CN106664826B - 检查装置及方法和包括其的部件贴装系统及方法 - Google Patents
检查装置及方法和包括其的部件贴装系统及方法 Download PDFInfo
- Publication number
- CN106664826B CN106664826B CN201580042581.8A CN201580042581A CN106664826B CN 106664826 B CN106664826 B CN 106664826B CN 201580042581 A CN201580042581 A CN 201580042581A CN 106664826 B CN106664826 B CN 106664826B
- Authority
- CN
- China
- Prior art keywords
- information
- mounting
- solder
- array substrate
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0817—Monitoring of soldering processes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (14)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140103115A KR20160019564A (ko) | 2014-08-11 | 2014-08-11 | 검사 장치 및 방법과, 이를 포함하는 부품 실장 시스템 및 방법 |
KR10-2014-0103115 | 2014-08-11 | ||
PCT/KR2015/008359 WO2016024778A1 (ko) | 2014-08-11 | 2015-08-10 | 검사 장치 및 방법과, 이를 포함하는 부품 실장 시스템 및 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106664826A CN106664826A (zh) | 2017-05-10 |
CN106664826B true CN106664826B (zh) | 2019-12-17 |
Family
ID=55304349
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201580042581.8A Active CN106664826B (zh) | 2014-08-11 | 2015-08-10 | 检查装置及方法和包括其的部件贴装系统及方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10827661B2 (zh) |
EP (1) | EP3182816A4 (zh) |
KR (1) | KR20160019564A (zh) |
CN (1) | CN106664826B (zh) |
WO (1) | WO2016024778A1 (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6752030B2 (ja) * | 2016-03-11 | 2020-09-09 | 株式会社Fuji | 情報処理装置及び情報処理方法 |
CN107197600B (zh) * | 2017-05-12 | 2019-05-03 | 深圳市路远电子科技有限公司 | 印刷电路板器件的制作方法 |
KR20190084167A (ko) * | 2017-12-21 | 2019-07-16 | 주식회사 고영테크놀러지 | 인쇄 회로 기판 검사 장치, 스크린 프린터의 결함 유형 결정 방법 및 컴퓨터 판독 가능한 기록 매체 |
KR102106349B1 (ko) * | 2017-12-21 | 2020-05-04 | 주식회사 고영테크놀러지 | 인쇄 회로 기판 검사 장치, 솔더 페이스트 이상 감지 방법 및 컴퓨터 판독 가능한 기록 매체 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101419264A (zh) * | 2007-10-24 | 2009-04-29 | Aju高技术公司 | 柔性印刷电路板的制造方法及其检查方法 |
JP2012051152A (ja) * | 2010-08-31 | 2012-03-15 | Hitachi High-Tech Instruments Co Ltd | スクリーン印刷機及びスクリーン印刷方法 |
CN102742380A (zh) * | 2010-02-02 | 2012-10-17 | 株式会社高永科技 | 检测程序的生成方法 |
KR20130121747A (ko) * | 2012-04-27 | 2013-11-06 | 주식회사 고영테크놀러지 | 스크린 프린터 장비의 보정방법 및 이를 이용한 기판 검사시스템 |
WO2013186963A1 (ja) * | 2012-06-11 | 2013-12-19 | パナソニック株式会社 | 電子部品実装システムおよび電子部品実装方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3128891B2 (ja) | 1991-10-09 | 2001-01-29 | 松下電器産業株式会社 | 部品実装方法および部品実装装置 |
JP3685035B2 (ja) | 2000-10-25 | 2005-08-17 | 松下電器産業株式会社 | 電子部品実装システムおよび電子部品実装方法 |
JP2007184498A (ja) | 2006-01-10 | 2007-07-19 | Yamaha Motor Co Ltd | 部品の実装処理方法および部品実装システム |
JP4710772B2 (ja) * | 2006-09-15 | 2011-06-29 | パナソニック株式会社 | 電子部品実装ラインおよび電子部品実装ラインにおける位置管理方法 |
JP4356769B2 (ja) * | 2007-05-22 | 2009-11-04 | パナソニック株式会社 | スクリーン印刷装置およびスクリーン印刷方法 |
JP4367524B2 (ja) | 2007-05-22 | 2009-11-18 | パナソニック株式会社 | 電子部品実装システムおよび電子部品実装方法 |
JP4550909B2 (ja) | 2008-02-13 | 2010-09-22 | シーケーディ株式会社 | 半田印刷検査装置及び部品実装システム |
JP4898753B2 (ja) | 2008-08-26 | 2012-03-21 | ヤマハ発動機株式会社 | 部品実装システム、部品実装方法、基板貼付状態検出装置、動作条件データ作成装置、基板貼付装置、部品搭載装置および検査装置 |
-
2014
- 2014-08-11 KR KR1020140103115A patent/KR20160019564A/ko active Search and Examination
-
2015
- 2015-08-10 CN CN201580042581.8A patent/CN106664826B/zh active Active
- 2015-08-10 WO PCT/KR2015/008359 patent/WO2016024778A1/ko active Application Filing
- 2015-08-10 EP EP15831748.7A patent/EP3182816A4/en active Pending
- 2015-08-10 US US15/503,259 patent/US10827661B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101419264A (zh) * | 2007-10-24 | 2009-04-29 | Aju高技术公司 | 柔性印刷电路板的制造方法及其检查方法 |
CN102742380A (zh) * | 2010-02-02 | 2012-10-17 | 株式会社高永科技 | 检测程序的生成方法 |
JP2012051152A (ja) * | 2010-08-31 | 2012-03-15 | Hitachi High-Tech Instruments Co Ltd | スクリーン印刷機及びスクリーン印刷方法 |
KR20130121747A (ko) * | 2012-04-27 | 2013-11-06 | 주식회사 고영테크놀러지 | 스크린 프린터 장비의 보정방법 및 이를 이용한 기판 검사시스템 |
WO2013186963A1 (ja) * | 2012-06-11 | 2013-12-19 | パナソニック株式会社 | 電子部品実装システムおよび電子部品実装方法 |
Also Published As
Publication number | Publication date |
---|---|
CN106664826A (zh) | 2017-05-10 |
EP3182816A1 (en) | 2017-06-21 |
WO2016024778A1 (ko) | 2016-02-18 |
US10827661B2 (en) | 2020-11-03 |
EP3182816A4 (en) | 2018-05-02 |
KR20160019564A (ko) | 2016-02-22 |
US20170273228A1 (en) | 2017-09-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: 15 / F, 14 / F, No.53, Jiashan digital 2 Road, Jinchuan District, Seoul, Korea Patentee after: Gaoying Technology Co.,Ltd. Address before: 15 / F, 14 / F, No.53, Jiashan digital 2 Road, Jinchuan District, Seoul, Korea Patentee before: KOH YOUNG TECHNOLOGY Inc. |
|
CP01 | Change in the name or title of a patent holder | ||
CP02 | Change in the address of a patent holder |
Address after: Han Guoshouershi Patentee after: Gaoying Technology Co.,Ltd. Address before: 15 / F, 14 / F, No.53, Jiashan digital 2 Road, Jinchuan District, Seoul, Korea Patentee before: Gaoying Technology Co.,Ltd. |
|
CP02 | Change in the address of a patent holder |