JP6631494B2 - 電子装置 - Google Patents
電子装置 Download PDFInfo
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- JP6631494B2 JP6631494B2 JP2016244350A JP2016244350A JP6631494B2 JP 6631494 B2 JP6631494 B2 JP 6631494B2 JP 2016244350 A JP2016244350 A JP 2016244350A JP 2016244350 A JP2016244350 A JP 2016244350A JP 6631494 B2 JP6631494 B2 JP 6631494B2
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- circuit
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- chip
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- 229910000679 solder Inorganic materials 0.000 claims description 34
- 238000007689 inspection Methods 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 238000003860 storage Methods 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 229910052745 lead Inorganic materials 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 8
- 230000006870 function Effects 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 239000010949 copper Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- 229910009071 Sn—Zn—Bi Inorganic materials 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Analysing Materials By The Use Of Radiation (AREA)
Description
図1から図3は、第1実施形態に係る電子装置10の概略構成を示す図であり、図1は平面図、図2は図1のAA線に沿う部分の縦断面図、図3は裏面図である。図1から図3に示すように、電子装置10は、ICチップ12、回路基板16、封止樹脂18、はんだボール24、及びシールド26を備えている。
図4は、シールド26を、ICチップ12に使用される多層配線のうち、1層目の配線層42aを回路配線として用い、2層目及び3層目の配線層42b、42cを積層させて基準回路14上に配置するようにして構成し、シールド26としたものである。
次に第2実施形態について図13から図15を参照して説明する。第2実施形態に係る電子装置10が、第1実施形態と異なる点は、シールド26による遮蔽領域28が、電子装置10の端部に配置されている点である。図に示すように、電子装置10端部に配置された遮蔽領域28に、はんだボール24が配置されている例を示しているが、第1実施形態と同様に、遮蔽領域28に、はんだボール24を配置しないように構成してもよい。なお、第2実施形態に係る電子装置10においてはボンディングワイヤ22に代えて貫通電極23によりICチップ12とはんだボール24を電気的に接続している。
(その他の実施形態)
図2又は図4に示すように、シールド26は、図において封止樹脂18内のICチップ12の上方に配置されている例を示して説明したが、これに限定されるものではない。例えば、電子装置10の封止樹脂18の上面に配置してもよい。また、ICチップ12の下方や、電子装置10の裏面に配置してもよいし、上方および下方の両方に配置してもよい。シールド26をICチップ12の下方に配置した場合には、下方からのX線照射に対しても、ICチップ12を遮蔽可能となる。
Claims (10)
- 第1方向に第1面を、前記第1方向に対して反対方向の第2方向に第2面を備える回路基板(16)と、
前記回路基板の前記第1面に設けられるICチップ(12)と、
前記回路基板の前記第2面に設けられる被検査物(24)と、
前記ICチップに配置された基準回路(14)と、
前記ICチップに配置された前記基準回路以外の回路(30、30a、30b、30c、30d)と、
前記基準回路の第1方向側を覆い、前記基準回路以外の回路の前記第1方向側を覆わない、X線を遮蔽可能な遮蔽物(26)と、を備える電子装置(10)。 - 前記遮蔽物を第2方向に投影した領域である遮蔽領域(28)には前記被検査物が配置されない請求項1に記載の電子装置。
- 前記遮蔽領域は、前記回路基板の端部に位置する請求項1又は2に記載の電子装置。
- 前記基準回路は、前記基準回路以外の回路の特性変動を調整するために用いられる回路(32、34、36、38)を含む請求項1から3のいずれか一項に記載の電子装置10。
- 前記基準回路は、X線の照射により特性変動が生じた場合に、当該特性変動を補正しても期待される機能を回復しない回路(32、34、36、38)を含む請求項1から4のいずれか一項に記載の電子装置。
- 前記遮蔽物は金属又は合金を含む請求項1から5のいずれか一項に記載の電子装置。
- 前記金属又は合金は少なくともAl、Cu、W、Ag、Ti、Sn、Pb、Ta、Mo、Ge、Bi、Zn、Mo及びPtのいずれかを含む請求項6に記載の電子装置。
- 前記基準回路は、前記基準回路以外の回路の初期特性を記憶する記憶部(34)と、前記基準回路以外の回路の変動後の特性と初期特性を比較する比較部(32)と、前記比較部での結果を判定して調整信号を生成する判定制御部(38)と、を備える請求項1から7のいずれか一項に記載の電子装置。
- 前記判定制御部で生成された調整信号が入力され、入力された調整信号に基づき前記基準回路以外の回路の特性変動を調整する調整回路(40、40a、40b、40c)を備える請求項8に記載の電子装置。
- 前記被検査物は、はんだボール(24)である請求項1から9に記載の電子装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2016244350A JP6631494B2 (ja) | 2016-12-16 | 2016-12-16 | 電子装置 |
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JP2016244350A JP6631494B2 (ja) | 2016-12-16 | 2016-12-16 | 電子装置 |
Publications (2)
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JP2018098444A JP2018098444A (ja) | 2018-06-21 |
JP6631494B2 true JP6631494B2 (ja) | 2020-01-15 |
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CN114687202B (zh) * | 2022-04-20 | 2023-07-11 | 西安工程大学 | 一种防x射线屏蔽织物及其制备方法和应用 |
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JP4096302B2 (ja) * | 2002-12-16 | 2008-06-04 | ソニー株式会社 | 磁気メモリ装置 |
JP4509806B2 (ja) * | 2005-01-18 | 2010-07-21 | 株式会社日立メディコ | Icパッケージ及びそれを用いたx線ct装置 |
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