JP2010074418A - 弾性波デバイス及びその製造方法 - Google Patents
弾性波デバイス及びその製造方法 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 111
- 239000002184 metal Substances 0.000 claims abstract description 88
- 229910052751 metal Inorganic materials 0.000 claims abstract description 88
- 238000007789 sealing Methods 0.000 claims abstract description 57
- 229910000679 solder Inorganic materials 0.000 claims description 22
- 239000000919 ceramic Substances 0.000 claims description 9
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 5
- 239000010980 sapphire Substances 0.000 claims description 4
- 229910052594 sapphire Inorganic materials 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 238000002955 isolation Methods 0.000 abstract description 24
- 238000003780 insertion Methods 0.000 abstract description 21
- 230000037431 insertion Effects 0.000 abstract description 21
- 230000006866 deterioration Effects 0.000 abstract description 11
- 238000004364 calculation method Methods 0.000 description 38
- 238000000034 method Methods 0.000 description 27
- 230000005540 biological transmission Effects 0.000 description 22
- 230000005684 electric field Effects 0.000 description 10
- 238000010897 surface acoustic wave method Methods 0.000 description 8
- 229910052737 gold Inorganic materials 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000012212 insulator Substances 0.000 description 5
- 229910052750 molybdenum Inorganic materials 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 2
- 229910020836 Sn-Ag Inorganic materials 0.000 description 2
- 229910020988 Sn—Ag Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/058—Holders; Supports for surface acoustic wave devices
- H03H9/059—Holders; Supports for surface acoustic wave devices consisting of mounting pads or bumps
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
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- H—ELECTRICITY
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- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1078—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a foil covering the non-active sides of the SAW device
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- H01L2224/0554—External layer
- H01L2224/05599—Material
- H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L2224/05599—Material
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- H01L2224/0554—External layer
- H01L2224/05599—Material
- H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/05638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
【解決手段】基板2と、圧電基板11を備え、基板2の上面にフリップチップ実装されたデバイスチップ10と、デバイスチップ10が備える圧電基板11の誘電率より低い誘電率を有し、デバイスチップ10の基板2と対向する面とは反対の面に設けられた第1絶縁層24と、デバイスチップ10と第1絶縁層24とを封止する封止金属部16とを具備する弾性波デバイス及びその製造方法。
【選択図】図2
Description
端子 4、6
バンプ 8
デバイスチップ 10
圧電基板 11、28
電極パターン 13
封止金属部 16
金属パターン 20
第1絶縁層 24、30
第2絶縁層 26
デュプレクサ 50
送信端子 52
受信端子 54
アンテナ端子 56
Claims (12)
- 基板と、
圧電基板を備え、前記基板の上面にフリップチップ実装されたデバイスチップと、
前記デバイスチップが備える前記圧電基板の誘電率より低い誘電率を有し、前記デバイスチップの前記基板と対向する面とは反対の面に設けられた第1絶縁層と、
前記デバイスチップを封止する封止金属部とを具備することを特徴とする弾性波デバイス。 - 前記封止金属部は前記デバイスチップの側面に接触していないことを特徴とする請求項1記載の弾性波デバイス。
- 基板と、
圧電基板を備え、前記基板の上面にフリップチップ実装されたデバイスチップと、
前記デバイスチップの側面に接触しないように、前記デバイスチップを封止する封止金属部とを具備することを特徴とする弾性波デバイス。 - 前記基板の上面であって前記基板と前記デバイスチップとが重なる領域よりも外側に設けられ、前記封止金属部と接続されている金属パターンを具備することを特徴とする請求項1から3いずれか一項記載の弾性波デバイス。
- 前記基板の上面であって前記基板と前記デバイスチップとが重なる領域と前記金属パターンとの間の少なくとも一部に設けられている第2絶縁層を具備することを特徴とする請求項4記載の弾性波デバイス。
- 前記基板の上面に設けられ、前記デバイスチップ及び前記金属パターンに接続された配線パターンを具備し、
前記第2絶縁層は前記金属パターンの少なくとも一部と重なるように設けられていることを特徴とする請求項5記載の弾性波デバイス。 - 前記第1絶縁層は、樹脂、サファイア、シリコン、セラミックス及びガラスのいずれか一つからなることを特徴とする請求項1、2、及び4から6いずれか一項記載の弾性波デバイス。
- 前記第1絶縁層はエポキシ樹脂からなることを特徴とする請求項1、2、及び4から7いずれか一項記載の弾性波デバイス。
- 前記封止金属部は半田からなることを特徴とする請求項1から8いずれか一項記載の弾性波デバイス。
- 圧電基板を備えたデバイスチップを、基板の上面にフリップチップ実装する工程と、
前記デバイスチップの前記基板と対向する面とは反対の面に、前記デバイスチップが備える前記圧電基板の誘電率より低い誘電率を有する第1絶縁層を設ける工程と、
前記基板の上面であって前記基板と前記デバイスチップとが重なる領域よりも外側に設けられた金属パターンと接続され、かつ前記デバイスチップの側面に接触しないように、前記デバイスチップを封止金属部で封止する工程とを有することを特徴とする弾性波デバイスの製造方法。 - 前記第1絶縁層を設ける工程は、前記フリップチップ実装する工程よりも前に行われることを特徴とする請求項10記載の弾性波デバイスの製造方法。
- 前記第1絶縁層を設ける工程は、前記封止する工程を含むことを特徴とする請求項10記載の弾性波デバイスの製造方法。
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JP2008238482A JP5686943B2 (ja) | 2008-09-17 | 2008-09-17 | 弾性波デバイス及びその製造方法 |
US12/560,059 US8076827B2 (en) | 2008-09-17 | 2009-09-15 | Acoustic wave device and method for fabricating the same |
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Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2013146374A1 (ja) * | 2012-03-26 | 2013-10-03 | 株式会社村田製作所 | 弾性波装置及びその製造方法 |
JP2014502563A (ja) * | 2010-12-28 | 2014-02-03 | エプコス アクチエンゲゼルシャフト | Memsデバイスのカプセル封止およびその製造方法 |
JP2014027249A (ja) * | 2012-06-18 | 2014-02-06 | Taiyo Yuden Co Ltd | 電子部品の製造方法 |
JP2015032634A (ja) * | 2013-07-31 | 2015-02-16 | 太陽誘電株式会社 | 電子デバイス |
US9070963B2 (en) | 2011-04-20 | 2015-06-30 | Taiyo Yuden Co., Ltd. | Duplexer |
JP2015126014A (ja) * | 2013-12-25 | 2015-07-06 | 太陽誘電株式会社 | 電子デバイス及びその製造方法 |
JP2015130601A (ja) * | 2014-01-07 | 2015-07-16 | 太陽誘電株式会社 | モジュール |
JP2017157922A (ja) * | 2016-02-29 | 2017-09-07 | 太陽誘電株式会社 | 電子デバイス |
JP2018093389A (ja) * | 2016-12-05 | 2018-06-14 | 太陽誘電株式会社 | 電子部品 |
JP2019129497A (ja) * | 2018-01-26 | 2019-08-01 | 京セラ株式会社 | 弾性波装置、分波器および通信装置 |
US11271542B2 (en) | 2016-09-06 | 2022-03-08 | Taiyo Yuden Co., Ltd. | Acoustic wave device and method of fabricating the same |
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Publication number | Priority date | Publication date | Assignee | Title |
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US7791255B2 (en) * | 2008-11-13 | 2010-09-07 | Eta Sa Manufacture Horlogère Suisse | Packaging for piezoelectric resonator |
US7919909B2 (en) * | 2009-04-24 | 2011-04-05 | Delaware Capital Formation, Inc. | Integrated coupling structures |
JP2012151698A (ja) * | 2011-01-19 | 2012-08-09 | Taiyo Yuden Co Ltd | 弾性波デバイス |
JP2013046167A (ja) * | 2011-08-23 | 2013-03-04 | Seiko Epson Corp | 振動デバイス、及び振動デバイスの製造方法 |
DE102011112476A1 (de) * | 2011-09-05 | 2013-03-07 | Epcos Ag | Bauelement und Verfahren zum Herstellen eines Bauelements |
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