JP2006202791A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2006202791A5 JP2006202791A5 JP2005009728A JP2005009728A JP2006202791A5 JP 2006202791 A5 JP2006202791 A5 JP 2006202791A5 JP 2005009728 A JP2005009728 A JP 2005009728A JP 2005009728 A JP2005009728 A JP 2005009728A JP 2006202791 A5 JP2006202791 A5 JP 2006202791A5
- Authority
- JP
- Japan
- Prior art keywords
- package
- substrate
- ray
- chip
- radiation shielding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 4
- 230000005855 radiation Effects 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005009728A JP4509806B2 (ja) | 2005-01-18 | 2005-01-18 | Icパッケージ及びそれを用いたx線ct装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005009728A JP4509806B2 (ja) | 2005-01-18 | 2005-01-18 | Icパッケージ及びそれを用いたx線ct装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006202791A JP2006202791A (ja) | 2006-08-03 |
| JP2006202791A5 true JP2006202791A5 (enExample) | 2008-02-28 |
| JP4509806B2 JP4509806B2 (ja) | 2010-07-21 |
Family
ID=36960555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005009728A Expired - Fee Related JP4509806B2 (ja) | 2005-01-18 | 2005-01-18 | Icパッケージ及びそれを用いたx線ct装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4509806B2 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4365844B2 (ja) * | 2006-09-08 | 2009-11-18 | 三菱電機株式会社 | 荷電粒子線の線量分布測定装置 |
| JP2010066109A (ja) | 2008-09-10 | 2010-03-25 | Canon Inc | 放射線装置 |
| JP5676922B2 (ja) * | 2010-05-31 | 2015-02-25 | ジーイー・メディカル・システムズ・グローバル・テクノロジー・カンパニー・エルエルシー | X線検出器モジュールおよびx線検出器並びにx線ct装置 |
| CN102639061B (zh) * | 2010-10-20 | 2015-11-25 | 株式会社东芝 | Das检测器以及x射线计算机断层摄影装置 |
| US8575558B2 (en) * | 2010-11-30 | 2013-11-05 | General Electric Company | Detector array with a through-via interposer |
| US9012857B2 (en) * | 2012-05-07 | 2015-04-21 | Koninklijke Philips N.V. | Multi-layer horizontal computed tomography (CT) detector array with at least one thin photosensor array layer disposed between at least two scintillator array layers |
| JP6631494B2 (ja) * | 2016-12-16 | 2020-01-15 | 株式会社デンソー | 電子装置 |
| EP3462494B1 (en) * | 2017-09-29 | 2021-03-24 | Detection Technology OY | Integrated radiation detector device |
| KR102487841B1 (ko) | 2018-03-14 | 2023-01-11 | 삼성전자주식회사 | 반도체 패키지 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60106150A (ja) * | 1983-11-15 | 1985-06-11 | Nippon Telegr & Teleph Corp <Ntt> | 耐放射線パツケ−ジ |
| JPH03208364A (ja) * | 1990-01-10 | 1991-09-11 | Mitsubishi Electric Corp | 半導体パッケージ |
| JP2001511202A (ja) * | 1997-01-30 | 2001-08-07 | スペース エレクトロニクス,インコーポレイテッド | 放射線遮蔽材をイオン化するための方法及び組成物関連出願のクロスレファレンス |
| JP2001083255A (ja) * | 1999-09-10 | 2001-03-30 | Kyocera Corp | X線検出素子搭載用配線基板 |
| JP4160702B2 (ja) * | 1999-09-24 | 2008-10-08 | 京セラ株式会社 | X線検出素子搭載用配線基板 |
| US6967390B2 (en) * | 2003-02-13 | 2005-11-22 | Freescale Semiconductor, Inc. | Electronic component and method of manufacturing same |
-
2005
- 2005-01-18 JP JP2005009728A patent/JP4509806B2/ja not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5081578B2 (ja) | 樹脂封止型半導体装置 | |
| JP2009105297A5 (enExample) | ||
| TWI594390B (zh) | 半導體封裝件及其製法 | |
| KR102270465B1 (ko) | 인-패키지 구획 차폐를 갖는 반도체 패키지 및 그 제조 방법 | |
| JP2009044160A5 (enExample) | ||
| JP2006202791A5 (enExample) | ||
| JP2009289849A5 (enExample) | ||
| JP6473778B2 (ja) | 光学的封止構造体 | |
| JP2010192653A5 (enExample) | ||
| JP2016072492A5 (enExample) | ||
| TWI599002B (zh) | 封裝結構製作方法 | |
| CN109326567A (zh) | 用于将集成电路管芯安装到载体的负圆角 | |
| TW200843056A (en) | Heat-dissipating semiconductor package and method for manufacturing the same | |
| US20200168557A1 (en) | Semiconductor package and fabrication method thereof | |
| JP2022510459A (ja) | シールドされた一体型デバイスパッケージ | |
| JP2009117819A5 (enExample) | ||
| TW200527617A (en) | Electronic part mounting substrate, electronic part, and semiconductor device | |
| CN205542768U (zh) | Sip封装结构 | |
| JP4509806B2 (ja) | Icパッケージ及びそれを用いたx線ct装置 | |
| KR20200064869A (ko) | 반도체 패키지 및 그것의 제조 방법 | |
| SG149896A1 (en) | Methods of fabrication of lead frame-based semiconductor device packages incorporating at least one land grid array package | |
| CN103441080A (zh) | 一种芯片正装bga封装方法 | |
| CN107093541A (zh) | 具有转换器元件上的照明层的x射线检测器 | |
| CN111066141B (zh) | 用于电子器件的抗辐射封装件 | |
| CN105552063A (zh) | Sip封装结构 |