CN100375281C - 球格阵x射线定向标志 - Google Patents
球格阵x射线定向标志 Download PDFInfo
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Abstract
给出了一种用于检查电子元件定位以及连接整体性的X射线校验的装置和方法。示例性方法包括:提供用于表面安装集成的电子元件100以及为该电子元件100提供X射线可见的定向指示符300、402、500、600,使得在进行该电子元件的表面安装集成之后,该电子元件100的适当定向可由X射线检查来校验。X射线检查还使电子元件100的连接整体性可被校验。
Description
技术领域
本发明涉及用于检查集成电子元件的系统和方法,尤其用于检查以的球格阵(BGA)连接的元件。
背景技术
电子电路封装技术是电路设计的一个重要方面。改进的封装方法提供了电路性能的改进以及费用和时间的节约。由于它在1960年代表面安装技术中的发展已经取代了常规的“通孔”封装方法,其中电子元件直接与印刷电路板表面上的金属板焊接。这种技术提供较好的电路性能和较高的连接密度。某些当前可用的表面安装技术有塑料引线的芯片载体、小型集成电路、芯片电容器、芯片电阻器、球格阵、以及芯片规模封装包。
如同任何封装技术一样,用于检查和校验元件连接质量的有效方法和系统对实现表面按装技术很重要。X射线检查有时用于校验元件连接,尤其是某些对于普通可视检查会模糊的那些连接。
球格阵技术一般使用离散焊接球的密集栅格以便于电子元件(譬如专用集成电路(ASIC)和印刷电路板(PCB))的电气连接。有了准确对齐和加热以后,通过熔化的焊接球在元件上焊点阵列和印刷电路板上相应的焊点阵列之间建立连接。BGA封装的优点包括减少了的元件大小、费用和重量,给定衬底区域的较高I/O计数、改进了的电气性能、以及向多芯片模块的容易延展。由于栅格存在模糊连接,因此通常用X射线检查来验证BGA连接的整体性。
而且,使用表面安装技术、尤其是BGA技术的许多元件设计都具有焊点阵列的对称连接模式。由于这些对称连接模式提供了连接的密集排列和方便的处理,因此它们是较佳的(实际上,是标准的)。连接的密集模式是表面安装技术、包括BGA技术的主要动机。具有对称连接模式的元件的适当定向常规上在元件与印刷电路板集成时由可视指示符确定。然而,仍会发生元件的不适当定向。
可视定向指示符一般用丝网印刷印在元件外表上,X射线检查不能看见。在某些情况下,嵌入电子元件外壳材料内的物理特征也被用作指示电子元件的适当定向的标记。然而,外壳材料总是对于X射线不可见;X射线可视的外壳材料会防止对电子元件集成的任何X射线检查。因此,连接整体性检查和定向校验目前作为两个独立过程执行。
需要用于检查电子电路封装的更有效的系统和方法。需要用最小的附加设备和步骤来进行附加的检查。尤其需要用于检查BGA封装的元件定向的这种改进了的系统和方法。还需要不牺牲对称连接模式的好处而采样这种系统和方法。本发明满足了这些需要。
发明内容
本发明揭示了提供对电子元件集成的定向检查的方法和装置,其中X射线检查用来校验集成后的电子元件的连接整体性。因此,本发明对于表面安装技术尤其有用,譬如球格阵(BGA)集成。本发明可以结合在要求最小附加时间和设备的现有集成检查过程内。
用本发明产生可检查的电子元件的示例性方法包括:为集成提供电子元件、以及为该电子元件提供X射线可见的定向指示符,使得在电子元件集成之后电子元件的正确定向可由X射线检查校验。X射线检查还使电子元件的连接整体性在电子元件的集成后可被校验。
用本发明检查电子元件的示例性方法包括在集成了电子元件之后产生电子元件的X射线,其中该电子元件包括X射线可见的定向指示符并且进行X射线的X射线检查以校验电子元件的连接整体性并且校验电子元件的恰当定位。
使用本发明的示例性装置包括用于集成的电子元件以及该电子元件的X射线可见的定向指示符,使得在电子元件的集成之后该电子元件的适当定向可由X射线检查来校验。X射线检查还在该电子元件的集成之后使电子元件的连接整体性可被校验。
本发明还可以与任何X射线检查的集成技术一起使用,譬如像球格阵集成这样的表面安装技术。在电子元件包括焊点和/或焊球的对称排列时,本发明是有用的。
在一个实施例中,X射线可见的定向指示符具有金属内容。X射线可见的定向指示符可以作为电子元件的部分制造过程而产生。例如,X射线可见的定向指示符可以作为制造电子元件的印模(如,定向指示符在印模中制成)、电子元件上的丝网印花标记(如,一个标记是定向指示符)、或产生电子元件的焊点(如,唯一焊点为定向指示符)的一部分而产生。
附图说明
现在参考附图,其中相同的号码表示相应的部分:
图1A和1B说明了典型的BGA连接X射线;
图2说明了示例性BGA连接的特写图;
