | Method and a system for XRF marking and reading XRF marks of electronic systems |
KR102204124B1 (ko) * | 2016-04-04 | 2021-01-19 | 소레크 뉴클리어 리서치 센터 | 전자 시스템의 xrf 마킹 및 xrf 마크 판독 방법 및 시스템 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4926452A (en) * | 1987-10-30 | 1990-05-15 | Four Pi Systems Corporation | Automated laminography system for inspection of electronics |
GB8806232D0 (en) * | 1988-03-16 | 1988-04-13 | Plessey Co Plc | Vernier structure for flip chip bonded devices |
JP3457348B2 (ja) * | 1993-01-15 | 2003-10-14 | 株式会社東芝 | 半導体装置の製造方法 |
US5465152A (en) * | 1994-06-03 | 1995-11-07 | Robotic Vision Systems, Inc. | Method for coplanarity inspection of package or substrate warpage for ball grid arrays, column arrays, and similar structures |
JPH10226A (ja) * | 1996-04-15 | 1998-01-06 | Mitsugi Sugiyama | X線により識別可能なプレス・スルー・パッケージ包装 |
JPH1074802A (ja) * | 1996-08-30 | 1998-03-17 | Shimu:Kk | ボールグリッドアレイパッケージの接続構造及びその接続検査方法 |
JP3535683B2 (ja) * | 1997-01-09 | 2004-06-07 | 株式会社ルネサステクノロジ | 位置認識用マーク付半導体装置 |
JPH10284812A (ja) * | 1997-04-08 | 1998-10-23 | Mitsubishi Electric Corp | 半導体デバイス |
WO1998050784A1 (de) * | 1997-05-05 | 1998-11-12 | Macrotron Process Technologies Gmbh | Verfahren und schaltungsanordnung zur prüfung von lötstellen |
JPH11191575A (ja) * | 1997-12-25 | 1999-07-13 | Shinkawa Ltd | フリップチップボンディング用部品、フリップチップボンディング確認用部品及びフリップチップボンディング方法 |
JP3929178B2 (ja) * | 1998-07-30 | 2007-06-13 | シチズン時計株式会社 | Ic実装構造 |
GB2344550A (en) * | 1998-12-09 | 2000-06-14 | Ibm | Pad design for electronic package |
US6272204B1 (en) * | 1999-02-23 | 2001-08-07 | Cr Technology, Inc. | Integrated X-ray and visual inspection systems |
US6577019B1 (en) * | 2000-01-21 | 2003-06-10 | Micron Technology, Inc. | Alignment and orientation features for a semiconductor package |
US6617702B2 (en) * | 2001-01-25 | 2003-09-09 | Ibm Corporation | Semiconductor device utilizing alignment marks for globally aligning the front and back sides of a semiconductor substrate |
-
2001
- 2001-10-30 US US10/016,288 patent/US6563905B1/en not_active Expired - Lifetime
-
2002
- 2002-10-29 BR BR0206243-7A patent/BR0206243A/pt not_active IP Right Cessation
- 2002-10-29 IL IL15672402A patent/IL156724A0/xx active IP Right Grant
- 2002-10-29 WO PCT/US2002/034809 patent/WO2003038896A2/en not_active Application Discontinuation
- 2002-10-29 CA CA002433488A patent/CA2433488A1/en not_active Abandoned
- 2002-10-29 EP EP02776377A patent/EP1440471A2/en not_active Withdrawn
- 2002-10-29 AU AU2002342218A patent/AU2002342218A1/en not_active Abandoned
- 2002-10-29 JP JP2003541052A patent/JP2006502557A/ja active Pending
- 2002-10-29 CN CNB028045300A patent/CN100375281C/zh not_active Expired - Fee Related
- 2002-12-06 US US10/313,401 patent/US6777821B2/en not_active Expired - Fee Related
-
2003
- 2003-06-30 IL IL156724A patent/IL156724A/en not_active IP Right Cessation
-
2004
- 2004-09-21 HK HK04107249A patent/HK1064509A1/xx not_active IP Right Cessation
-
2009
- 2009-11-09 JP JP2009256294A patent/JP2010103543A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
HK1064509A1 (en) | 2005-01-28 |
US20030082898A1 (en) | 2003-05-01 |
JP2010103543A (ja) | 2010-05-06 |
US6563905B1 (en) | 2003-05-13 |
US20040008812A1 (en) | 2004-01-15 |
EP1440471A2 (en) | 2004-07-28 |
WO2003038896A2 (en) | 2003-05-08 |
IL156724A (en) | 2007-07-04 |
JP2006502557A (ja) | 2006-01-19 |
CN1515032A (zh) | 2004-07-21 |
