JP2010087343A - 基板処理装置及び基板載置方法 - Google Patents

基板処理装置及び基板載置方法 Download PDF

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Publication number
JP2010087343A
JP2010087343A JP2008256300A JP2008256300A JP2010087343A JP 2010087343 A JP2010087343 A JP 2010087343A JP 2008256300 A JP2008256300 A JP 2008256300A JP 2008256300 A JP2008256300 A JP 2008256300A JP 2010087343 A JP2010087343 A JP 2010087343A
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JP
Japan
Prior art keywords
substrate
stage
glass substrate
pin
lift pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008256300A
Other languages
English (en)
Japanese (ja)
Inventor
Manabu Kamatani
学 釜谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Engineering Co Ltd
Original Assignee
Toray Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Engineering Co Ltd filed Critical Toray Engineering Co Ltd
Priority to JP2008256300A priority Critical patent/JP2010087343A/ja
Priority to TW098125462A priority patent/TWI465793B/zh
Priority to KR1020090079717A priority patent/KR20100037534A/ko
Priority to CN200910178723XA priority patent/CN101713924B/zh
Publication of JP2010087343A publication Critical patent/JP2010087343A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Coating Apparatus (AREA)
JP2008256300A 2008-10-01 2008-10-01 基板処理装置及び基板載置方法 Pending JP2010087343A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008256300A JP2010087343A (ja) 2008-10-01 2008-10-01 基板処理装置及び基板載置方法
TW098125462A TWI465793B (zh) 2008-10-01 2009-07-29 Substrate processing device and substrate carrying method
KR1020090079717A KR20100037534A (ko) 2008-10-01 2009-08-27 기판처리장치 및 기판재치방법
CN200910178723XA CN101713924B (zh) 2008-10-01 2009-09-28 基板处理装置及基板载置方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008256300A JP2010087343A (ja) 2008-10-01 2008-10-01 基板処理装置及び基板載置方法

Publications (1)

Publication Number Publication Date
JP2010087343A true JP2010087343A (ja) 2010-04-15

Family

ID=42214713

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008256300A Pending JP2010087343A (ja) 2008-10-01 2008-10-01 基板処理装置及び基板載置方法

Country Status (4)

Country Link
JP (1) JP2010087343A (ko)
KR (1) KR20100037534A (ko)
CN (1) CN101713924B (ko)
TW (1) TWI465793B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016186962A (ja) * 2015-03-27 2016-10-27 東京エレクトロン株式会社 熱処理装置、熱処理における異常検出方法及び読み取り可能なコンピュータ記憶媒体

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI407268B (zh) * 2010-07-28 2013-09-01 Au Optronics Corp 工作台
JP5912403B2 (ja) * 2011-10-21 2016-04-27 東京エレクトロン株式会社 塗布処理装置
CN106164190B (zh) 2014-03-31 2020-05-01 日挥触媒化成株式会社 透明被膜形成用的涂布液及其制造方法、有机树脂分散溶胶、以及带透明被膜的基材及其制造方法
CN106298622B (zh) * 2015-05-28 2019-03-15 沈阳芯源微电子设备有限公司 一种承载翘曲晶圆的装置及其承载方法
JP6516664B2 (ja) * 2015-12-16 2019-05-22 株式会社Ｓｃｒｅｅｎホールディングス 基板保持装置、塗布装置、基板保持方法
TWI825613B (zh) * 2022-03-08 2023-12-11 權亞石材股份有限公司 花崗岩牙叉
TWI812568B (zh) * 2022-12-29 2023-08-11 卓金星 測試裝置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08236604A (ja) * 1994-12-28 1996-09-13 Sumitomo Metal Ind Ltd 静電チャックおよびその使用方法
JP2001319957A (ja) * 2000-05-02 2001-11-16 Tokyo Electron Ltd 基板搬送装置及び基板処理装置
JP2004083182A (ja) * 2002-08-26 2004-03-18 Sharp Corp 基板搬送装置および液晶表示装置の製造方法
JP2004182457A (ja) * 2002-12-06 2004-07-02 Hitachi Printing Solutions Ltd 印刷装置
JP2005310989A (ja) * 2004-04-20 2005-11-04 Hitachi High-Tech Electronics Engineering Co Ltd 基板及びフォトマスクの受け渡し方法、並びに基板及びフォトマスクの受け渡し装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4288694B2 (ja) * 2001-12-20 2009-07-01 株式会社ニコン 基板保持装置、露光装置及びデバイス製造方法
JP4906375B2 (ja) * 2006-03-20 2012-03-28 東京応化工業株式会社 基板支持部材
JP4901323B2 (ja) * 2006-06-20 2012-03-21 東京応化工業株式会社 基板処理装置
JP2008041896A (ja) * 2006-08-04 2008-02-21 Tokyo Electron Ltd 基板検知機構およびそれを用いた基板処理装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08236604A (ja) * 1994-12-28 1996-09-13 Sumitomo Metal Ind Ltd 静電チャックおよびその使用方法
JP2001319957A (ja) * 2000-05-02 2001-11-16 Tokyo Electron Ltd 基板搬送装置及び基板処理装置
JP2004083182A (ja) * 2002-08-26 2004-03-18 Sharp Corp 基板搬送装置および液晶表示装置の製造方法
JP2004182457A (ja) * 2002-12-06 2004-07-02 Hitachi Printing Solutions Ltd 印刷装置
JP2005310989A (ja) * 2004-04-20 2005-11-04 Hitachi High-Tech Electronics Engineering Co Ltd 基板及びフォトマスクの受け渡し方法、並びに基板及びフォトマスクの受け渡し装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016186962A (ja) * 2015-03-27 2016-10-27 東京エレクトロン株式会社 熱処理装置、熱処理における異常検出方法及び読み取り可能なコンピュータ記憶媒体
TWI643246B (zh) * 2015-03-27 2018-12-01 日商東京威力科創股份有限公司 Heat treatment device, abnormality detection method in heat treatment, and readable computer memory medium

Also Published As

Publication number Publication date
TWI465793B (zh) 2014-12-21
CN101713924B (zh) 2012-09-26
CN101713924A (zh) 2010-05-26
KR20100037534A (ko) 2010-04-09
TW201015147A (en) 2010-04-16

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