TW201015147A - Substrate processing apparatus and substrate carrying method - Google Patents

Substrate processing apparatus and substrate carrying method Download PDF

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Publication number
TW201015147A
TW201015147A TW098125462A TW98125462A TW201015147A TW 201015147 A TW201015147 A TW 201015147A TW 098125462 A TW098125462 A TW 098125462A TW 98125462 A TW98125462 A TW 98125462A TW 201015147 A TW201015147 A TW 201015147A
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TW
Taiwan
Prior art keywords
substrate
glass substrate
pin
platform
ejector pin
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TW098125462A
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Chinese (zh)
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TWI465793B (en
Inventor
Manabu Kamatani
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Toray Eng Co Ltd
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Priority to JP2008256300A priority Critical patent/JP2010087343A/en
Application filed by Toray Eng Co Ltd filed Critical Toray Eng Co Ltd
Publication of TW201015147A publication Critical patent/TW201015147A/en
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Publication of TWI465793B publication Critical patent/TWI465793B/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70691Handling of masks or wafers
    • G03F7/70716Stages
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70691Handling of masks or wafers
    • G03F7/70758Drive means, e.g. actuator, motor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70691Handling of masks or wafers
    • G03F7/70775Position control
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/708Construction of apparatus, e.g. environment, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709Vibration, e.g. vibration detection, compensation, suppression

Abstract

To shorten operation time and increase productivity of a substrate processing apparatus by employing a platform to carry out ascending or descending movement so that the installed lift-pin can carry a to-be-processed substrate on the platform. A substrate processing apparatus (1) includes: a platform (3) for carrying a substrate (K), which is installed to carry out ascending or descending movement via through holes (33) formed on the platform. The tip end of the lift-pin (41) can be used to support the substrate. Driving and controlling the lift-pin would carry the substrate which is supplied to moving-in position (P2) above the platform to the pin-driving control part (43,10) of the platform, in which the pin-driving control part carries out driving and controlling so as to ascend the lift-pin and use its tip end to support the substrate at the moving-in position and keep it at the position (P3) higher than the moving-in position, after then the substrate is carried to the platform by lowering down the lift-pin.

Description

201015147 四、 指定代表圖: (一)本案指定代表圖為:第( 8 )圖。 •(二)本代表圖之元件符號簡單說明: 1 :開縫喷嘴塗佈機(基板處理裝置) 3:吸附平台(平台) 9:基板運送機械手臂 1 0 :控制裝置(銷驅動控制部) 3 1 :承載面 41 :頂出銷 ® 6 0 :開縫喷嘴 93:機械手 K:基板 ' P1 :退避位置 - P 2 :搬進位置 P3 :基板待機位置(比搬進位置高的位置) 五、 本案若有化學式時,請揭示最能顯示發明特 参徵的化學式: 六、 發明說明: • 【發明所屬之技術領域】 本發明是關於保持基板(substrate)於平台(stage) 上,對該被保持的基板進行預定的處理之基板處理裝置及 該基板處理裝置中的基板承載方法。特別是關於透過可由 平台進行升降動作而被配設之頂出銷(1 i f t p i η)進行基板 2 201015147 之承載於平台上之基板處理裝置及該基板處理裝置中的基 板承載方法。基板例如可舉出玻璃基板和半導體晶圓。 【先前技術】 保持基板於平台上,對該被保持的被處理基板進行預定 的處理之基板處理裝置的例子有使用於液晶面板的製造的 裝置之一的開縫喷嘴塗佈機(si i t_nozzle coater)。開縫 喷嘴塗佈機是為形成彩色濾光片(color filter)或 ❹ TFT(Thin-Film Transistor:薄膜電晶體)於玻璃基板而塗 佈光阻(pho tores ist)液於玻璃基板的表面而構成(參照專 利文獻1)。 - 參照圖1 〇,針對習知的開縫喷嘴塗佈機1 0 0的處理動 - 作的概要來說明。此外’針對圖1 0所示的開縫噴嘴塗佈機 1 〇〇的構成要素之中與後述的本發明的一實施形態的開縫 喷嘴塗佈機1同一的構成要素是附加與該等構成要素同一 符號。如圖10(A)所示,習知的開縫喷嘴塗佈機1〇〇具備 ❹吸附平台3、頂出銷41A、開縫喷嘴(siit nozzle)6〇及控 制裝置l〇A等,藉由具備機械手(r〇b〇t hand)93的基板運 ^ 送機械手臂9進行玻璃基板K的遞送。 假設習知的開縫喷嘴塗佈機1 0 0處於圖1 〇 (A)的初私 狀態。亦即’頂出銷41A為埋沒於吸附平台3的下方的狀 態’機械手93在支撐玻璃基板K的狀態下位於退避位复 Pl。以下針對各步驟依序說明。圖中,反白的箭頭是表示機 械手93的動作方向,黑色的粗箭頭是表示頂出銷41A的動 3 201015147 作方向。 [玻璃基板接受步驟] 由圖10(A)的狀態’首先基板運送機械手臂9驅動機 械手93於水平方向,將玻璃基板κ供給至搬進位置P2a (參 照圖10(B))。搬進位置P2a為吸附平台3的上方位置。接 著’控制裝置1 0 A使頂出銷41A上升至規定位置(參照圖 10(C))。接著’基板運送機械手臂9使支撐玻璃基板κ的 機械手93下降’使玻璃基板K的背面抵接頂出銷41A的尖 @ 端部(參照圖1 0 ( D ))。 在玻璃基板K抵接頂出銷41A後機械手93也繼續下 降,在玻璃基板K與機械手93分離規定間隔D的時間點, - 基板運送機械手臂9使機械手93的下降停止(參照圖 10(E))。接著,基板運送機械手臂9驅動機械手93於水平 方向,使其移動至退避位置P1 (參照圖1 0 (F ))。接著,在 控制裝置10A使支撐玻璃基板K的頂出銷41A下降,將域; 璃基板K承載於吸附平台3上後,依照需要進行玻璃基板κ φ 的定位,接著,將玻璃基板Κ真空吸附於吸附平台3 (參照 圖10(G))。吸附完了後,藉由開缝喷嘴60的移動開始塗佈 - (參照圖10(H))。 [玻璃基板傳遞步驟] Λ 塗佈結束後,玻璃基板Κ的傳遞基本上是以上述的玻 璃基板接受步驟的相反的程序進行。亦即,以如下的順序 進行:被吸附保持於吸附平台3的玻璃基板Κ的真空吸附的 解除、利用頂出銷41Α進行之玻璃基板Κ的支撐上升、機 4 201015147 械手93之進入搬進位置P2a、機械手93的上升、 _ 41A的下降以及利用機械手93進行之玻璃基板κ的 退避。 [專利文獻1 ]日本國特開2008_55322號公報 【發明内容】 在習知的開縫喷嘴塗佈機1〇〇中,正當透過頂出 承載玻璃基板K於吸附平台3上時機械手93下降, φ基板〖與頂出銷41A的尖端部抵接時的機械手93的 度被设定為非常慢的值。其理由是為了防止因玻璃 的背面抵接頂出銷41A的尖端部時的碰撞使玻璃基 •生缺陷或裂痕。而且,由於機械手93 —般重量很重 限的空間中其升降速度的高速化很困難。 但是’伴隨液晶面板的用途擴大與普及,液晶 生產擴大的要求增加。因此’開缝喷嘴塗佈機中的 間(tact time)的縮短化為重要的課題。此課題當然 〇縫喷嘴塗佈機所特有的。例如在使用於液晶面板的 曝光裝置、洗淨裝置、乾燥裝置及檢查襄置中也適 - 且’在液晶面板以外凡是利用基板運送機器人進行 * 遞送之基板處理裝置全般都適用,其解決被盼望。 乃是鑒於這種問題所進行的創作,其目的為提供一 處理裝置,透過可由平台進行升降動作而被配設之 進行被處理基板之承載於平台上,可謀求作業時間 化,可提高生產效率。 頂出銷 支撐、 銷41A 且玻璃 下降速 基板K 板K產 ,在有 面板的 作業時 不是開 製造之 用。而 基板的 本發明 種基板 頂出銷 的縮短 5 201015147 上述目的是藉由下述的本發明達成。此外,在[申請專 _ 利範圍]及本[發明内容]欄中附加於各構成要素的加括號 的符號是表示與在後述的實施方式記載的具體的手段 (means)對應的關係。 申請專利範圍第1項的發明是一種基板處理裝置 (1)’包含:承載基板(K)之平台(3);可由形成於平台(3) 的貫通孔(33)進行升降動作而被配設,且可藉由尖端部支 撐基板(K)之頂出銷(41);驅動控制頂出銷(41),俾將供給 ❹至平台(3)的上方的搬進位置(P2)的基板(κ)承載於平台(3) 上之銷驅動控制部(43、10),其特徵為:銷驅動控制部(43、 1 0 )進行驅動控制,俾在藉由使頂出銷(4丨)上升,以其尖端 -部支撐位於搬進位置(Ρ2)的基板(Κ),將其保持在比搬進位 -置(Ρ2)咼的位置(Ρ3)後,藉由使頂出銷(41)下降,以承載 於平台(3)上。 依照申請專利範圍第Μ的發明,在藉由使頂出銷⑷)201015147 IV. Designated representative map: (1) The representative representative of the case is: (8). • (2) A brief description of the component symbols in this representative drawing: 1 : Slotted nozzle coating machine (substrate processing device) 3: Adsorption platform (platform) 9: Substrate transfer robot 1 0 : Control device (pin drive control unit) 3 1 : Bearing surface 41 : Eject pin ® 6 0 : Slot nozzle 93 : Robot K : Substrate ' P1 : Retracted position - P 2 : Carry-in position P3 : Substrate standby position (position higher than the loading position) 5. If there is a chemical formula in this case, please disclose the chemical formula that best shows the special characteristics of the invention: 6. Description of the invention: • Technical field of the invention The present invention relates to a substrate held on a stage, A substrate processing apparatus for performing predetermined processing on the held substrate and a substrate carrying method in the substrate processing apparatus. In particular, a substrate processing apparatus for carrying a substrate 2 201015147 on a substrate through an ejection pin (1 i f t p i η) disposed by a lifting operation of a platform, and a substrate carrying method in the substrate processing apparatus. Examples of the substrate include a glass substrate and a semiconductor wafer. [Prior Art] An example of a substrate processing apparatus that holds a substrate on a stage and performs predetermined processing on the substrate to be processed is a slit nozzle coater (si i t_nozzle) which is one of devices for manufacturing a liquid crystal panel. Coater). The slit nozzle coater applies a color filter or a TFT (Thin-Film Transistor) to a glass substrate to apply a photoresist (pho tores ist) liquid to the surface of the glass substrate. Configuration (refer to Patent Document 1). - The outline of the processing of the conventional slit nozzle coater 100 will be described with reference to Fig. 1 . In addition, among the components of the slit nozzle coater 1 shown in FIG. 10, the same components as the slit nozzle coater 1 of the embodiment of the present invention to be described later are added to the components. The same symbol of the element. As shown in FIG. 10(A), the conventional slit nozzle coater 1 is provided with a sputum adsorption platform 3, an ejector pin 41A, a slit nozzle 6 〇, and a control device 10A, etc. The delivery of the glass substrate K is performed by the substrate transport robot 9 having a robot (r〇b〇t hand) 93. It is assumed that the conventional slit nozzle coater 100 is in the initial private state of Fig. 1 (A). In other words, the ejector pin 41A is buried under the adsorption stage 3, and the robot 93 is located at the retracted position P1 while supporting the glass substrate K. The following is a description of each step. In the figure, the reversed white arrow indicates the direction of movement of the robot hand 93, and the black thick arrow indicates the direction of the movement of the ejector pin 41A. [Glass substrate receiving step] In the state of Fig. 10(A), first, the substrate transport robot 9 drives the robot hand 93 in the horizontal direction, and the glass substrate κ is supplied to the carry-in position P2a (refer to Fig. 10(B)). The loading position P2a is an upper position of the adsorption platform 3. Then, the control device 10A raises the ejector pin 41A to a predetermined position (see Fig. 10(C)). Then, the substrate transport robot 9 lowers the robot 93 supporting the glass substrate κ. The back surface of the glass substrate K is brought into contact with the tip end of the ejector pin 41A (see Fig. 10 (D)). After the glass substrate K abuts the ejector pin 41A, the robot 93 continues to descend, and when the glass substrate K and the robot 93 are separated by a predetermined interval D, the substrate transport robot 9 stops the lowering of the robot 93 (refer to the figure). 10(E)). Next, the substrate transport robot 9 drives the robot 93 in the horizontal direction to move to the retracted position P1 (see Fig. 10 (F)). Next, the control device 10A lowers the ejector pin 41A supporting the glass substrate K, and after the glass substrate K is placed on the adsorption stage 3, the glass substrate κ φ is positioned as needed, and then the glass substrate is vacuum-adsorbed. On the adsorption platform 3 (refer to Fig. 10 (G)). After the adsorption is completed, the coating is started by the movement of the slit nozzle 60 (refer to Fig. 10 (H)). [Glass substrate transfer step] 后 After the application is completed, the transfer of the glass substrate 基本上 is basically carried out in the reverse procedure of the above-described glass substrate receiving step. In other words, the vacuum adsorption of the glass substrate 吸附 adsorbed and held by the adsorption stage 3 is released, the support of the glass substrate 利用 by the ejector pin 41 上升 is raised, and the movement of the machine 4 201015147 is entered. The position P2a, the rise of the robot 93, the fall of _41A, and the retraction of the glass substrate κ by the robot 93. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2008-55322 [Summary of the Invention] In the conventional slit nozzle coater 1A, the robot 93 is lowered when the load bearing glass substrate K is ejected onto the adsorption platform 3. The degree of the robot 93 when the φ substrate abuts against the tip end portion of the ejector pin 41A is set to a very slow value. The reason for this is to prevent the glass base from being defective or cracked by the collision when the back surface of the glass abuts against the tip end portion of the ejector pin 41A. Further, it is difficult to increase the speed of the lifting and lowering of the space in which the weight of the robot 93 is extremely heavy. However, as the use of liquid crystal panels has expanded and spread, the demand for liquid crystal production has increased. Therefore, the shortening of the tact time in the slit nozzle coater is an important issue. This subject is of course unique to the quilting nozzle coater. For example, it is suitable for use in an exposure apparatus, a cleaning apparatus, a drying apparatus, and an inspection apparatus for a liquid crystal panel, and a substrate processing apparatus that performs *delivery by a substrate transport robot other than a liquid crystal panel is generally applicable, and its solution is expected . In view of the above-mentioned problems, the object of the present invention is to provide a processing device for carrying a substrate to be processed on a platform by being lifted and lowered by a platform, thereby realizing work time and improving production efficiency. . The ejector pin support, the pin 41A, and the glass descent speed substrate K plate K are not used for manufacturing in the case of a panel. Further, the substrate ejector pin of the present invention is shortened 5 201015147 The above object is achieved by the present invention described below. In addition, the bracketed symbols attached to the respective constituent elements in the column of the "application specific area" and the "contents of the present invention" indicate the relationship with the specific means (means) described in the embodiment to be described later. The invention of claim 1 is a substrate processing apparatus (1)' comprising: a platform (3) carrying a substrate (K); and being disposed by a through hole (33) formed in the stage (3) And the ejector pin (41) of the substrate (K) can be supported by the tip end; the ejector pin (41) is driven to be driven, and the substrate is fed to the loading position (P2) above the platform (3) ( κ) a pin drive control unit (43, 10) carried on the platform (3), characterized in that the pin drive control unit (43, 10) performs drive control, by ejector pin (4丨) Raise, support the substrate (Κ) at the loading position (Ρ2) with its tip end, and hold it at a position (Ρ3) than the loading position - (Ρ2) , by making the ejector pin (41) Drop to be carried on the platform (3). According to the invention of the third application patent, by making the ejector pin (4)
即可,該部分可謀求作業時間的縮短化 # 9的動作步驟少 可提高生產效率。 頂出銷(41)包含: I生的碰撞之緩衝 在申請專利範圍第2項的發明中,] 在其尖端抵接基板(Κ)時吸收在基板(]〇產 機構(44)。 6 201015147 依照申凊專利範圍第2項的發明,因緩衝機構(4 4 )在 ,頂出銷(41)抵接基板〇〇時發揮緩衝(cushi〇n)作用,故基 板(K)由頂出銷(41)的尖端部接受的碰撞被緩和、吸收。因 此’可抑制基板(K)產生缺陷或裂痕。 而且,申請專利範圍第3項的發明是一種基板承載方 法,是在包含如下構件的基板處理裝置(1)中,將供給至平 台(3)的上方的搬進位置(p2)的基板(κ)承載於平台上: 承載基板(Κ)之平台(3);可由形成於前述平台(3)的貫通孔 ❹(33)進行升降動作而被配設,且可藉由尖端部支撐基板(κ) 之頂出銷(41),其特徵為:在藉由使前述頂出銷(41)上升, 以其尖端部支撐位於搬進位置(ρ2)的基板(κ),將其保持在 比刚述搬進位置(Ρ2)高的位置(ρ3)後,藉由使頂出銷(4〇 -下降,以承載於平台(3)上。 【發明的功效】 依照本發明,一種基板處理裝置,透過可由平台進行 ❹升降動作而被配設之頂出銷進行被處理基板之承載於平台 上了謀求作業時間的縮短化,可提高生產效率。 【實施方式] 、下邊參照添附圖面,一邊針對本發明的實施形態來 1 田 疋與本發明有關的開縫喷嘴塗佈機1之外觀斜 視圖’圖2是吸附平台3及定心單元(centering un⑴5 卜觀斜視圖’圖3是頂出銷單元4之構成概略圖,圖4 7 201015147 是顯示緩衝機構44的詳細之正面剖面圖,圖5是開缝喷嘴 6 0之侧面一部分剖面圖,圖6是洗淨單元8之外觀斜視圖, 圖9是顯示緩衝機構44的作用之圖。在圖9中,A圖是顯 示頂出銷41的尖端部未抵接玻璃基板K時的狀態,B圖是 顯示頂出銷41的尖端部剛抵接玻璃基板K後的狀態’ C圖 是顯示頂出銷41的尖端部抵接玻璃基板K並支撐該玻璃基 板K的狀態。在各圖中以正交座標系的3軸為χ、γ、ζ, 以ΧΥ平面為水平面,以Ζ方向為鉛直方向。而且,需更進 ❿一步區別ΧΥ各方向的方向成左右而說明的情形有在最前 頭附加[+ ]或[-]的符號。 如圖1所示,與本發明有關的開縫喷嘴塗佈 機台2、吸附平台3、頂出銷單元4、定心單元5、塗佈單 元6、塗佈液供給部7、洗淨單元8及控制裝置1〇等,將 彩色濾光片形成用的光阻液2〇塗佈於玻璃基板1[的表面而 構成而且,玻璃基板Κ之遞送至吸附平台3是藉由具備 機械手93的基板運送機械手臂g進行。 ❹ 機台2是當作支撐開縫喷嘴塗佈機】的主構成部(例如 :附平台3或塗佈單元6)的底座而發揮功能,藉由石材構 度地柚糾# @ 呆充刀的剛性和平面精度,且最小限 度地抑制伴隨溫度變化 岩(granite)。 ^特別是較佳的石材為花崗 吸附平台3如圖2所示且古 佈對象的玻璃基板K之承載:J載成為光阻液20的塗 樣是以石材構成。在承栽面冑吸附平台3與機台2一 穿设有複數個真空吸附孔In this part, it is possible to shorten the working time. #9 The number of operating steps is small, and the production efficiency can be improved. The ejector pin (41) includes: I. The impact buffer of the collision is in the invention of claim 2, and is absorbed in the substrate (44) when the tip abuts against the substrate (Κ). 6 201015147 According to the invention of claim 2, since the buffer mechanism (4 4 ) functions as a buffer when the ejector pin (41) abuts against the substrate ,, the substrate (K) is ejector pin. The collision received by the tip end portion of (41) is alleviated and absorbed. Therefore, it is possible to suppress the occurrence of defects or cracks in the substrate (K). Moreover, the invention of claim 3 is a substrate carrying method, which is a substrate including the following members. In the processing device (1), the substrate (κ) supplied to the loading position (p2) above the platform (3) is carried on the platform: a platform (3) carrying the substrate (Κ); may be formed on the aforementioned platform ( The through hole ❹ (33) of 3) is arranged to be lifted and lowered, and the ejector pin (41) of the substrate (κ) is supported by the tip end portion, characterized in that the ejector pin (41) is provided by Rise, support the substrate (κ) at the loading position (ρ2) with its tip end, and keep it in Immediately after the position (ρ3) at which the loading position (Ρ2) is high, the ejector pin (4〇-lowering is carried on the platform (3). [Effect of the Invention] According to the present invention, a substrate processing apparatus The ejector pin that is disposed by the platform to perform the hoisting and lowering operation is carried on the platform, and the working time is shortened, thereby improving the production efficiency. [Embodiment] Embodiment 1 of the present invention is a perspective view of a slit nozzle coater 1 relating to the present invention. FIG. 2 is an adsorption platform 3 and a centering unit (centering un(1)5 oblique view' FIG. 3 is an ejection FIG. 4 is a front cross-sectional view showing the buffer mechanism 44, FIG. 5 is a partial cross-sectional view of the side surface of the slit nozzle 60, and FIG. 6 is an external perspective view of the cleaning unit 8. Fig. 9 is a view showing the action of the buffer mechanism 44. In Fig. 9, A is a view showing a state in which the tip end portion of the ejector pin 41 is not in contact with the glass substrate K, and Fig. B is a view showing the tip end portion of the ejector pin 41. The state after the glass substrate K is abutted C is a state in which the tip end portion of the ejector pin 41 abuts against the glass substrate K and supports the glass substrate K. In each of the figures, the three axes of the orthogonal coordinate system are χ, γ, ζ, and the ΧΥ plane is a horizontal plane. The direction of the Ζ is the vertical direction. Moreover, it is necessary to further distinguish the direction of each direction into the left and right, and the symbol of [+] or [-] is added at the forefront. As shown in Fig. 1, the present invention The slit nozzle coating machine 2, the suction platform 3, the ejector pin unit 4, the centering unit 5, the coating unit 6, the coating liquid supply unit 7, the cleaning unit 8, and the control device 1 will be The photoresist liquid for forming a color filter is applied to the surface of the glass substrate 1 and the glass substrate is transported to the adsorption stage 3 by the substrate transport robot g provided with the robot 93. ❹ The machine 2 functions as a base for supporting the main component of the slot nozzle coater (for example, the platform 3 or the coating unit 6), and the structure of the stone is made by the stone. Rigidity and plane accuracy, and minimally inhibiting the granite accompanying temperature changes. ^ In particular, the preferred stone material is the granitic adsorption platform 3 as shown in Fig. 2 and the glass substrate K of the ancient object is carried: the coating of the J-loaded photoresist 20 is made of stone. In the bearing surface, the adsorption platform 3 and the machine table 2 are provided with a plurality of vacuum adsorption holes.
S 201015147 32與複數個頂出銷孔33。真空吸附孔32為在承载面31 上分散配置複數個成平面視格子狀之微細孔,省略圖示, 藉由真空泵(vacuum pump)等的真空產生手段在微細孔内 產生負壓。頂出銷孔33是在與真空吸附孔32分離規定間 隔的狀態下,在承載面31上分散配置複數個成平面視格子 狀。接著敘述的頂出銷41可由各頂出銷孔33出沒。S 201015147 32 and a plurality of ejector pin holes 33. In the vacuum suction hole 32, a plurality of fine holes which are formed in a lattice shape in a plan view are dispersedly disposed on the bearing surface 31, and a vacuum is generated in the fine holes by a vacuum generating means such as a vacuum pump. In the state in which the ejector pin hole 33 is separated from the vacuum suction hole 32 by a predetermined interval, a plurality of planar lattices are arranged in a distributed manner on the bearing surface 31. The ejector pin 41, which will be described later, can be ejected from each of the ejector pin holes 33.
❹ 頂出銷單元4是進行塗佈對象的玻璃基板1(的接受及 塗佈凡了的玻璃基板κ的傳遞之部位。頂出銷單元4如圖 3所示具備:複數根頂出銷41、銷框架(pin卜錢6)42及框 架驅動。p 43 #。這種頂出銷單元4可藉由框架驅動部43 使銷框架42料驅動,㈣成於吸附^ 3㈣出銷孔 33進行頂出銷41的升降動作。 頂出銷41是藉由其尖端部抵接玻璃基板K並可支撐該 破璃基板K之銷構件。針對其詳細是於後述。 銷框架42是用以安裝複數根頂出銷41之框架構件。 :體上’銷框架42是沿著頂出銷孔Μ的排列被配設,在 對應頂出銷孔33的位置安裝有頂㈣41。據此,一使銷 ^架42升降驅動’頂出銷41就可由頂出銷孔出沒。此 永W具有銷框架孔421(參照圖4),頂 出銷4 1被安裝於該銷框架孔42 i。 框架驅動部 43县林 走升降驅動銷框架42而構成,具備: ^^#(ball screw)^ 431. ^ m 4 ϋ (servo m〇tor)432 珠螺帽(bal 1 nut)433。具體上,滾珠螺帽433被安裝 ;框架42 ’並且被螺合於滾珠螺桿軸43}。滾珠螺桿轴 9 201015147 431是沿著Z軸被配設。伺服馬達432被安裝於滾珠螺桿軸 431,俾繞其軸線旋轉驅動滾珠螺桿軸431。因此,藉由透 過伺服馬達432使滾珠螺桿轴431旋轉驅動,可使滾珠螺帽 433進退移動於Z方向。據此,可使銷框架42進行升降動 作於Z方向。 針對頂出銷41詳述。頂出銷41如圖4所示,具有銷 上端部41S與銷基部41p 、 銷上端部41S為可插通頂出銷孔33的部位。銷上端部 ❹41S被製作成比頂出銷孔33的内徑細的尺寸之粗度,其尖 端部被製作成尖端尖銳狀。而且,在其下部形成有連結於 銷基部41H用的陽螺旋41a。 . 鎖基部41H是用以垂直地支撐銷上端部41S的部位, .連結於銷上端部41S的下部。銷基部41H具有安裝部44A 與緩衝機構44。具體上,銷基部41H具有連結桿23,在連 結桿2 3配設有安裝部4 4 A與緩衝機構4 4。 連結桿23具備:圓柱狀的徑大部231;與該徑大部231 Ο同心’且延設於其軸線方向下方的徑小部2 3 2。徑大部2 3 j 在上部具備沿著其中心轴線的陰螺紋孔23b丨。藉由使銷上 • 端部41S的陽螺旋41a螺合於陰螺紋孔23bl,使鎖上端部 -41S被連結於連結桿2 3。而且,後小部2 3 2在下部具備产 著其中心軸的陰螺紋孔23b。在該陰螺紋孔23b螺合有用 以安裝下部墊圈(washer)29的螺检(b〇lt)27。 安裝部44A是對銷框架42維持垂直姿勢而安装鎖上端 部41S的部位。具體上,徑小部232是在嵌裝中空的圓筒 10 201015147 軸環(collar)26的狀態下被插通於框架孔421。圓筒軸環 26的上端抵接上部墊圈28,並且圓筒軸環26的下端抵接 下部墊圈29 ’下部墊圈29是藉由螺栓2?固定於上述徑小 部232。因此,嵌裝圓筒轴環26的徑小部232就會在上部 墊圈28與下部墊圈29之間維持垂直姿勢地被安裝,銷上 端部41S可對銷框架42維持垂直姿勢。 ❹The ejector pin unit 4 is a portion for receiving and coating the glass substrate 1 to be coated. The ejector pin unit 4 is provided with a plurality of ejector pins 41 as shown in FIG. , pin frame (pin 2) 42 and frame drive. p 43 #. This ejector pin unit 4 can be driven by the frame driving portion 43 to drive the pin frame 42 and (4) to be formed in the suction hole 3 (four) pin hole 33 The ejector pin 41 is a pin member that abuts against the glass substrate K by its tip end portion and can support the glass substrate K. The details thereof will be described later. The pin frame 42 is for mounting a plurality of pins. The frame member of the root ejector pin 41. The body 'pin frame 42 is disposed along the arrangement of the ejector pin holes ,, and the top (four) 41 is attached at a position corresponding to the ejector pin hole 33. Accordingly, a pin is provided The frame 42 lifting drive 'ejection pin 41 can be detached from the ejector pin hole. This permanent W has a pin frame hole 421 (refer to FIG. 4) to which the ejector pin 41 is mounted. The 43-country forest walks up and down the drive pin frame 42 and has: ^^#(ball screw)^ 431. ^ m 4 ϋ (servo m〇tor) 432 bead nut (bal 1 nut) 433. Specifically, the ball nut 433 is mounted; the frame 42' is screwed to the ball screw shaft 43}. The ball screw shaft 9 201015147 431 is disposed along the Z axis. The servo motor 432 is mounted on The ball screw shaft 431 rotates around the axis to drive the ball screw shaft 431. Therefore, by rotating the ball screw shaft 431 through the servo motor 432, the ball nut 433 can be moved forward and backward in the Z direction. The frame 42 is moved up and down in the Z direction. The ejector pin 41 is detailed. As shown in Fig. 4, the ejector pin 41 has a pin upper end portion 41S and a pin base portion 41p, and the pin upper end portion 41S is a detachable ejector pin hole 33. The pin upper end portion 41S is formed to have a smaller thickness than the inner diameter of the ejector pin hole 33, and the tip end portion is formed to have a sharp pointed end. Further, a lower end portion is formed to be coupled to the pin base portion 41H. The male base 41H is a portion for vertically supporting the pin upper end portion 41S, and is coupled to the lower portion of the pin upper end portion 41S. The pin base portion 41H has a mounting portion 44A and a buffer mechanism 44. Specifically, the pin base portion 41H has Connecting rod 23 is disposed at connecting rod 2 3 There are a mounting portion 4 4 A and a buffer mechanism 44. The connecting rod 23 includes a cylindrical large diameter portion 231, and a small diameter portion 23 2 that is concentric with the large diameter portion 231 and extends downward in the axial direction. The large diameter portion 2 3 j has a female screw hole 23b 沿着 along the center axis thereof at the upper portion. By screwing the male screw 41a of the pin end portion 41S to the female screw hole 23bl, the locking end portion -41S is Connected to the connecting rod 2 3 . Further, the rear small portion 213 has a female screw hole 23b for producing a central axis at the lower portion. A thread check (b〇lt) 27 for attaching a lower washer 29 is screwed into the female screw hole 23b. The mounting portion 44A is a portion where the pin frame 42 is maintained in a vertical posture and the upper end portion 41S is attached. Specifically, the small diameter portion 232 is inserted into the frame hole 421 in a state in which the hollow cylinder 10 201015147 collar 26 is fitted. The upper end of the cylindrical collar 26 abuts the upper washer 28, and the lower end of the cylindrical collar 26 abuts against the lower washer 29'. The lower washer 29 is fixed to the small diameter portion 232 by bolts 2?. Therefore, the small diameter portion 232 of the fitting cylindrical collar 26 is mounted in a vertical posture between the upper washer 28 and the lower washer 29, and the pin upper end portion 41S can maintain the vertical posture of the pin frame 42. ❹
缓衝機構44為在頂出銷41的尖端部抵接玻璃基板κ 時&揮緩衝作用的機構。具體上,具有螺旋彈簧(coil SPring)25、彈簧收容筒24及鎖緊螺帽(lock nut)22。在 緩衝機構44中彈簧收容筒24具備用以收容螺旋彈簧25The buffer mechanism 44 is a mechanism that acts on the glass substrate κ when the tip end portion of the ejector pin 41 abuts. Specifically, it has a coil spring 25, a spring receiving cylinder 24, and a lock nut 22. The spring housing tube 24 is provided in the buffer mechanism 44 to accommodate the coil spring 25