AU2002342218A1 (en) | 2003-05-12 |
CA2433488A1 (en) | 2003-05-08 |
IL156724A0 (en) | 2004-01-04 |
US6777821B2 (en) | 2004-08-17 |
WO2003038896A3 (en) | 2003-07-31 |
CN100375281C (zh) | 2008-03-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
BRPI0709105A8 (pt) | Sistemas de teste de diagnóstico e método de suprimento de dados de diagnóstico para um computador | |
BR0206243A (pt) | Marca de orientação de raios x para matriz de bolas em grade | |
BRPI0519225A2 (pt) | aparelho mÉdico empregando estruturas de luz flexÍveis e mÉtodos para fabricar as mesmas | |
BRPI0603066A (pt) | simulação de procedimento invasivos | |
ATE453430T1 (de) | Vorrichtung und verfahren für die qualitätsüberprüfung einer partikeltherapieanlage | |
BR0309947A (pt) | Processo para a produção de camadas de polìmero | |
ATE533115T1 (de) | Verfahren zum simulieren und erstellen eines behandlungsplans für vorhofflimmern | |
SG148015A1 (en) | Lithographic apparatus and device manufacturing method | |
BRPI0900510A2 (pt) | sistema e método de esterilização de um dispositivo médico implantável | |
EP1758166A3 (en) | Interposer and method for producing the same and electronic device | |
BRPI0515208B8 (pt) | implante e instrumento de colocação de implante | |
BRPI0410277A (pt) | método para simular um comportamento de uma distribuição de energia dentro de um conjunto contendo um material multicamada reativo, dispositivo de armazenamento de programa legìvel por uma máquina, método para unir, e, junta | |
ATE386682T1 (de) | Vorrichtung und verfahren zur befestigung eines flugzeug-radoms | |
ATE444475T1 (de) | Verfahren und vorrichtung zum genauen bestimmen eines drehwinkels | |
DE602006020461D1 (de) | System zur darstellung von menschlichen oder tierischen organen zur messung der elastizität des organs | |
DE502009000187D1 (de) | Vorrichtung und Verfahren zur Reduzierung der Strahlaufweitung einer Strahlung | |
JP2010103543A5 (pt) | ||
TW200746238A (en) | Method and apparatus for indicating directionality in integrated circuit manufacturing | |
DE602004023966D1 (de) | Verfahren und vorrichtung zur bildung strukturierter beschichteter filme | |
BR0207772A (pt) | Procedimento e dispositivo para a verificação de circuitos eletrônicos ou componentes dos mesmos em uma placa de circuitos impressos | |
BR0116307A (pt) | Sistema e método para pré-programar uma memória de dispositivo eletrônico | |
WO2008059414A3 (en) | Undisturbed speech generation for speech testing and therapy | |
HK1133152A1 (en) | Lead shield for a betatron and x-ray testing apparatus | |
Knox et al. | The influence of mini-fragment plates on the mechanical properties of long-bone plate fixation | |
ATE395882T1 (de) | Vorrichtung zur reparatur der fersenbeinsehne |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08L | Patent application lapsed because of non payment of annual fee [chapter 8.12 patent gazette] |
Free format text: REFERENTE AO NAO RECOLHIMENTO DAS 10A E 11A ANUIDADES. |
|
B08I | Publication cancelled [chapter 8.9 patent gazette] |
Free format text: ANULADA A PUBLICACAO CODIGO 8.12 NA RPI NO 2258 DE 15/04/2014 POR TER SIDO INDEVIDA. |
|
B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE AS 10A, 11A, 12A, 13A, 14A, 15A, 16A, 17A E 18A ANUIDADES. |
|
B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2602 DE 17-11-2020 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |