JP4509806B2 - Ｉｃパッケージ及びそれを用いたｘ線ｃｔ装置 - Google Patents

Ｉｃパッケージ及びそれを用いたｘ線ｃｔ装置 Download PDF

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Publication number
JP4509806B2
JP4509806B2 JP2005009728A JP2005009728A JP4509806B2 JP 4509806 B2 JP4509806 B2 JP 4509806B2 JP 2005009728 A JP2005009728 A JP 2005009728A JP 2005009728 A JP2005009728 A JP 2005009728A JP 4509806 B2 JP4509806 B2 JP 4509806B2
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JP
Japan
Prior art keywords
ray
package
substrate
chip
detector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005009728A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006202791A5 (enExample
JP2006202791A (ja
Inventor
史章 福岡
拓也 門嶋
健二 麻殖生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Healthcare Manufacturing Ltd
Original Assignee
Hitachi Medical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Medical Corp filed Critical Hitachi Medical Corp
Priority to JP2005009728A priority Critical patent/JP4509806B2/ja
Publication of JP2006202791A publication Critical patent/JP2006202791A/ja
Publication of JP2006202791A5 publication Critical patent/JP2006202791A5/ja
Application granted granted Critical
Publication of JP4509806B2 publication Critical patent/JP4509806B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15182—Fan-in arrangement of the internal vias
    • H01L2924/15184—Fan-in arrangement of the internal vias in different layers of the multilayer substrate

Landscapes

  • Measurement Of Radiation (AREA)
  • Apparatus For Radiation Diagnosis (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2005009728A 2005-01-18 2005-01-18 Ｉｃパッケージ及びそれを用いたｘ線ｃｔ装置 Expired - Fee Related JP4509806B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005009728A JP4509806B2 (ja) 2005-01-18 2005-01-18 Ｉｃパッケージ及びそれを用いたｘ線ｃｔ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005009728A JP4509806B2 (ja) 2005-01-18 2005-01-18 Ｉｃパッケージ及びそれを用いたｘ線ｃｔ装置

Publications (3)

Publication Number Publication Date
JP2006202791A JP2006202791A (ja) 2006-08-03
JP2006202791A5 JP2006202791A5 (enExample) 2008-02-28
JP4509806B2 true JP4509806B2 (ja) 2010-07-21

Family

ID=36960555

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005009728A Expired - Fee Related JP4509806B2 (ja) 2005-01-18 2005-01-18 Ｉｃパッケージ及びそれを用いたｘ線ｃｔ装置

Country Status (1)

Country Link
JP (1) JP4509806B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4365844B2 (ja) * 2006-09-08 2009-11-18 三菱電機株式会社 荷電粒子線の線量分布測定装置
JP2010066109A (ja) 2008-09-10 2010-03-25 Canon Inc 放射線装置
JP5676922B2 (ja) * 2010-05-31 2015-02-25 ジーイー・メディカル・システムズ・グローバル・テクノロジー・カンパニー・エルエルシー Ｘ線検出器モジュールおよびｘ線検出器並びにｘ線ｃｔ装置
CN102639061B (zh) * 2010-10-20 2015-11-25 株式会社东芝 Das检测器以及x射线计算机断层摄影装置
US8575558B2 (en) * 2010-11-30 2013-11-05 General Electric Company Detector array with a through-via interposer
US9012857B2 (en) * 2012-05-07 2015-04-21 Koninklijke Philips N.V. Multi-layer horizontal computed tomography (CT) detector array with at least one thin photosensor array layer disposed between at least two scintillator array layers
JP6631494B2 (ja) * 2016-12-16 2020-01-15 株式会社デンソー 電子装置
EP3462494B1 (en) * 2017-09-29 2021-03-24 Detection Technology OY Integrated radiation detector device
KR102487841B1 (ko) 2018-03-14 2023-01-11 삼성전자주식회사 반도체 패키지

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60106150A (ja) * 1983-11-15 1985-06-11 Nippon Telegr & Teleph Corp <Ntt> 耐放射線パツケ−ジ
JPH03208364A (ja) * 1990-01-10 1991-09-11 Mitsubishi Electric Corp 半導体パッケージ
JP2001511202A (ja) * 1997-01-30 2001-08-07 スペース エレクトロニクス，インコーポレイテッド 放射線遮蔽材をイオン化するための方法及び組成物関連出願のクロスレファレンス
JP2001083255A (ja) * 1999-09-10 2001-03-30 Kyocera Corp Ｘ線検出素子搭載用配線基板
JP4160702B2 (ja) * 1999-09-24 2008-10-08 京セラ株式会社 Ｘ線検出素子搭載用配線基板
US6967390B2 (en) * 2003-02-13 2005-11-22 Freescale Semiconductor, Inc. Electronic component and method of manufacturing same

Also Published As

Publication number Publication date
JP2006202791A (ja) 2006-08-03

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