的内部空間。而 2gg^:|JU^AA· Ct A 向且,彈簧收谷筒24具有可與連結桿23的 陽螺旋仏螺合的陰螺紋24b,藉由陽螺旋23a與陰螺紋 24b的累。而與連結桿23 -體化。鎖緊螺if 22是於在彈 簧收容筒24沾 : 的上部抵接彈簧收容筒24的狀態下被螺合於 連、才干23的陽螺旋23a。藉由該鎖緊螺帽22限制彈簧收 容筒24朝上下方向移動。 «彈簧U是在被收容於彈簧收容筒24的狀態下裝 設於連結桿23的徑小部232之中與徑大部231的根侧。具 體上螺旋彈簧25是在其上端部抵接徑大部231且其下端 部抵接上部墊圈28,比自然長度收縮的狀態下被配設。因 此,因徑大部? 』±a L i &上 231朝上被推迫並且上部墊圈28朝 迫故在彈簧收容筒24與上部墊圈28之間形成有間隙L。 據此1出銷41的尖端部抵接玻璃基板κ並在連 下降時螺旋彈簧2 5收縮,可發揮緩衝作用。 201015147 亦即’伴隨頂出銷41的尖端部一抵接玻璃基板κ,連 結桿23就由圖9(A)的狀態下降,螺旋彈簧25收縮。此時, 圓筒轴環26、下部墊圈29及螺栓27與連結桿23 —起下 降。亦即’因下部墊圈29藉由螺栓27 —體地被安裝於上 述徑小部2 3 2,故隨著徑小部2 3 2的下降,圓筒軸環2 6及 下部墊圈29下降。因此,變成圓筒軸環26離開上部塾圈 28 ’下部墊圈29離開銷框架42的狀態(圖9(B))。 而且’在頂出銷4 1的下方位置配設有用以檢測玻璃基 ❹板Κ的支撐之感測器(sensor)45。感測器45如圖4所示由 具備透過緊壓接通(on)而輸出接通信號SG1的開關部451 之微動開關(microswitch)構成,透過托架(bracket)452 • 安裝於銷框架42的下部。其安裝位置位於螺栓27的下方, . 具有距螺栓27比上述間隙L的距離短的距離。 亦即,在頂出銷41的尖端部抵接玻璃基板κ後,伴隨 由圖9 (B )的狀態連結桿2 3更下.降,圓筒轴環2 6、下部整 圈29及螺栓27 —下降,如圖9(C)’藉由螺栓27按壓開 ❹關部4 51 ’開關部4 5 1就輸出接通信號S G1。該接通信號 S G1被取入後述的控制裝置1 〇。此外,這種感測器45對各 •頂出銷41各配設一個也可以’惟僅對特定的一部分的頂出 .銷41配设’以檢測玻璃基板κ的支撑也可以。而且,此時 螺旋彈菁25由圖9(B)的狀態更收縮,彈簧收容筒24與上 部墊圈28的間隙L消失。據此,彈簧收容筒24與上部墊 圈28抵接。其結果,玻璃基板κ的負載藉由銷框架42支 撐。 201015147 此外,用以檢測玻璃基板κ的支撐之手段除了藉由如 上述的緊壓接通的類型之感測器45外,例如也能使用透射 良光電]關反射型光電開關、近接感測器(p r 〇 X i m i t y sensor)電磁開關(magnet switch)等。使用上述透射型 光電開關的情形為透過配設透射型光電開關,俾例如在螺 检27的位置配設遮蔽透射型光電開關的透射光用的擋塊 (遮光板)’在藉由頂出銷41支撐玻璃基板κ而下降時,上 述擋塊遮蔽透射型光電開關的透射光,如此可檢測玻璃基 φ 板K的支撐。 而且’緩衝機構4 4可調節緩衝作用的強弱,據此,針 對重量不同的玻璃基板K也能給予適當的緩衝作用。具體 ' 上,藉由旋鬆第二螺帽2 2 ’旋緊、旋鬆彈簧收容筒2 4與 . 連結桿2 3,改變間隙L的長度’調節螺旋彈簧2 5的推迫 的強度。 而且,配設於吸附平台3的定心單元5如圖2所示具 備夾入構件51及驅動裝置52。失入構件51是在吸附平台 ❹ 3中的Y方向兩側成左右一對而被配設。在各夾入構件51 女裝有用以緊壓玻璃基板K的γ方向兩側端面之概塾 • (pad)53。襯墊53預先被調整高度,俾與吸附平台3的承 載面31之Z方向的間隙成〇. 1mm〜0. 3mm。驅動裝置52例 如以互相同步且在±Y方向動作的氣缸(air cylinder)構 成’各自的致動器部(actuator part)連結於各夾入構件 51 ° 塗佈單元6如圖1所示具備:隔著比吸附平台3的寬度 13 201015147 寬一些的間隔對向立設之兩根可動支柱部66;架設於該等 兩根可動支柱部6 6間之開縫喷嘴6 0,為跨過吸附平台3而 配設之門型形狀體。兩根可動支柱部 66可藉由線性馬達 (1 inear mo tor) 67X驅動於X方向。線性馬達67X是沿著X 方向互相平行配設於基台2。開缝喷嘴6 0可藉由線性馬達 67Z驅動於Z方向。線性馬達67Z是沿著Z方向各自配設於 兩根可動支柱部66。 〇Interior space. 2gg^:|JU^AA· Ct A, the spring receiving cylinder 24 has a female thread 24b which can be screwed with the male screw of the connecting rod 23, and is tired by the male screw 23a and the female thread 24b. And the connecting rod 23 - body. The locking screw if 22 is screwed to the male screw 23a of the connector 23 in a state where the upper portion of the spring housing tube 24 is in contact with the spring housing tube 24. The spring receiving cylinder 24 is restricted from moving in the up and down direction by the lock nut 22. The spring U is attached to the small diameter portion 232 of the connecting rod 23 and the root side of the large diameter portion 231 in a state of being housed in the spring housing tube 24. The specific coil spring 25 is disposed in a state in which the upper end portion abuts against the large diameter portion 231 and the lower end portion abuts against the upper washer 28 and is contracted from the natural length. Therefore, because of the large diameter? The upper portion 231 is urged upward and the upper washer 28 is urged to form a gap L between the spring housing tube 24 and the upper washer 28. Accordingly, the tip end portion of the 1st pin 41 abuts against the glass substrate κ, and the coil spring 25 contracts when it is lowered, and a buffering action can be exerted. In other words, when the tip end portion of the ejector pin 41 abuts against the glass substrate κ, the tie rod 23 is lowered by the state of Fig. 9(A), and the coil spring 25 is contracted. At this time, the cylindrical collar 26, the lower washer 29, and the bolt 27 are lowered together with the connecting rod 23. That is, since the lower washer 29 is integrally attached to the small diameter portion 23 2 by the bolt 27, the cylindrical collar 26 and the lower washer 29 are lowered as the small diameter portion 23 2 is lowered. Therefore, the cylindrical collar 26 is separated from the upper collar 28' and the lower washer 29 is separated from the pin frame 42 (Fig. 9(B)). Further, a sensor 45 for detecting the support of the glass substrate Κ is disposed at a position below the ejector pin 41. As shown in FIG. 4, the sensor 45 is constituted by a microswitch having a switch portion 451 that outputs a turn-on signal SG1 by being pressed and turned on, and is transmitted through a bracket 452. The lower part. The mounting position is located below the bolt 27, and has a distance that is shorter than the distance of the bolt 27 from the gap L described above. That is, after the tip end portion of the ejector pin 41 abuts against the glass substrate κ, the rod 2 3 is further lowered and lowered along with the state of FIG. 9(B), and the cylindrical collar 26, the lower full ring 29, and the bolt 27 are attached. - Descent, as shown in Fig. 9(C)', the switch-on portion 4 51 is pressed by the bolt 27 to output the switch-on signal S G1. The ON signal S G1 is taken in a control device 1 后 which will be described later. Further, such a sensor 45 may be provided for each of the ejector pins 41. Alternatively, only a specific portion may be ejected. The pin 41 may be disposed to detect the support of the glass substrate κ. Further, at this time, the auger 25 is more contracted from the state of Fig. 9(B), and the gap L between the spring housing tube 24 and the upper washer 28 disappears. Accordingly, the spring housing tube 24 abuts against the upper gasket 28. As a result, the load of the glass substrate κ is supported by the pin frame 42. 201015147 In addition, the means for detecting the support of the glass substrate κ can be used, for example, by means of the sensor 45 of the type which is tightly connected as described above, for example, a transmissive photoelectric switch, a close-coupled photoelectric switch, a proximity sensor can also be used. (pr 〇X imity sensor) electromagnetic switch (magnet switch) and so on. In the case of using the above-described transmissive photoelectric switch, a transmissive photoelectric switch is disposed, and a stopper (light shield) for shielding transmitted light of the transmissive photoelectric switch is disposed at a position of the screw check 27, for example, by ejector pins. When the support glass substrate κ is lowered by 41, the stopper blocks the transmitted light of the transmissive photoelectric switch, so that the support of the glass base φ plate K can be detected. Further, the buffer mechanism 44 can adjust the strength of the buffering action, whereby the glass substrate K having a different weight can be appropriately buffered. Specifically, the strength of the pushing of the coil spring 25 is adjusted by loosening the second nut 2 2 ' to tighten and loosen the spring receiving cylinder 2 4 and the connecting rod 2 3 and changing the length of the gap L'. Further, the centering unit 5 disposed on the adsorption stage 3 has a sandwiching member 51 and a driving device 52 as shown in Fig. 2 . The loss-in member 51 is disposed in a pair on the left and right sides of the adsorption stage ❹ 3 in the Y direction. In each of the sandwiching members 51, it is useful to press the outline of both end faces of the glass substrate K in the γ direction. 5毫米。 The pad 53 is adjusted in advance, the gap between the 俾 and the carrier surface 31 of the suction platform 3 in the Z direction is 〇. 1mm~0. 3mm. The driving device 52 is configured, for example, in an air cylinder that is synchronized with each other and operates in the ±Y direction. The respective actuator parts are connected to the respective sandwiching members 51. The coating unit 6 is provided as shown in FIG. Two movable pillar portions 66 that are opposed to each other across a width wider than the width 13 201015147 of the adsorption platform 3; the slit nozzles 60 that are spanned between the two movable pillar portions 66 are crossed across the adsorption platform 3 is equipped with a door shape body. The two movable pillar portions 66 can be driven in the X direction by a linear motor (1 inear mo tor) 67X. The linear motor 67X is disposed in parallel with each other on the base 2 in the X direction. The slit nozzle 60 can be driven in the Z direction by a linear motor 67Z. The linear motor 67Z is disposed in each of the two movable pillar portions 66 along the Z direction. 〇
開缝喷嘴60是以Y方向為長度方向而配設的略柱狀 體,如圖5所示由行進方向側的第一唇61與其相反側的第 二唇62組合而成。在對向於玻璃基板κ的底面形成有滲出 光阻液2 0用的開縫狀的止出口 6 3。在開縫噴嘴6 0的内部 形成有:連通於開縫狀的吐出口 63的内部流道之歧管 (mam f old)64,及間隙通常被設定為數十μ m的連通路65。 經由連通路6 5擠出的光阻液2 〇 —邊潤濕塗料接觸面之唇尖 如面60a、60b’ 一邊被塗佈於玻璃基板κ。 開縫噴嘴60是藉由利用線性馬達67z進行的升降動 作,可選擇地配置於塗佈高度H2與退避高度Hl。塗佈高度 為保持於承載面31上的玻璃基板κ的表面與開縫嘴嘴 ^吐出口 63之間隙成為1〇〇//計2〇〇”左右的高度。退避 高度H1為保持於承载面31的玻璃基板κ的表面與開 6〇的吐出口 63充分分離的高度。 、塗佈液供給部7如圖1所示具備:塗佈液儲存槽71、 塗佈液輸送泵72及止回閥(check valve) 73、74。 塗佈液儲存槽71 I用以一時地儲存成為塗佈液之規 201015147 定量(例如可塗佈於複數片玻璃基板K的量)的光阻液20 之槽,經由止回閥73配管連接於塗佈液輸送泵72» 塗佈液輸送泵7 2是經由止回閥7 4配管連接於開缝喷 嘴60。在進行塗佈於使用於像液晶顯示器(iiqUidcrystal display)或電漿顯示器(pi asma display)的平面面板顯示 器(flat panel display)的製造之玻璃基板,或與半導體 的製造有關的晶圓等的平坦且單片(single wafer)形態的 基板之裝置中被要求:使塗佈方向的膜厚分佈均勻且可形 _成不含氣泡或雜質的塗佈膜。因此,塗佈液輸送泵72最好 是脈動微小’並且供給開始時的起動時間短,而且耐溶劑 性(solvent resistance)佳,並且不產生在泵内的液體的 • 凝聚(coagulati〇n)或起泡,富有氣密性及耐久性者❶例如 注射(活塞(Piston))系(syringe pump)或伸縮泵(bellows pump)等較佳。特別是因注射泵是藉由活塞直接地送出内液 的方式’故響應性及定流量特性佳。另一方面,因伸縮泵 是間接地送出内液的方式,故可防止空氣的混入等。 ❹ 洗淨單元8如圖6所示,具備:刮刀(scraper)81、刮 刀驅動裝置82及廢液承受部83等。刮刀81是以合成橡膠 ’等的彈性體為材質’為具備與開縫喷嘴6 0中的開縫狀的吐 出口 63側的外形略相似的v字形溝之塊體。在其内部具備 洗淨液喷射喷嘴81a及乾燥用空氣喷射喷嘴81b。省略圖 不’洗淨液喷射嘴嘴8 1 a是經由控制閥配管連接於填充洗淨 液之洗淨液儲存槽。乾燥用空氣喷射喷嘴81b是經由控制閥 配管連接於填充乾燥用的壓縮空氣之乾燥用空氣儲存槽。被 201015147 製作成刮刀驅動裝置82可使刮刀81移動於±γ方向之構 成’例如以驅動側滑輪(pu 11 ey )、從動側滑輪、架於該等 兩個滑輪之無端環帶(endless belt)以及用以旋轉驅動驅 動側滑輪之旋轉式伺服馬達等構成。廢液承受部8 3是以γ 方向為長度方向,以具備比開縫喷嘴6 0大一肚的亚二 —〜十面視面 積(由Z方向看的面積)的金屬性的長條有壁盤構成。此 外’也可以並設與洗淨動作一併使開縫狀的吐出D ^ 叫u D ό的调 濕狀態等返回到一定狀態用的初始化裝置。 φ 控制裝置10是由如下構件構成:觸控面板(touch panel)等的輸入/輸出裝置;以記憶體裝置和微處理器等為 主體之適當的硬體(hardware);用以使該硬體氣七 功1乍之内裝 • 電腦程式之硬碟(hard disk)裝置;以及與開縫嗔 、方变佈機 .1中的各驅動裝置等的構成部及基板運送機械丰辟n 〜τ蛘進行 資料通信(data communications)之適當的人 w w面電路 (interface circuit)等,輸出適當的控制信號 现至各構成 部’俾開縫喷嘴塗佈機1進行一連串的塗佈動 〜吓句構成。 ❹控制裝置10具體上如下驅動控制框架驅動部4;3。 亦即’若玻璃基板Κ藉由基板運送機械手臂9搬進搬 .進位置Ρ2(參照圖8(B)),則控制裝置10驅動控制框架驅 _ 動部43,使玻璃基板κ上升至基板待機位置Ρ3,在該位置 使其停止。具體上,控制裝置10中的上述記憶體裝置預先 記憶關於比玻璃基板Κ的搬進位置Ρ2 (參照圖8 (Β))高的位 置之基板待機位置Ρ3(參照圖8(C))的高度資料(data)。若 玻璃基板κ被保持於基板待機位置P3(參照圖8(c)),則控 16 201015147 制裝置ίο輸出該保持完 板運送機械手臂9。而且乂信號之基板保持完了信號至基 手臂9接收機械手93退&控制裝置10由基板運送機械 則驅動控制框架驅動部;Γ信號之機械手退避完了信號, 你署山 ’俾保持玻璃基板K於基板待機 位置P3的頂出銷41下 低付機 板K被承載於吸附平▲ 3。此時的驅動控制進行至玻璃基 K被支撐的時間點,由感纟玻璃基板 該接通信號SG1未被輪屮吐^ 田 ❿ 時’控制裝置1 0判斷為利用頂屮 銷41進行的玻璃基^ ㈣A W用頂出 的支撐有某些問題,輸出錯誤传號 (error signal)。 口 藏 基板運送機械手臂9如圖i所示具備:馬達9ι、臂Μ •及機械手93°機械手93被製作成可支撑玻璃基板K的又子 .形狀體,藉由馬達91的驅動透過臂92在χγΖ0各方向移動 自如地構成,可藉由水平移動選擇性地配置於下述的退避位 置Ρ1與搬進位置Ρ2。亦即,退避位置P1為吸附平台3的 外方,在由Z方向看時於吸附平台3與機械手93無共有區 ❿域的位置。而且,搬進位置P2為吸附平台3的正上方,此 時的機械手93的高度與退避位置P1的高度一致。此外,機 * 械手93的控制是藉由與控制裝置1〇不同的基板運送機械手 - 臂9自身所具有的控制裝置進行。 其次’參照圖7、8、9針對與本發明有關的開縫喷嘴塗 佈機1的塗佈動作來說明。圖7是與本發明有關的開縫喷 嘴塗佈機1的塗佈動作之流程圖,圖8是時系列地顯示與 本發明有關的開缝噴嘴塗佈機1的塗佈動作之圖,在圖8 17 201015147 中’反白的箭頭是表示機械手93的動作方向,黑色的粗箭 頭是表示頂出銷41的動作方向。 如圖7所示,開縫喷嘴塗佈機丨的塗佈動作是透過玻 璃基板接受步驟S1、定心步驟S2、塗佈步驟S3、刮削 (scrape)步驟S4、玻璃基板傳遞步驟S5而進行。在圖8 中是假設開縫喷嘴塗佈機1處於以下的初始狀態來說明。 亦即,為頂出銷41埋沒於承載面31的下方之狀態,在機 械手93支揮玻璃基板κ的狀態下位於退避位置ρι(參照圖 _ 8(A))。而且,開縫喷嘴60位於退避高度H1及待機位置The slit nozzle 60 is a slightly columnar body that is disposed in the longitudinal direction in the Y direction, and is composed of a combination of the first lip 61 on the traveling direction side and the second lip 62 on the opposite side as shown in Fig. 5 . A slit-like stopper 6 3 for oozing the photoresist 20 is formed on the bottom surface of the glass substrate κ. Inside the slit nozzle 60, a manifold 64 that communicates with the internal flow path of the slit-shaped discharge port 63, and a communication path 65 in which the gap is normally set to several tens of μm are formed. The photoresist 2 extruded through the communication path 65 is applied to the glass substrate κ while the lip of the contact surface of the coating is wetted as the surfaces 60a and 60b'. The slit nozzle 60 is selectively disposed at the coating height H2 and the evacuation height H1 by the lifting operation by the linear motor 67z. The coating height is such that the gap between the surface of the glass substrate κ held on the bearing surface 31 and the slit nozzle/exit port 63 is about 1 〇〇//2 〇〇". The retracting height H1 is maintained on the bearing surface. The coating liquid supply unit 7 is provided with a coating liquid storage tank 71, a coating liquid transfer pump 72, and a non-return, as shown in Fig. 1 at a height at which the surface of the glass substrate κ of 31 is sufficiently separated from the discharge port 63. A check valve 73, 74. The coating liquid storage tank 71I is used for temporarily storing a groove of the photoresist liquid 20 which is a coating liquid of 201015147 (for example, an amount that can be applied to a plurality of glass substrates K). The liquid is connected to the coating liquid transfer pump 72 via the check valve 73. The coating liquid transfer pump 7 2 is connected to the slit nozzle 60 via a check valve 74. The coating is applied to a liquid crystal display (iiqUidcrystal). Device for producing a flat panel display of a pi asma display or a flat and single wafer form of a wafer related to semiconductor manufacturing Required in: film thickness in the coating direction It is uniformly distributed and can be shaped into a coating film containing no bubbles or impurities. Therefore, the coating liquid transfer pump 72 preferably has a small pulsation and has a short starting time at the start of supply and a good solvent resistance. And it does not produce coagulation or foaming of the liquid in the pump, and is rich in airtightness and durability, such as injection (Piston) pump or bellows pump, etc. In particular, since the syringe pump directly feeds the inner liquid by the piston, the responsiveness and the constant flow rate are excellent. On the other hand, since the telescopic pump indirectly sends the inner liquid, the air can be prevented. As shown in Fig. 6, the cleaning unit 8 includes a scraper 81, a blade drive device 82, a waste liquid receiving portion 83, etc. The scraper 81 is made of an elastomer such as synthetic rubber. A block of a v-shaped groove slightly similar to the outer shape of the slit-shaped discharge port 63 side of the slit nozzle 60. The cleaning liquid spray nozzle 81a and the drying air spray nozzle 81b are provided inside. Cleaning liquid spray nozzle 8 1 a is connected to the cleaning liquid storage tank filled with the cleaning liquid via a control valve pipe. The drying air injection nozzle 81b is a drying air storage tank that is connected to the compressed air for filling and drying via a control valve pipe. The blade driving device 82 can move the blade 81 in the ±γ direction, for example, a driving side pulley (pu 11 ey ), a driven side pulley, an endless belt attached to the two pulleys, and The rotary servo motor or the like that rotationally drives the drive side pulley is configured. The waste liquid receiving portion 83 is a metallic strip having a y-direction in the longitudinal direction and having a sub-two to ten-view area (area viewed in the Z direction) which is larger than the slit nozzle 60. Disk composition. In addition, it is also possible to provide an initializing device for returning to a constant state, such as a defrosting state in which the slitting discharge D ^ is called u D ό, in addition to the washing operation. The φ control device 10 is composed of an input/output device such as a touch panel, and an appropriate hardware mainly composed of a memory device and a microprocessor, etc., for making the hardware The interior of the Qiqiu 1乍• The hard disk device of the computer program; and the components of the drive unit such as the slotted boring machine and the square cloth changer 1. The substrate transport mechanism is abundant n ~ τ蛘Properly use the appropriate person ww interface circuit for data communication, etc., and output appropriate control signals to each component's squeezing nozzle coater 1 for a series of coating movements~ . The cymbal control device 10 specifically drives the control frame drive unit 4; 3 as follows. In other words, if the glass substrate 搬 is moved into the loading position Ρ 2 by the substrate transport robot 9 (see FIG. 8(B)), the control device 10 drives the control frame drive unit 43 to raise the glass substrate κ to the substrate. Standby position Ρ3, at which it stops. Specifically, the memory device in the control device 10 stores in advance the height of the substrate standby position Ρ3 (see FIG. 8(C)) at a position higher than the loading position Ρ2 (see FIG. 8 (Β)) of the glass substrate Κ. Data. When the glass substrate κ is held at the substrate standby position P3 (see Fig. 8(c)), the device 16 201015147 outputs the holding plate transport robot 9 . Moreover, the substrate of the 乂 signal is kept intact until the base arm 9 receives the robot 93. The control device 10 drives the control frame drive unit by the substrate transport mechanism; the Γ signal of the robot retreats the signal, and you carry the glass substrate K is placed on the suction flat plate ▲ under the ejector pin 41 of the substrate standby position P3. At this time, the drive control is performed until the glass base K is supported, and when the ON signal SG1 of the sensation glass substrate is not rimped, the control device 10 determines that the glass is made by the top pin 41. Base ^ (4) A W has some problems with the support of the ejector, and outputs an error signal. The port substrate transport robot 9 is provided with a motor 9 ι, an arm Μ, and a manipulator 93°. The manipulator 93 is formed to support the glass substrate K, and is driven by the motor 91. The arm 92 is configured to be movable in all directions of χγΖ0, and can be selectively disposed in the following retracted position Ρ1 and the carry-in position Ρ2 by horizontal movement. That is, the retreat position P1 is outside the adsorption platform 3, and when the Z direction is viewed, the adsorption platform 3 and the robot 93 have no common area. Further, the loading position P2 is directly above the suction platform 3, and the height of the robot 93 at this time coincides with the height of the retracted position P1. Further, the control of the robot 93 is performed by a control device provided by the substrate transport robot-arm 9 itself, which is different from the control device 1A. Next, the application operation of the slit nozzle coater 1 according to the present invention will be described with reference to Figs. 7, 8, and 9. Fig. 7 is a flow chart showing a coating operation of the slit nozzle coater 1 according to the present invention, and Fig. 8 is a view showing a coating operation of the slit nozzle coater 1 according to the present invention in a series. In Fig. 8 17 201015147, the 'anti-white arrow' indicates the operation direction of the robot 93, and the black thick arrow indicates the action direction of the ejector pin 41. As shown in Fig. 7, the application operation of the slit nozzle coater is performed through the glass substrate receiving step S1, the centering step S2, the coating step S3, the scraping step S4, and the glass substrate transfer step S5. In FIG. 8, it is assumed that the slit nozzle coater 1 is in the following initial state. In other words, in a state where the ejector pin 41 is buried below the load-bearing surface 31, the robot hand 93 swings the glass substrate κ in the retracted position ρ (see Fig. 8(A)). Moreover, the slit nozzle 60 is located at the retreat height H1 and the standby position.
Ql(參照圖5)。 [玻璃基板接受步驟S1] ' 玻璃基板接受動作是如下進行。首先,基板運送機械手 •臂9驅動支撐玻璃基板κ的機械手93於水平方向,由退避 位置P1移動至搬進位置P2(參照圖8(B))。在使玻璃基板κ 由退避位置P1移動至搬進位置P2時,機械手93僅進行水 平移動。 〇 接著’藉由控制裝置10透過驅動控制框架驅動部43 使銷框架42上升驅動’使埋沒於承載面31的下方的頂出 •銷41上升。據此,頂出銷41的尖端部由承載面31突出, -抵接位於搬進位置P2的玻璃基板κ的背面。然後,藉由更 使頂出銷41上升,緩衝機構44中的螺旋彈簧25收縮,如 圖9(B)所示朝上推迫頂出銷41。亦即,緩衝機構44在頂 出銷41的尖端部抵接玻璃基板κ時發揮缓衝作用。 頂出銷41支撐玻璃基板κ時如圖9(C)所示,開關部 201015147 4 51接通。然後,各開關部4 5 1的接通信號s G1被發出。 然後,頂出銷41 一邊以其尖端部支撐玻璃基板K,一邊上 升,玻璃基板K被保持於基板待機位置P3(參照圖8(C))。 ' 如此,玻璃基板K的支撐被由機械手93移至頂出銷41。 玻璃基板K 一被保持於基板待機位置P3,控制裝置10 就輸出基板保持完了信號至基板運送機械手臂9。藉由該基 板保持完了信號,基板運送機械手臂9驅動玻璃基板κ已脫 離的機械手93於水平方向,使其移動至退避位置ρι(參照 ❹圖8(D))。基板運送機械手臂9 一退避至退避位置ρι,基板 運送機械手臂9就輸出機械手退避完了信號至控制裝置ι〇。 接著’藉由控制裝置1〇透過根據上述機械手退避完了 -信號驅動控制框架驅動部43,下降驅動銷框架42以使頂出 銷41下降。頂出銷41 一邊支撐玻璃基板κ,—邊下降,在 το全埋沒於承載面31之下之處停止。據此,玻璃基板κ被 承載於承載面3 1 (參照圖8 ( E))。 、如此,依照玻璃基板接受步驟S1,在藉由機械手⑽ 參將被搬進搬進位置P2的玻璃基板κ承載於承 在以下的點與以往不同。亦即,不是使支樓破璃基板1κ:機 •械手93下降,而是藉由使頂出銷41上升,以其尖端部支撐 •玻璃基板K,在使其保持於比搬進位置p2高 待機位置P3^ H J位置之基板 行水平移動即可Λ1141下降Λ此’機械手93僅進 短化,可提=少即可’該部分可謀求作業時間的縮 。生產效率。而且’耗令基板運送機械手臂9 201015147 與開縫喷嘴塗佈機1的批制 的控制裝置不同,但因基板運送機械 手臂9的動作步驟少的邱八 .们4分,關於在兩控制裝置間的機械手 93與頂出銷41之間的掳砝|ρ Λ α坡璃基板Κ的遞送之控制資料的發送 /接收/就可卩故由此點也可謀求作業時間的縮短化。而 且,因緩衝機構44在頂出鎖41抵接玻璃基板κ時發揮緩衝 作用纟玻璃基板Κ由頂出銷41的尖端部接受的碰撞被緩 和、吸收。因此,可抑制玻璃基板Κ產生缺陷或裂痕。 [定心步驟S2] 〇 定心動作是如下進行。定心單元5藉由以驅動裝置 5 2 (參照圖2 )驅動夾入構件5卜由γ方向兩側夾住被承載於 承載面31上的玻璃基板κ。據此,變成玻璃基板κ各自距 吸附平台3的Υ方向兩蠕等間隔的位置,使玻璃基板〖的 • X方向中心線與承載面31的χ方向中心線(通過γ方向寬的 中心,平行於X方向的中心線)_致之所謂的定心被進行。 然後’驅動装置52使夾入構件51返回到原來的位置。 [塗佈步驟S3] β 塗佈動作是如下進行。定心結束後’首先,使真空壓 產生於吸附平台3的真空吸附孔32,真空吸附保持玻璃基 ’板Κ於承載面31上。接著,藉由驅動線性馬達67Χ,使開 *縫噴嘴60由待機位置Q1移動炱塗佈開始位置Q2(參照圖 5>)。接著,藉由驅動線性馬達67Z,使開縫噴嘴6〇由退避 高度H1移動至塗佈高度H2。 接著,塗佈液輸送泵72將光阻液20送至開縫噴嘴6〇, 由開縫狀的吐出ϋ 63渗出光阻浪20。此時,在開縫狀的吐 20 201015147 出口 63與玻璃基板1(的表面之間形成有與該等雙方接觸的 薄膜20B(參照圖5)。藉由在該狀態下驅動線性馬達67义, 使開縫喷嘴60移動於+χ方向(參照圖8(F))。伴隨開缝喷嘴 60的移動在玻璃基板K的表面朝+χ方向光阻液2〇被塗 佈。藉由開縫噴嘴60 一到達塗佈結束位置Q3,塗佈液輸送 泵72就停止光阻液2〇的供給,線性馬達停止可動支 柱部61的驅動以停止開縫噴嘴60的移動。接著,驅動線 陡馬達67Ζ ’使開縫喷嘴6〇上升至退避高度们。接著,反 e e 轉驅動線性馬達於- . 、λ方向’在開縫喷嘴6 0中的開缝狀 的吐出口 63來到洗淨單元8的上方處停止。 [刮削步驟S 4 ] 刮削動作是如下進行。 百先’驅動線性馬達 6 7 Ζ,使 開縫喷嘴60中的開縫狀的吐 (參照圖6)接近配置。接著 、刮刀81的V字形溝 液。與洗淨液的切液喷射喷嘴…喷射洗淨 於+v古a ^ , 巧刀驅動裝置82驅動刮刀81 於+Y方向。據此,開縫狀的 $.1 ^ ^ 吐出口 63被洗淨。刮刀81 — 到達+Υ方向的端部,刮刀 私 ^ m π* I置82就停止刮刀81的驅 動。與此同時,洗淨液的噴 置82反轉驅動到刀81於〜也停止。然後,刮刀驅動裝 喷嘴81b喷射乾燥用空氣,向。此時,乾燥用空氣噴射 烘乾。刮刀81—到達_γ方破洗淨的開縫狀的吐出口 63 77 81 η的端部,刮刀驅動裝置82就 1τ止刮刀81的驅動。與此 [玻璃基板傳遞步驟S5]乾燥用空氣的喷射也停止。 玻璃基板傳遞動作是如 進行。首先,破壞在吸附平 201015147 台3的真空吸附孔32產生的真空壓。接著,藉由控制裝置 _ 10透過驅動控制枢架驅動部43使銷框架42上升驅動,由 .吸附平台3使頂出銷41突出,使其抵接玻璃基板κ。然後, 在支撲玻璃基板K的狀態下使其上升至基板待機位置P3。 此時也與玻璃基板Κ的接受時-樣,在頂出銷41抵接玻璃 基板Κ時發揮緩衝作用。據此,可抑制玻璃基板κ產生缺 陷或裂痕接板運送機械手冑9驅動位於退避位置 Ρ1的機械手93於水平方向’使其移動至搬進位f ρ2。接 ❹著藉由控制裝置1〇驅動控制框架驅動部43,使支撐玻 璃基板κ的頂出銷41下降。藉由玻璃基板κ的下降,機械 手93接受塗佈完了的玻璃基板κ。接著,基板運送機械手 -臂9驅動在搬進位置Ρ2接受了玻璃基板1(的機械手93於 •水平方向,傳遞至下一個製程之例如減壓乾燦製程。 此外,在上述的實施形態中,開縫喷嘴塗佈機丨的初 始狀態雖然是顯示頂出銷41埋沒於承載面31的下方的情 形’惟使頂出銷41預先突出到預定高度,以該預定高度當 〇作頂出鎖41的上升開始位置也可以。亦即,以被搬進搬進 位置Ρ2的玻璃基板Κ與頂出銷41不干涉的高度,例如頂 , 出銷41的尖端部比被搬進搬進位置Ρ2的玻璃基板κ還低 - 的位置當作預定高度,以該預定高度當作頂出銷41的上升 開始位置。據此’在玻璃基板接受步驟S 1中因使玻璃基板 Κ上升至基板待機位置Ρ3所需的頂出銷41的上升距離變 短,故可縮短使玻璃基板Κ上升至基板待機位置Ρ3所需的 時間》 22 201015147 以上雖然疋針對本發明的實施形態進行說明,惟以上所 揭示的實施形滤只不過是舉例說明’本發明的範圍不是被限 定於該實施的形態。本發明的範圍是透過申請專利範圍的記 載而顯示,更企圖包含與申請專利範圍均等的意義及在範圍 内的所有的變更。亦即’開縫喷嘴塗佈機1的全體或一部 分的構造、形狀、尺寸、材質、個數等可依照本發明的旨 趣進打種種的變更。而且,在本實施形態中雖然基板處理 裝置是以開縫喷嘴塗佈機,惟也能適用於開縫喷嘴塗佈機 β以外,例如曝光裝置、洗淨裝置、乾燥裝置及檢查裝置等。 【圖式簡單說明】 . 圖1是與本發明有關的開縫喷嘴塗佈機之外觀斜視圖。 . 圖2是吸附平台及定心單元之外觀斜視圖。 圖3是頂出銷單元之構成概略圖。 圖4是顯示緩衝機構的詳細之正面剖面圖。 圖5是開縫喷嘴之側面一部分剖面圖。 Φ 圖6是洗淨單元之外觀斜視圖。 圖7是與本發明有關的開縫噴嘴塗佈機的塗佈 流程圖。 乍之 圖8是時系列地顯示與本發明有 的塗佈動作之圖。 贺嘴塗佈機 圖9是顯示緩衝機構的作用之囷。 圖丨〇是時系列地顯示習知的開縫喷嘴塗 動作之圖。 @的塗伟 23 201015147 【主要元件符號說明】 1 :開縫喷嘴塗佈機(基板處理裝置) 2 :機台 3 :吸附平台(平台) 4 :頂出銷單元 5 :定心單元 6 :塗佈單元 7 :塗佈液供給部 8 :洗淨單元 9:基板運送機械手臂 1 0 :控制裝置(銷驅動控制部) 10A:控制裝置 2 0 :光阻液 22:鎖緊螺帽 2 3 ·.連結桿 2 3 a、4 1 a :陽螺旋 23b、23bl :陰螺紋孔 24:彈簧收容筒 24b:陰螺紋 25 :螺旋彈簧 2 6 :圓筒軸環 27:螺栓 2 8 :上部墊圈 24 201015147 2 9 :下部墊圈 31 :承載面 3 2 :真空吸附孔 3 3 :頂出銷孔(貫通孔) 41、41A·.頂出銷 41 a :陽螺旋 41 Η :銷基部 41 S ·.上端部 φ 42:銷框架 4 3 :框架驅動部(銷驅動控制部) 44:緩衝機構 44Α:安裝部 . 4 5 :感測器 60:開縫喷嘴 60a、60b:唇尖端面 61 :第一唇 ❹ 62:第二唇 6 3 :吐出口 • 64:歧管 . 65 :連通路 6 6 :可動支柱部 6 7 X、6 7 Z :驅動線性馬達 71 :塗佈液儲存槽 72:塗佈液輸送泵 25 201015147 73、74:止回閥 81 :刮刀 81a:洗淨液喷射噴嘴 81b:乾燥用空氣喷射喷嘴 8 2 :刮刀驅動裝置 83 :廢液承受部 9 3 :機械手 1 0 0 :開縫噴嘴塗佈機 H 2 31 :徑大部 2 3 2 :徑小部 4 2 1 :銷框架孔 - 431:滾珠螺桿軸 • 451 :開關部 452:托架 H1 :退避高度 H2:塗佈高度 φ K:玻璃基板(基板) L :間隙 • P1 :退避位置 . P2、P2a:搬進位置 P3 :基板待機位置(比搬進位置高的位置) 26Ql (refer to Figure 5). [Glass Substrate Receiving Step S1] 'The glass substrate receiving operation is performed as follows. First, the substrate transport robot/arm 9 drives the robot 93 that supports the glass substrate κ in the horizontal direction, and moves from the retracted position P1 to the carry-in position P2 (see Fig. 8(B)). When the glass substrate κ is moved from the retracted position P1 to the carry-in position P2, the robot 93 moves only horizontally. 