图3说明了带有X射线可见的定向指示符的示例性BGA连接;
图4说明了带有印模内X射线可见的定向指示符的示例性BGA连接;
图5说明了带有X射线可见的定向指示符焊点的示例性BGA连接;
图6说明了带有分开的X射线可见定向指示符的示例性BGA连接;
图7是用本发明产生可检查的电子元件的方法流程图;以及
图8是用本发明检查电子元件的方法流程图。
具体实施方式
在下面优选实施例的描述中,参考作为这里组成部分的附图,它们通过说明本发明可实际应用的特定实施例而示出。可以理解,可以使用其它实施例并作出结构上的变化,而不背离本发明的范围。
1.综述
本发明建立了连接整体性检查以及元件集成的定向校验之间的协同作用。本发明可应用于集成在较大电路内的任何电子元件(如,集成电路)并且揭示了X射线检查下的对称连接模式。自动或手动X射线检查用于校验集成电子元件的连接整体性。然而,如果电子元件的连接模式是对称的,对被捕获的X射线的研究通常不揭示任何指示元件是否被不适当地定向的信息。这是由于X射线可见的连接模式一般是对称的。
图1A和1B说明了电子元件100的典型球格阵X射线。对称连接模式110由一焊接球栅格连接102组成。各连接102建立在电子元件100上的第一焊点106和印刷电路板104上的第二焊点108之间。X射线检查用于校验焊接球112到焊点106、108的连接整体性。按照惯例,特定连接102A被指定为元件100和印刷电路板104的“引脚1”。电子元件100的适当定向通过匹配两个元件间的“引脚1”连接102A而被校验。然而如前所述,常规指示符对于X射线检查不可见。当然,本发明并不限于针对“引脚1”的定向指示符;任何连接102或元件100内的位置能充当下文中示例性实施例中所描述的定向指示符。
图2说明了示例性BGA连接102的特写图。焊接球102形成电子元件100上的第一焊点106和印刷电路板104上的第二焊点108之间的连接。该连接的形成以焊接球112附着在电子元件100的第一焊点106上开始,然后精确熔入电路板104的第二焊点108。
而且,尽管以带有四个可能定向的格子的形式示出对称连接模式110,然而也可以使用其它对称模式。对称模式110仅需具有两个可能定向,它们在集成电子元件100受到X射线检查时是不可辨认的。在其它实施例中,对称连接模式从一个格子开始形成,该格具有一个或多个省略行和/或列或者被省略的行/或列的部分(未示出)。
本发明也可被有效地结合在任何现有自动X射线检查过程中,譬如进行计算机化的图像识别来校验连接整体性的过程。定向指示符位置的识别可以容易地被补充到校验连接整体性所需的更为复杂的图像识别中。
此外,尽管这里所述的本发明主要关于BGA集成电子元件100的X射线检查,然而本发明可被结合在元件100的任何X射线检查过程中。本发明不限于BGA集成或者甚至表面安装技术。
2.示例实施例
在本发明的一个实施例中,在电子元件上提供了一个X射线可见的指示符。尽管不作要求,然而该指示符具有金属内容,从而提供了X射线内更清楚的标记。若干不同技术可用于产生该指示符,然而,指示符最好作为电子元件的普通制造过程的一部分而产生,从而使实现的费用最小。指示符最好不遮蔽要被X射线检查的元件。
下面的图中详述了可被改变来实现本发明的电子元件的普通制造过程的某些示例。它们包括印刷识别标记、印模制造、以及焊点和电气接触点的制造和定位。
图3说明了示例性BGA连接X射线,示出X射线可见的定向指示符300。标记作为目标识别的普通制造过程的一部分而被印在电子元件100的外表上。例如,电子元件可以用丝网印刷工艺作标记。在该实施例中,定向指示符300是丝网印刷的X射线可见的“1”标记,表示“引脚1”连接102A。为了加强标记的X射线可见性,丝网印刷的材料中可以包括金属内容。例如,丝网印刷的印色可以装载金属粉末。假如产生X射线可见的标记,则也可以使用其它印刷过程,譬如冲压或手动写入。此外,标记自身可以是任何形式或形状,尽管“1”获得工业上的识别。
图4说明了示例性BGA连接X射线,在元件100的电子电路的印模400中带有X射线可见的定向指示符。电子元件制造一般采用元件100的电子电路印模400的制造,并且包括带有焊点106的电子连接的形成。在一个实施例中,X射线可见的定向指示符402在印模400内制成,它处在不会遮蔽BGA连接的X射线检查的无害区域中。定向指示符402可以是任何形状,只要它能用于校验电子元件100的适当定向。在一个实施例中,印模400的一角清楚地用如定向指示符402这样的金属来标记。由于印模400包括金属组分,因此定向指示符402将是X射线可见的。
图5说明了示例性BGA连接X射线,带有包括在焊点102A内的X射线可见的定向指示符500。在本发明的该实施例中,定向指示符500是在“引脚1”连接102A处的清楚形状的接触点500。清楚接触点500的形状可以是使它能从其它接触点102中被辨认出来的任何形式。然而,该形状应该使对元件100的电气性能的负面影响可以忽略并且使它不遮蔽电气连接的X射线检查。