〇 Next, the pin frame 42 is driven up by the drive control frame drive unit 43 by the control device 10, and the ejector pin 41 buried under the bearing surface 31 is raised. Thereby, the tip end portion of the ejector pin 41 protrudes from the bearing surface 31, and abuts against the back surface of the glass substrate κ located at the loading position P2. Then, by further raising the ejector pin 41, the coil spring 25 in the buffer mechanism 44 is contracted, and the ejector pin 41 is urged upward as shown in Fig. 9(B). In other words, the buffer mechanism 44 exerts a cushioning action when the tip end portion of the ejector pin 41 abuts against the glass substrate κ. When the ejector pin 41 supports the glass substrate κ, as shown in Fig. 9(C), the switch unit 201015147 4 51 is turned on. Then, the turn-on signal s G1 of each of the switch sections 45 1 is emitted. Then, the ejector pin 41 is supported by the tip end portion while supporting the glass substrate K, and the glass substrate K is held at the substrate standby position P3 (see Fig. 8(C)). Thus, the support of the glass substrate K is moved by the robot 93 to the ejector pin 41. Once the glass substrate K is held at the substrate standby position P3, the control device 10 holds the signal on the output substrate to the substrate transport robot 9. When the signal is held by the substrate, the substrate transport robot 9 drives the robot 93 from which the glass substrate κ has been detached in the horizontal direction to move to the retracted position ρ (refer to Fig. 8(D)). When the substrate transport robot 9 is retracted to the retracted position ρι, the substrate transport robot 9 outputs a robot retraction signal to the control device ι. Then, by the control device 1 〇, the signal drive control frame drive unit 43 is retracted by the above-described robot, and the drive pin frame 42 is lowered to lower the ejector pin 41. The ejector pin 41 supports the glass substrate κ while falling, and stops when το is completely buried below the bearing surface 31. Thereby, the glass substrate κ is carried on the bearing surface 31 (refer to Fig. 8 (E)). In this way, in accordance with the glass substrate receiving step S1, the glass substrate κ carried by the robot (10) into the loading position P2 is carried by the following points, which is different from the prior art. In other words, the ejector pin 41 is not lowered, but the ejector pin 41 is raised, and the glass substrate K is supported at the tip end portion thereof to be held at the moving position p2. The high standby position P3^HJ position of the substrate line can be moved horizontally by 1141. This 'manipulator 93 is only shortened, and can be reduced = less.' This part can reduce the working time. Productivity. In addition, the "manufactured substrate transport robot arm 9 201015147 is different from the batch control device of the slotted nozzle coater 1 , but the operation steps of the substrate transport robot 9 are small. The transmission/reception of the control data for the delivery of the 掳砝|ρ Λ α between the robot 93 and the ejector pin 41 can be shortened. Further, the buffer mechanism 44 acts as a buffer when the ejector lock 41 abuts against the glass substrate κ. The collision of the glass substrate 接受 received by the tip end portion of the ejector pin 41 is alleviated and absorbed. Therefore, it is possible to suppress defects or cracks in the glass substrate. [Centering step S2] 〇 The centering action is performed as follows. The centering unit 5 drives the sandwiching member 5 by the driving device 5 2 (refer to Fig. 2) to sandwich the glass substrate κ carried on the bearing surface 31 from both sides in the γ direction. As a result, the glass substrates κ are each positioned at equal intervals from the Υ direction of the adsorption stage 3, and the center line of the X-direction of the glass substrate and the center line of the y-direction direction of the bearing surface 31 (parallel through the center of the γ direction) The center line in the X direction) _ caused the so-called centering to be carried out. Then, the driving means 52 returns the sandwiching member 51 to the original position. [Coating Step S3] The β coating operation is performed as follows. After the centering is completed, first, vacuum pressure is generated in the vacuum suction hole 32 of the adsorption stage 3, and the glass substrate is vacuum-adsorbed to hold the glass substrate on the bearing surface 31. Then, by driving the linear motor 67A, the slit nozzle 60 is moved from the standby position Q1 to the coating start position Q2 (see Fig. 5>). Next, by driving the linear motor 67Z, the slit nozzle 6 is moved from the retraction height H1 to the coating height H2. Next, the coating liquid transfer pump 72 sends the photoresist liquid 20 to the slit nozzle 6A, and the photoresist 20 is oozing out from the slit-like discharge port 63. At this time, a film 20B (see FIG. 5) that is in contact with the glass substrate 1 is formed between the slit 63 201015147 outlet 63 and the surface of the glass substrate 1 (see FIG. 5). By driving the linear motor 67 in this state, The slit nozzle 60 is moved in the +χ direction (see Fig. 8(F)). The movement of the slit nozzle 60 is applied to the surface of the glass substrate K in the +χ direction of the photoresist 2〇. Upon reaching the coating end position Q3, the coating liquid transfer pump 72 stops the supply of the photoresist liquid 2, and the linear motor stops the driving of the movable stay portion 61 to stop the movement of the slit nozzle 60. Then, the drive line steep motor 67 turns 'The slit nozzles 6 〇 are raised to the retraction height. Then, the reverse ee rotation drive linear motor is at - . , and the λ direction ' opens the slotted discharge port 63 in the slit nozzle 60 to the cleaning unit 8 The upper part is stopped. [Scraping step S 4 ] The scraping operation is performed as follows: The first step is to drive the linear motor 6 7 Ζ to make the slit-like spout (see Fig. 6) in the slit nozzle 60 close to the arrangement. Next, the scraper 81 V-shaped groove liquid. The liquid cutting jet nozzle with the cleaning solution...sprayed and washed in +v a ^ , the knife drive device 82 drives the scraper 81 in the +Y direction. Accordingly, the slit-shaped $.1 ^ ^ discharge port 63 is washed. The scraper 81 — reaches the end in the +Υ direction, and the scraper is private. When the π*I is set to 82, the driving of the squeegee 81 is stopped. At the same time, the discharge of the cleaning liquid 82 is reversely driven until the knives 81 are stopped. Then, the squeegee driving nozzle 81b ejects the drying air. The drying is performed by air jet drying. The doctor blade 81 reaches the end portion of the slit-shaped discharge port 63 77 81 η which is broken by the γ γ, and the blade driving device 82 stops the driving of the blade 81 by 1 τ. The transfer step S5] the ejection of the drying air is also stopped. The glass substrate transfer operation is performed as follows. First, the vacuum pressure generated in the vacuum adsorption hole 32 of the adsorption flat 201015147 is destroyed. Then, the control device _ 10 transmits the drive control. The pivot driving unit 43 drives the pin frame 42 upward, and the ejector pin 41 protrudes from the suction platform 3 to abut against the glass substrate κ. Then, the glass substrate K is raised to the standby position of the substrate while the glass substrate K is being smashed. P3. At this time, also with the acceptance of the glass substrate - When the ejector pin 41 abuts against the glass substrate 缓冲, the buffering action is exerted. Accordingly, the glass substrate κ can be prevented from being defective or the cracked plate transporting robot 9 drives the robot 93 located at the retracted position Ρ1 in the horizontal direction. Moving to the carry-in position f ρ2, the control frame driving unit 43 is driven by the control device 1 to lower the ejector pin 41 supporting the glass substrate κ. By the lowering of the glass substrate κ, the robot 93 is coated. Then, the substrate transport robot-arm 9 is driven to receive the glass substrate 1 at the loading position Ρ2 (the robot 93 is horizontally transferred to the next process, for example, a vacuum drying process). Further, in the above-described embodiment, the initial state of the slit nozzle coater 显示 indicates that the ejector pin 41 is buried below the bearing surface 31. However, the ejector pin 41 is protruded to a predetermined height in advance. The predetermined height is also possible when the rising start position of the ejector lock 41 is made. In other words, the height of the glass substrate 被 that is carried into the loading position Ρ2 does not interfere with the ejector pin 41, for example, the top end of the output pin 41 is lower than the glass substrate κ that is moved into the loading position Ρ2. The position is regarded as a predetermined height, and the predetermined height is taken as the rising start position of the ejector pin 41. According to this, in the glass substrate receiving step S1, the rising distance of the ejector pin 41 required to raise the glass substrate 至 to the substrate standby position Ρ3 is shortened, so that it is possible to shorten the glass substrate Κ required to rise to the substrate standby position Ρ3. The time of the present invention is described above with reference to the embodiments of the present invention. However, the above-described embodiments of the present invention are merely illustrative of the scope of the present invention. The scope of the present invention is to be construed as being limited by the scope of the appended claims. That is, the structure, shape, size, material, number, and the like of the entire or a part of the slitting nozzle coater 1 can be variously changed in accordance with the gist of the present invention. Further, in the present embodiment, the substrate processing apparatus is a slit nozzle coater, and can be applied to other than the slit nozzle coater β, such as an exposure apparatus, a washing apparatus, a drying apparatus, and an inspection apparatus. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the appearance of a slit nozzle coater according to the present invention. Figure 2 is a perspective view showing the appearance of the adsorption platform and the centering unit. 3 is a schematic view showing the configuration of an ejector pin unit. Figure 4 is a detailed front cross-sectional view showing the buffer mechanism. Figure 5 is a partial cross-sectional view of the side surface of the slit nozzle. Φ Figure 6 is a perspective view showing the appearance of the washing unit. Fig. 7 is a flow chart showing the application of a slit nozzle coater in accordance with the present invention. Fig. 8 is a view showing a series of coating operations in accordance with the present invention. Mouth Coating Machine Fig. 9 is a view showing the action of the buffer mechanism. The figure shows a series of conventional slit nozzle coating operations. @涂伟23 201015147 [Main component symbol description] 1 : Slotted nozzle coating machine (substrate processing device) 2 : Machine table 3 : Adsorption platform (platform) 4 : Eject pin unit 5 : Centering unit 6 : Coated Cloth unit 7: coating liquid supply unit 8: cleaning unit 9: substrate transfer robot 1 0: control device (pin drive control unit) 10A: control device 2 0: photoresist liquid 22: lock nut 2 3 · Connecting rod 2 3 a, 4 1 a : male spiral 23b, 23bl: female threaded hole 24: spring receiving cylinder 24b: female thread 25: coil spring 2 6 : cylindrical collar 27: bolt 2 8 : upper washer 24 201015147 2 9 : lower washer 31 : bearing surface 3 2 : vacuum suction hole 3 3 : ejector pin hole (through hole) 41, 41A · ejector pin 41 a : male screw 41 Η : pin base 41 S · upper end φ 42: pin frame 4 3 : frame drive unit (pin drive control unit) 44: buffer mechanism 44 Α: mounting portion. 4 5 : sensor 60: slit nozzles 60a, 60b: lip tip surface 61: first lip 62: second lip 6 3 : discharge port • 64: manifold. 65 : communication path 6 6 : movable column portion 6 7 X, 6 7 Z : drive linear motor 71: coating liquid storage tank 72: coating liquid loss Pump 25 201015147 73, 74: Check valve 81: Scraper 81a: Cleaning liquid injection nozzle 81b: Drying air injection nozzle 8 2: Scraper drive unit 83: Waste liquid receiving portion 9 3 : Robot 1 0 0 : Slotting Nozzle coater H 2 31 : Large diameter portion 2 3 2 : Small diameter portion 4 2 1 : Pin frame hole - 431: Ball screw shaft • 451 : Switch unit 452: Bracket H1 : Retraction height H2: Coating height φ K: glass substrate (substrate) L : gap • P1 : retracted position. P2, P2a: loading position P3 : substrate standby position (position higher than the loading position) 26

Claims (1)

  1. 201015147 七、申請專利範圍: I —種基板處理裝置,包含:承載基板(κ)之平 可由形成於平台(3)的貫通孔(33)進行 1 , 西? %,Η ΰΓ Μ丄丨 开降動作而被 ' 藉由尖端部支撐基板〇〇之頂出銷(41); 驅動控制頂出銷(41),俾將供給至平台’ 谁位著上方的搬 )的基板(Κ)承載於平台(3)上 (43、10), 、^上之銷驅動控制部 ❹ :::為:鎖驅動控制部(43、1〇)進行驅動控制 =吏頂出鎖⑷)上升,以其尖端部支擇位於搬進位置(ρ2) ::板⑴,將其保持在比搬進位置(ρ2)高的位置(ρ3)後, 藉由使頂出銷(41)下降,以承載於平台(3)上。 如申請專利範圍第丨項之基板處理裝置,其中頂出 包含:在其尖端抵接基板(κ)時吸收在基板(κ)產生 的碰撞之緩衝機構(44)。 、一種基板承載方法,是在包含如下構件的基板處理 裝置(1)争,將供給至平台(3)的上方的搬進位置(ρ2)的基 j承載於平台(3)上··承載基板(Κ)之平台(3)丨可由形成 ;s平。(3)的貫通孔(33)進行升降動作而被配設,且可藉 由尖端部支撐基板(K)之頂出銷(41), 其特徵為:在藉由使該頂出銷(41)上升,以其尖端部支 撐位於搬進位置(P2)的基板U),將其保持在比該搬進位置 (P2)间的位置(p3)後,藉由使頂出銷(ο下降,以承載於 平台(3)上。 27201015147 VII. Patent application scope: I. A substrate processing device comprising: a flat substrate (κ) can be made by a through hole (33) formed in the platform (3). %, Η Μ丄丨 Μ丄丨 Μ丄丨 动作 被 被 被 被 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 ; ; ; ; ; ; ; The substrate (Κ) is carried on the platform (3) (43, 10), and the pin drive control unit ❹ ::: is: the lock drive control unit (43, 1 〇) performs drive control = dome output The lock (4) is raised, and the tip end portion is positioned at the loading position (ρ2)::plate (1), and is held at a position higher than the loading position (ρ2) (ρ3) by the ejector pin (41). ) descends to be carried on the platform (3). The substrate processing apparatus according to claim 2, wherein the ejector comprises: a buffer mechanism (44) that absorbs a collision generated by the substrate (κ) when the tip thereof abuts the substrate (κ). A substrate carrying method is carried out by a substrate processing apparatus (1) including the following members, and a substrate j fed to a loading position (ρ2) above the platform (3) is carried on the platform (3). (Κ) platform (3) 丨 can be formed; s flat. The through hole (33) of (3) is arranged to be lifted and lowered, and the ejector pin (41) of the substrate (K) can be supported by the tip end portion, characterized in that the ejector pin (41) is obtained by Raising, supporting the substrate U) at the loading position (P2) with its tip end portion, holding it at a position (p3) between the loading position (P2), and then lowering the ejector pin (o) To be carried on the platform (3). 27
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