图6说明了带有分开的X射线可见定向指示符的示例性BGA连接X射线。在本发明的还有一个实施例中,X射线可见的定向指示符600是元件材料内的分开的元件。指示符600可以单独从普通制造过程中被添加。或者,分开的指示符600可以是附加的非功能性焊点(没有电气连接器或焊接球),方便地与功能性焊点一起被安装。将附加焊点用作定向指示符600消除了对单独制造部件的需求。
3.示例方法实施例
图7是用本发明产生可检查的电子元件的方法流程图。过程通过在块700处提供用于集成的电子元件而开始。接着,在块702处提供了电子元件的X射线可见的定向指示符,使得在电子元件集成之后该电子元件的适当定向可由X射线检查来校验。定向指示符可以作为许多普通电子元件制造过程的一部分而被提供,譬如印刷识别标记、印模制造、以及焊点的制造和定位。X射线检查还在电子元件集成之后使电子元件的连接整体性可被校验。
图8是用本发明检查电子元件的方法流程图。在块800处,过程通过在电子元件被集成后产生电子元件的X射线而开始。该电子元件包括X射线可见的定向指示符。定向指示符可以作为许多普通电子元件制造过程的部分而被提供,譬如印刷识别标记、印模制造、以及焊点的制造和定位。然后,在块802处执行X射线的检查,用于校验电子元件的连接整体性,以及用于校验电子元件的适当定向。
结论
这总结包括了本发明优选实施例的说明书。上述包括本发明优选实施例的说明已经为了说明和描述的目的而被给出。它并非是详尽的且并非试图将本发明限制在所揭示的范围内。根据上述原理,许多等价的修改和变化也是可行的。
本发明的范围并非受到该详细说明所限制,而却受到所附权利要求的限制。上述说明、示例和信息提供了制造的完全描述以及本发明装置和方法的使用。由于可以不背离本发明的范围而作出本发明的许多实施例,因此本发明存在于所附权利要求内。
Claims (32)
1.一种产生可检查的电子元件的方法,其特征在于包括:
提供用于集成的电子元件;以及
提供该电子元件的X射线可见的定向指示符,使得在电子元件的集成之后该电子元件的适当定向可由X射线检查来校验;
其中X射线检查还在电子元件的集成之后使电子元件的连接整体性可被校验。
2.如权利要求1所述的方法,其特征在于,所述集成是球格阵集成。
3.如权利要求1所述的方法,其特征在于,所述电子元件包括焊点的对称排列。
4.如权利要求1所述的方法,其特征在于,所述X射线可见的定向指示符具有金属内容。
5.如权利要求1所述的方法,其特征在于,所述X射线可见的定向指示符作为电子元件的部分制造过程而产生。
6.如权利要求5所述的方法,其特征在于,所述制造过程是制造电子元件的印模。
7.如权利要求5所述的方法,其特征在于,所述制造过程是电子元件上的丝网印刷标记。
8.如权利要求5所述的方法,其特征在于,所述制造过程是产生电子元件的焊点。
9.一种检查电子元件的方法,其特征在于包括下列步骤:
在电子元件被集成之后产生电子元件的X射线,其中该电子元件包括X射线可见的定向指示符;以及
执行该X射线的X射线检查,用于校验电子元件的连接整体性,并且用于校验电子元件的适当定向。
10.如权利要求9所述的方法,其特征在于,所述电子元件的集成是用球格阵集成。
11.如权利要求9所述的方法,其特征在于,所述电子元件包括焊点的对称排列。
12.如权利要求9所述的方法,其特征在于,所述X射线可见的定位指向符具有金属内容。
13.如权利要求9所述的方法,其特征在于,所述X射线可见的定向指示符作为电子元件的部分制造过程而产生。
14.如权利要求13所述的方法,其特征在于,所述制造过程是制造电子元件的印模。
15.如权利要求13所述的方法,其特征在于,所述制造过程是电子元件上的丝网印刷标记。
16.如权利要求13所述的方法,其特征在于,所述制造过程是产生电子元件的焊点。
17.一种装置,其特征在于包括:
用于集成的电子元件;以及
电子元件的X射线可见的定向指示符,使得在电子元件集成之后该电子元件的适当定位可由X射线检查来校验;
其中该X射线检查还在电子元件的集成之后使电子元件的连接整体性可被校验。
18.如权利要求17所述的装置,其特征在于,所述集成是球格阵集成。
19.如权利要求17所述的装置,其特征在于,所述电子元件包括焊点的对称排列。
20.如权利要求17所述的装置,其特征在于,所述X射线可见的定向指示符具有金属内容。
21.如权利要求17所述的装置,其特征在于,所述X射线可见的定向指示符作为电子元件的部分制造过程而产生。
22.如权利要求21所述的装置,其特征在于,所述制造过程是制造电子元件的印模。
23.如权利要求21所述的装置,其特征在于,所述制造过程是电子元件上的丝网印刷标记。
24.如权利要求21所述的装置,其特征在于,所述制造过程是产生电子元件的焊点。
25.一种装置,其特征在于包括:
电子元件装置,用集成过程结合到电子组装件内;以及
X射线可见的定向指示符装置,用于在电子元件集成之后用X射线检查来校验该电子元件的适当定位;
其中该X射线检查还在电子元件的集成之后使电子元件的连接整体性可被校验。
26.如权利要求25所述的装置,其特征在于,所述集成过程是球格阵集成。
27.如权利要求25所述的装置,其特征在于,所述电子元件装置包括焊点的对称排列。
28.如权利要求25所述的装置,其特征在于,所述X射线可见的定向指示符装置具有金属内容。
29.如权利要求25所述的装置,其特征在于,所述X射线可见的定向指示符装置作为电子元件的部分制造过程而产生。
30.如权利要求29所述的装置,其特征在于,所述制造过程是制造电子元件装置的印模。
31.如权利要求29所述的装置,其特征在于,所述制造过程是电子元件装置上的丝网印刷标记。
32.如权利要求29所述的装置,其特征在于,所述制造过程是产生电子元件装置的焊点。
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US7027070B2 (en) * | 2001-11-29 | 2006-04-11 | Agilent Technologies, Inc. | Systems and methods for manipulating a graphical display of a printed circuit board model for an automated x-ray inspection system |
US7386376B2 (en) | 2002-01-25 | 2008-06-10 | Intelligent Mechatronic Systems, Inc. | Vehicle visual and non-visual data recording system |
US7529336B2 (en) | 2007-05-31 | 2009-05-05 | Test Research, Inc. | System and method for laminography inspection |
US7989229B2 (en) * | 2007-09-10 | 2011-08-02 | International Business Machines Corporation | Tactile surface inspection during device fabrication or assembly |
JP5493360B2 (ja) * | 2009-01-08 | 2014-05-14 | オムロン株式会社 | X線検査方法、x線検査装置およびx線検査プログラム |
JP2014192176A (ja) * | 2013-03-26 | 2014-10-06 | Ngk Spark Plug Co Ltd | 配線基板 |
US11029267B2 (en) * | 2016-04-04 | 2021-06-08 | Security Matters Ltd. | Method and a system for XRF marking and reading XRF marks of electronic systems |
WO2017175219A1 (en) * | 2016-04-04 | 2017-10-12 | Soreq Nuclear Research Center | A method and a system for xrf marking and reading xrf marks of electronic systems |
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AU2002342218A1 (en) | 2003-05-12 |
IL156724A0 (en) | 2004-01-04 |
US6777821B2 (en) | 2004-08-17 |
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BR0206243A (pt) | 2004-12-28 |
CN1515032A (zh) | 2004-07-21 |
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CA2433488A1 (en) | 2003-05-08 |
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